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1. 发明授权

US06479886B1 Integrated circuit package with EMI shield 有权
标题翻译：集成电路封装，带EMI屏蔽
公开(公告)号：US06479886B1
公开(公告)日：2002-11-12
申请号：US09662056
申请日：2000-09-15
申请人： Steven L. Pollock , Robert L. Olivier
发明人： Steven L. Pollock , Robert L. Olivier
IPC分类号： H01L23552
CPC分类号： H01L23/552 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： An improved packaged IC is disclosed, which includes a semiconductor die mounted to a substrate and an EMI shield that encapsulates the semiconductor die. In addition, a ground pin is electrically coupled to the semiconductor die, a ferrite bead is electrically coupled to the EMI shield and the ground pin, and a package body encapsulates the EMI shield.
摘要翻译：公开了一种改进的封装IC，其包括安装到衬底的半导体管芯和封装半导体管芯的EMI屏蔽。此外，接地引脚电耦合到半导体管芯，铁氧体磁珠电耦合到EMI屏蔽和接地引脚，封装体封装EMI屏蔽。

2. 发明授权

US06781573B1 Ergonomic mouse 有权
标题翻译：人体工程学的老鼠
公开(公告)号：US06781573B1
公开(公告)日：2004-08-24
申请号：US09557820
申请日：2000-04-25
申请人： Ted T. Honma , Steven L. Pollock
发明人： Ted T. Honma , Steven L. Pollock
IPC分类号： G09G500
CPC分类号： G06F3/03543 , G06F2203/0333
摘要： An ergonomic mouse is designed to maximize productivity by reducing user fatigue and discomfort. The ergonomic mouse of the present invention includes a housing having a grippable portion that permits a user to grip the mouse substantially under its palm when the mouse rests on a flat surface such as a mouse pad. A concave portion in the housing receives the user's fingers. At least one button is positioned in the concave portion of the housing. The at least one button is actuated by a substantially horizontal force produced by a substantially horizontal motion of the tips of the fingers as the fingers curl in toward the palm.
摘要翻译：符合人体工程学的鼠标旨在通过减少用户疲劳和不适而最大限度地提高生产率。本发明的符合人体工程学的鼠标包括具有可抓握部分的壳体，当鼠标放置在诸如鼠标垫的平坦表面上时，该壳体允许使用者将鼠标基本上抓住其手掌。壳体中的凹部接收使用者的手指。至少一个按钮被定位在壳体的凹部中。当手指朝向手掌卷曲时，至少一个按钮由基本上水平的力由手指的尖端的基本上水平的运动产生。

3. 发明授权

US06691242B1 SYSTEM TEST AND METHOD FOR CHECKING PROCESSOR OVER-CLOCKING BY RETRIEVING AN ASSIGNED SPEED FROM AN REGISTER INTERNAL TO THE PROCESSOR, COMPARING WITH RUNNING SPEED, AND DISPLAYING CAUTION MESSAGE TO USER 失效
标题翻译：通过从处理器内部向处理器检索指定的速度，与运行速度进行比较，以及向用户显示小心信息来检查处理器过时的系统测试和方法
公开(公告)号：US06691242B1
公开(公告)日：2004-02-10
申请号：US09585860
申请日：2000-06-01
申请人： Steven L. Pollock , Ted T. Honma
发明人： Steven L. Pollock , Ted T. Honma
IPC分类号： G06F1127
CPC分类号： G06F11/2284
摘要： The present invention is designed to test whether a Central Processing Unit (CPU) in a computer system is being overclocked. That is, being run at a speed higher than its rated or assigned speed. An important feature of the present invention is that it is internal to the computer system on which it operates. That is, the test of the present invention is implemented in the computer system's Basic Input/Output System or as microcode stored directly on the CPU. The end user need not resort to any external means such as a floppy or CD disk to test the CPU included in his/her computer system. If the CPU is not overclocked, the test runs invisible to the end user. If, on the other hand, the CPU is overclocked, the test allows the user to either continue with the normal boot up process or exit the boot up process to adjust the running speed to substantially match the assigned speed of the CPU.
摘要翻译：本发明旨在测试计算机系统中的中央处理单元（CPU）是否超频。也就是说，以高于其额定值或分配速度的速度运行。本发明的一个重要特征是它在其运行的计算机系统的内部。也就是说，本发明的测试在计算机系统的基本输入/输出系统中实现，或者直接存储在CPU上。最终用户不需要使用任何外部手段，例如软盘或CD盘来测试他/她的计算机系统中包含的CPU。如果CPU没有超频，则测试对最终用户不可见。另一方面，如果CPU超频，则测试允许用户继续正常启动过程或退出引导过程，以调整运行速度以与CPU的分配速度基本匹配。

4. 发明授权

US06720956B1 Apparatus and method for obtaining geographical information using a touch-sensitive globe device 有权
标题翻译：使用触摸感应球体装置获取地理信息的装置和方法
公开(公告)号：US06720956B1
公开(公告)日：2004-04-13
申请号：US09608646
申请日：2000-06-30
申请人： Ted T. Honma , Steven L. Pollock
发明人： Ted T. Honma , Steven L. Pollock
IPC分类号： G09G500
CPC分类号： G06F3/011 , G06F3/0488
摘要： An apparatus is provided that includes a touch-sensitive three-dimensional globe and an information handling system coupled to the touch-sensitive three-dimensional globe and adapted to receive the signals corresponding to the touched area of the globe. The information handling system may include a display device to display information regarding the area. A data accessing system may be coupled to the information handling system and be adapted to receive signals from the information handling system and transmit information from a data storage unit to the information handling system.
摘要翻译：提供了一种装置，其包括触敏三维球体和耦合到触敏三维球体的信息处理系统，并适于接收与球体的触摸区域对应的信号。信息处理系统可以包括显示关于区域的信息的显示装置。数据访问系统可以耦合到信息处理系统，并且适于从信息处理系统接收信号，并将信息从数据存储单元传送到信息处理系统。

5. 发明授权

US06392887B1 PLGA-BGA socket using elastomer connectors 失效
标题翻译： PLGA-BGA插座使用弹性体连接器
公开(公告)号：US06392887B1
公开(公告)日：2002-05-21
申请号：US09461680
申请日：1999-12-14
申请人： Jeffrey W. Day , Steven L. Pollock
发明人： Jeffrey W. Day , Steven L. Pollock
IPC分类号： H05K720
CPC分类号： H01R4/024 , H01L23/32 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： An electronic assembly that may include an elastomeric connector. The elastomeric connector may couple the solder ball of a BGA integrated circuit package to a substrate. The elastomeric connector provides an interconnect that may compensate for variations in the solder balls and a lack of flatness in the package and/or substrate.
摘要翻译：可以包括弹性连接器的电子组件。弹性体连接器可以将BGA集成电路封装的焊球耦合到衬底。弹性体连接器提供可以补偿焊球的变化和在封装和/或衬底中缺乏平坦度的互连。

6. 发明授权

US6056601A Processor card connector 失效
标题翻译：处理器卡连接器
公开(公告)号：US6056601A
公开(公告)日：2000-05-02
申请号：US997688
申请日：1997-12-23
申请人： Steven L. Pollock , Robert Olivier
发明人： Steven L. Pollock , Robert Olivier
IPC分类号： H05K7/10 , H01R23/70
CPC分类号： H05K7/1007 , H01R12/716
摘要： A connector for mounting a processor card on a motherboard includes a base and an upper support chassis. The base is electrically and structurally coupled to a motherboard and the upper support chassis is mounted on the base. A processor card is received within the upper support chassis for mounting of the card to the motherboard. When the card is received within the upper support chassis, the processor card is positioned substantially parallel to the motherboard.
摘要翻译：用于将处理器卡安装在母板上的连接器包括基座和上支撑底盘。基座电气结构地耦合到母板，并且上支撑底盘安装在基座上。处理器卡被容纳在上支撑底盘内，用于将卡安装到母板上。当卡被接收在上支撑底盘内时，处理器卡基本上平行于母板定位。

7. 发明授权

US06707145B2 Efficient multiple power and ground distribution of SMT IC packages 失效
标题翻译： SMT IC封装的高效多功率和地面分布
公开(公告)号：US06707145B2
公开(公告)日：2004-03-16
申请号：US09753303
申请日：2000-12-29
申请人： Steven L. Pollock , Robert L. Olivier
发明人： Steven L. Pollock , Robert L. Olivier
IPC分类号： H01L2352
CPC分类号： H01L23/50 , H01L2924/0002 , H01L2924/15311 , H05K1/0263 , H05K1/113 , H05K2201/10734 , H01L2924/00
摘要： An apparatus, comprising a substrate having a surface, comprising an array of electrical contacts, and a plurality of electrical planes, where the plurality of electrical planes are positioned within the electrical contact array.
摘要翻译：一种装置，包括具有表面的基板，包括电触点阵列和多个电平面，其中所述多个电平面位于所述电接触阵列内。

8. 发明授权

US06365960B1 Integrated circuit package with EMI shield 有权
标题翻译：集成电路封装，带EMI屏蔽
公开(公告)号：US06365960B1
公开(公告)日：2002-04-02
申请号：US09596945
申请日：2000-06-19
申请人： Steven L. Pollock , Robert L. Olivier
发明人： Steven L. Pollock , Robert L. Olivier
IPC分类号： H01L23552
CPC分类号： H01L23/552 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48247 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： An improved packaged IC is disclosed, which includes a semiconductor die mounted to a substrate and an EMI shield that encapsulates the semiconductor die. In addition, a package body encapsulates the EMI shield.
摘要翻译：公开了一种改进的封装IC，其包括安装到衬底的半导体管芯和封装半导体管芯的EMI屏蔽。另外，封装体封装EMI屏蔽。

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