专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10468209B2 Waterproof board switch and method of manufacturing waterproof board switch 有权
公开(公告)号：US10468209B2
公开(公告)日：2019-11-05
申请号：US15309718
申请日：2015-05-07
申请人： Soo Ho Lee
发明人： Soo Ho Lee
IPC分类号： H01H13/06 , H01H13/48 , H01H11/04 , H01H13/14 , H01H13/36 , H01H13/52
摘要： A waterproof board switch includes a print circuit board, a bottom coverlay, an insulation adhesive film having a dome hole and being thermo-compression bonded to the front surface of the print circuit board, a metal dome inserted into the dome hole, and a top coverlay coupled to the insulation adhesive film and the print circuit board to cover the dome hole and surround sides of the insulation adhesive film and sides of the print circuit board. The top coverlay is thermo-compression bonded to the top of the insulation adhesive film, the sides of the insulation adhesive film, and the sides of the print circuit board by thermo-compression bonding to seal a space on which the metal dome rests, thereby preventing an introduction of contaminant into the metal dome and the print circuit board.

2. 发明申请

US20100049302A1 STENT FOR EXPENDING INTRA LUMINAL 审中-公开
标题翻译：支付内部灯泡
公开(公告)号：US20100049302A1
公开(公告)日：2010-02-25
申请号：US12531262
申请日：2007-10-30
申请人： Sung-Gwon Kang , Seung-Hwan Jaegal , Woo-Sung Yang , Soo-Ho Lee , Se-Chul Lee
发明人： Sung-Gwon Kang , Seung-Hwan Jaegal , Woo-Sung Yang , Soo-Ho Lee , Se-Chul Lee
IPC分类号： A61F2/06
CPC分类号： A61F2/90 , A61F2/852 , A61F2230/0054
摘要： The present invention relates to a stent for intraluminal expansion. The stent for intraluminal expansion comprises an inner stent A, an outer stent B and fixing threads C for fixing these stents as one unit. The outer stent B is inserted over the inner stent A in such a way that the space portions of the inner stent A and the space portions of the outer stent B are alternated with each other, so the outer surface of the inner stent and the inner surface of the outer stent are in close contact with each other, and both ends of the outer stent and inner stent are fixed as one unit by fixing threads C. According to the stent for intraluminal expansion of the present invention, in which form recoverability of each of the inner stent A and the outer stent B is excellent, expansion is easy after it is inserted into the lumen body because the cylindrical film membrane is not fixed by fixing thread C, and the space portions Id of the inner and outer stents are overlapped alternately with each other so that it is possible to effectively prevent cancer cells, etc. from penetrating into the lumen.
摘要翻译：本发明涉及一种用于管腔内扩张的支架。用于管腔内扩张的支架包括内支架A，外支架B和用于将这些支架固定为一个单元的固定线C. 外支架B以内支架A的空间部和外支架B的空间部彼此交替的方式插入内支架A上，内支架的外表面和内支架外支架的表面彼此紧密接触，并且外支架和内支架的两端通过固定螺纹C固定为一个单元。根据本发明的用于管腔内扩张的支架，其中形状可恢复性内支架A和外支架B各自优异，因为圆柱形膜膜不通过固定螺纹C固定，因此内插体和外支架的空间部分Id之间容易扩张，因此，交替地重叠，使得可以有效地防止癌细胞等渗透到内腔中。

3. 发明申请

US20080157806A1 TEST SOCKET FOR SEMICONDUCTOR 失效
标题翻译：半导体测试插座
公开(公告)号：US20080157806A1
公开(公告)日：2008-07-03
申请号：US11960993
申请日：2007-12-20
申请人： Soo Ho Lee
发明人： Soo Ho Lee
IPC分类号： G01R31/26
CPC分类号： G01R1/0466
摘要： The present invention relates to a test socket for a semiconductor device, which may correspond to a narrow pitch of terminal interval and high speed test in a simplified structure, thereby reducing manufacturing cost thereof. The test socket for a semiconductor device includes conductive substrates having contact point parts exposed at upper and lower surfaces for contacting the terminals of the semiconductor device and the lead terminals of the test board, and slant parts connecting the contact point parts and facing each other in repetitive arrangement, and an insulating elastic element filled in positions where the slant parts are formed as the contact point parts of the conductive substrate are exposed to the outside so as to fix the conductive substrates.
摘要翻译：本发明涉及一种用于半导体器件的测试插座，其可以对应于简化结构中的端子间隔的窄间距和高速测试，从而降低其制造成本。用于半导体器件的测试插座包括具有暴露在上表面和下表面处的接触点部分的导电基底，用于接触半导体器件的端子和测试板的引线端子，以及将接触点部件彼此面对的倾斜部件重复布置以及填充在作为导电基板的接触点的倾斜部分形成的位置的绝缘弹性元件暴露于外部以固定导电基板。

4. 发明授权

US07183634B2 Printed circuit board tact switch 失效
标题翻译：印刷电路板手动开关
公开(公告)号：US07183634B2
公开(公告)日：2007-02-27
申请号：US10514469
申请日：2004-06-07
申请人： Soo Ho Lee
发明人： Soo Ho Lee
IPC分类号： H01L23/02
CPC分类号： H01H13/48 , H01H2203/026 , H01H2205/026 , H01H2207/032 , H01H2213/002 , H01H2215/002 , Y10T428/31511
摘要： The present invention relates to a PCB-type tactile switch, which improves clicking operation and prevents operational errors, thus improving functionality and reliability of products including the tactile switch. The tactile switch of the present invention comprises an insulating member (100), an interval maintaining member (200), a lower pattern (300), a solder mask (400), a groove (500), a upper conducting coat (600), a lower conducting coat (610), a short circuit part of electricity (700), a metal dome (800), and a cover layer (900).
摘要翻译：本发明涉及一种PCB型触觉开关，其改进了点击操作并且防止了操作错误，从而提高了包括触觉开关在内的产品的功能和可靠性。本发明的触觉开关包括绝缘构件（100），间隔保持构件（200），下图案（300），焊接掩模（400），凹槽（500），上导电涂层（600），下导电涂层（610），短路部分电（700），金属圆顶（800）和覆盖层（900）。

5. 发明申请

US20170148586A1 WATERPROOF BOARD SWITCH AND METHOD OF MANUFACTURING WATERPROOF BOARD SWITCH 审中-公开
公开(公告)号：US20170148586A1
公开(公告)日：2017-05-25
申请号：US15309718
申请日：2015-05-07
申请人： Soo Ho LEE
发明人： Soo Ho LEE
IPC分类号： H01H13/06 , H01H13/14 , H01H11/04
摘要： A method of manufacturing a waterproof board switch according to the first embodiment comprises the following steps: (A) arranging a plurality of print circuit boards on a board plate, each of the print circuit board having a top pattern on a front surface and a bottom pattern on a rear surface; (B) insulating the rear surface of the print circuit board; (C) forming a board ass'y by thermo-compression bonding an insulation adhesive film having a dome hole to the front surface of the print circuit board; (D) forming a plurality of board holes near both edges of the dome hole on the board ass'y; (E) resting a metal dome on the dome hole such that the metal dome is able to be in contact with the top pattern; (F) arranging a top coverlay having bigger width than the insulation adhesive film on the board ass'y such that the top coverlay covers the dome hole; (G) arranging a thermoplastic resin above the top coverlay, arranging a top jig above the thermoplastic resin, arranging a bottom jig below the board ass'y and then applying thermo-compression to the thermoplastic resin by means of the top jig and the bottom jig; (H) making the thermoplastic resin having flowability flow from the top coverlay to the board hole by the step (G) such that ends of the top coverlay are bended so as to be in contact with sides of the board ass'y and then are inserted into the board hole, and then thermo-compression bonding the top coverlay to the top of the board ass'y and the sides of the board ass'y by means of the thermoplastic resin; and (I) separating the board ass'y to which the top coverlay was bonded from the board plate after the step (H).

6. 发明申请

US20140144765A1 PCB TACT SWITCH 审中-公开
公开(公告)号：US20140144765A1
公开(公告)日：2014-05-29
申请号：US13812463
申请日：2011-07-11
申请人： Soo Ho Lee
发明人： Soo Ho Lee
IPC分类号： H01H13/12
CPC分类号： H01H13/12 , H01H13/06 , H01H13/48 , H01H2205/016 , H01H2207/032 , H01H2215/004 , H01H2223/002 , H01H2229/04
摘要： The invention relates to a PCB tact switch, and more particularly, to a PCB tact switch having excellent water resistance because same does not have holes on the top and bottom which are open to the outside, capable of preventing erroneous operation through improved contact point safety, and capable of preventing product disengagement through improved fixing strength by being soldered to a substrate. The PCB tact switch of the present invention comprises: an insulation member (100) forming an insulator in a thin plate-shape through which electricity does not pass; an upper conductive substrate (300) formed of a conductor through which electricity may pass, covering the upper surface of the insulation member (100), and including a central contact point terminal (340) and an external contact point terminal (330) by means of a disconnecting portion (310); a lower conductive substrate (400) at the lower surface of the insulation member (100), having an insulation adhesive film (200) deposited on the upper portion thereof, and electrically connected with the upper substrate (300) by means of a through-hole (410); a metal dome (500) which is resiliently deformed by the click from a user, and which electrically connects or disconnects the upper conductive substrate (300) and the lower conductive substrate (400); an insulation film as an insulation cover (600) entirely covering the top portions of the upper conductive substrate (300) and the metal dome (500) and protecting the insides thereof; and an insulation solder mask (700) bonded to the undersurface of the lower conductive substrate (400) and covering the portions with an insulator, except for those requiring soldering, wherein a receiving slot (360) is formed by a receiving slot (110) defined through the insulation member (100) and the insulation film (111), and the metal dome (500) is disposed within the receiving slot (360).

7. 发明授权

US07579826B2 Test socket for semiconductor 失效
标题翻译：半导体测试插座
公开(公告)号：US07579826B2
公开(公告)日：2009-08-25
申请号：US11960993
申请日：2007-12-20
申请人： Soo Ho Lee
发明人： Soo Ho Lee
IPC分类号： G01R31/28
CPC分类号： G01R1/0466
摘要： The present invention relates to a test socket for a semiconductor device, which may correspond to a narrow pitch of terminal interval and high speed test in a simplified structure, thereby reducing manufacturing cost thereof. The test socket for a semiconductor device includes conductive substrates having contact point parts exposed at upper and lower surfaces for contacting the terminals of the semiconductor device and the lead terminals of the test board, and slant parts connecting the contact point parts and facing each other in repetitive arrangement, and an insulating elastic element filled in positions where the slant parts are formed as the contact point parts of the conductive substrate are exposed to the outside so as to fix the conductive substrates.
摘要翻译：本发明涉及一种用于半导体器件的测试插座，其可以对应于简化结构中的端子间隔的窄间距和高速测试，从而降低其制造成本。用于半导体器件的测试插座包括具有暴露在上表面和下表面处的接触点部分的导电基底，用于接触半导体器件的端子和测试板的引线端子，以及将接触点部件彼此面对的倾斜部件重复布置以及填充在作为导电基板的接触点的倾斜部分形成的位置的绝缘弹性元件暴露于外部以固定导电基板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式