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    • 3. 发明授权
    • Flash memory VDS compensation techiques to reduce programming variability
    • 闪存VDS补偿技术,以减少编程变异性
    • US5798966A
    • 1998-08-25
    • US828873
    • 1997-03-31
    • Stephen N. Keeney
    • Stephen N. Keeney
    • G11C16/06G11C16/10G11C16/30G11C11/34
    • G11C16/10G11C16/30
    • A nonvolatile memory device. For one embodiment, the nonvolatile memory device includes a bit line, a source line, and a nonvolatile memory cell having a drain coupled to the bit line, a source coupled to the source line, a control gate, and a floating gate. The nonvolatile memory device also includes a source voltage generator circuit coupled to the source line and generating a source line voltage when programming the nonvolatile memory cell. The source voltage generator circuit varies the source line voltage based on a location of the nonvolatile memory cell in the memory array. The nonvolatile memory device may also include a drain voltage generator circuit coupled to the bit line and generating a bit line voltage when programming the nonvolatile memory cell. The drain voltage generator circuit varies the bit line voltage based on the location of the nonvolatile memory cell in the memory array.
    • 非易失性存储器件。 对于一个实施例,非易失性存储器件包括位线,源极线和具有耦合到位线的漏极的非易失性存储器单元,耦合到源极线的源极,控制栅极和浮置栅极。 非易失性存储器件还包括耦合到源极线的源极电压发生器电路,并且在编程非易失性存储器单元时产生源极线电压。 源电压发生器电路基于存储器阵列中的非易失性存储单元的位置来改变源极线电压。 非易失性存储器件还可以包括耦合到位线的漏极电压发生器电路,并且在编程非易失性存储器单元时产生位线电压。 漏极电压发生器电路基于存储器阵列中的非易失性存储器单元的位置改变位线电压。
    • 4. 发明授权
    • Post erase repair to enhance performance in a flash memory
    • 擦除擦除功能以提高闪存中的性能
    • US06462990B1
    • 2002-10-08
    • US09752197
    • 2000-12-29
    • Stephen N. Keeney
    • Stephen N. Keeney
    • G11C1604
    • G11C16/3409G11C16/3404
    • A technique of performing post erase repair on a flash memory by identifying a leaky column after the flash memory is erased. The leaky column is repaired first by programming memory cells of the column to increase the threshold voltage Vt of the memory cells to remove the leaky column condition prior to performing post erase repair on the memory cells. Then, each memory cell is verified and repaired to ensure that each memory cell has a Vt above an acceptable post erase repair value. By performing the column leakage repair first, over erased leakage from deselected cells are not present to give false indications when each cell is verified for the post erase repair Vt.
    • 通过在擦除闪速存储器之后识别泄漏列来在闪存上执行擦除后修复的技术。 首先通过对列的存储单元进行编程来修复泄漏柱,以在对存储器单元执行擦除后修复之前增加存储器单元的阈值电压Vt以消除泄漏列条件。 然后,对每个存储单元进行验证和修复,以确保每个存储单元的Vt高于可接受的擦除后修复值。 通过首先执行色谱柱泄漏修复,当每个单元格被验证用于擦除后修复Vt时,不存在未被选择的单元的擦除的泄漏以给出错误的指示。
    • 5. 发明授权
    • Structure and method for low current programming of flash EEPROMs
    • 闪存EEPROM低电流编程的结构和方法
    • US5553020A
    • 1996-09-03
    • US521656
    • 1995-08-31
    • Stephen N. KeeneyGregory E. Atwood
    • Stephen N. KeeneyGregory E. Atwood
    • G11C11/56G11C16/10H01L27/115G11C7/00
    • G11C16/10G11C11/5621G11C11/5628G11C2211/5622G11C2211/565H01L27/115
    • A system and method for programming non-volatile memory enables fast low current programming. Low current programming is achieved by applying a source bias voltage and increasing the drain voltage to be greater than the source bias voltage to maintain fast programming. Furthermore, the control gate voltage may be stepped or ramped from a minimum value to a maximum value to further reduce the peak channel current and to allow the flash cell threshold voltage to be placed to an exact value, for MLC applications. Ramping or stepping of the control gate may be done independently or in conjunction with an applied source bias voltage. Furthermore, the reduced cell current allows more cells to be programmed in parallel which improves program performance and the drain select device can be reduced in size to reduce die area.
    • 用于编程非易失性存储器的系统和方法可实现快速的低电流编程。 通过施加源偏置电压并将漏极电压增加到大于源极偏置电压来维持快速编程,可实现低电流编程。 此外,对于MLC应用,控制栅极电压可以从最小值阶跃或斜坡化以进一步降低峰值通道电流并允许将闪存单元阈值电压置于精确值。 可以独立地或结合施加的源偏置电压来完成控制栅极的斜坡或步进。 此外,降低的电池电流允许并行编程更多的单元,这提高了程序性能,并且可以减小漏极选择器件的尺寸以减小管芯面积。
    • 8. 发明授权
    • Structure and method for low current programming of flash EEPROMS
    • 闪存EEPROM的低电流编程的结构和方法
    • US5487033A
    • 1996-01-23
    • US267815
    • 1994-06-28
    • Stephen N. KeeneyGregory E. Atwood
    • Stephen N. KeeneyGregory E. Atwood
    • G11C11/56G11C16/10H01L27/115G11C7/00
    • G11C16/10G11C11/5621G11C11/5628G11C2211/5622G11C2211/565H01L27/115
    • A system and method for programming non-volatile memory enables fast low current programming. Low current programming is achieved by applying a source bias voltage and increasing the drain voltage to be greater than the source bias voltage to maintain fast programming. Furthermore, the control gate voltage may be stepped or ramped from a minimum value to a maximum value to further reduce the peak channel current and to allow the flash cell threshold voltage to be placed to an exact value, for MLC applications. Ramping or stepping of the control gate may be done independently or in conjunction with an applied source bias voltage. Furthermore, the reduced cell current allows more cells to be programmed in parallel which improves program performance and the drain select device can be reduced in size to reduce die area.
    • 用于编程非易失性存储器的系统和方法可实现快速的低电流编程。 通过施加源偏置电压并将漏极电压增加到大于源极偏置电压来维持快速编程,可实现低电流编程。 此外,对于MLC应用,控制栅极电压可以从最小值阶跃或斜坡化以进一步降低峰值通道电流并允许将闪存单元阈值电压置于精确值。 可以独立地或结合施加的源偏置电压来完成控制栅极的斜坡或步进。 此外,降低的电池电流允许并行编程更多的单元,这提高了程序性能,并且可以减小漏极选择器件的尺寸以减小管芯面积。