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1. 发明授权

US4353954A Flexible printed circuit base board and method for producing the same 失效
标题翻译：柔性印刷电路基板及其制造方法
公开(公告)号：US4353954A
公开(公告)日：1982-10-12
申请号：US191215
申请日：1980-02-05
申请人： Sigenori Yamaoka , Akinobu Kusuhara , Toshinaga Endo
发明人： Sigenori Yamaoka , Akinobu Kusuhara , Toshinaga Endo
IPC分类号： H05K3/38 , C08G59/42 , C08L63/00 , H05K1/03 , H05K1/00 , B32B15/08 , B32B27/34 , B32B27/38
CPC分类号： H05K1/0353 , C08G59/4269 , C08L63/00 , H05K1/0346 , Y10S428/901 , Y10T428/24917 , Y10T428/2495 , Y10T428/24967 , Y10T428/24975 , Y10T428/31525 , Y10T428/31529 , Y10T428/31681 , Y10T428/31721 , Y10T428/31725
摘要： There are disclosed a flexible printed circuit base board produced as an elemental material suitable for a flexible printed circuit board by coating a heat-resistant resin composition composed of a heat-resistant resin having a heterocyclic ring and an epoxy resin dissolved in an organic solvent on a metal foil and drying it to form a film directly on said foil, and a method for producing the same. Said flexible printed circuit base board is more excellent in heat resistance, flame retardancy, adhesiveness, electric insulation, and heat deterioration characteristics than the conventional base board obtained by integrating a heat-resistant film and a metal foil through an adhesive. These properties are of great importance in practical applications of the printed circuit base board. As compared with the conventional products, the production is easy, and hence, the present base board can be produced at a low cost.This base board is not only usable for various types of flexible printed circuit boards but also the film per se obtained from the base board can be used in a field in which a film is used.
摘要翻译： PCT No.PCT / JP79 / 00150 Sec。 371日期1980年2月5日 102（e）日期1980年2月5日PCT申请日1979年6月13日PCT公布。公开号WO80 / 00117 日本1980年1月24日。公开了一种柔性印刷电路基板，其通过涂覆由具有杂环和环氧树脂的耐热树脂组成的耐热性树脂组合物作为适用于柔性印刷电路板的元素材料将树脂溶解在金属箔上的有机溶剂中并干燥以直接在所述箔上形成膜及其制造方法。所述柔性印刷电路基板与通过粘合剂集成耐热膜和金属箔而获得的传统基板相比，耐热性，阻燃性，粘合性，电绝缘性和热劣化性更优异。这些性能在印刷电路基板的实际应用中是非常重要的。与常规产品相比，生产容易，因此可以以低成本生产本基板。该基板不仅可用于各种类型的柔性印刷电路板，而且从基板获得的膜本身也可用于使用膜的领域。

2. 发明授权

US3936575A Flexible metal-clad laminates and method for manufacturing the same 失效
标题翻译：柔性金属包覆层压板及其制造方法
公开(公告)号：US3936575A
公开(公告)日：1976-02-03
申请号：US443621
申请日：1974-02-19
申请人： Tsutomu Watanabe , Takahiro Nakayama , Sigenori Yamaoka
发明人： Tsutomu Watanabe , Takahiro Nakayama , Sigenori Yamaoka
IPC分类号： H05K1/03 , H01B5/14 , E05D15/00
CPC分类号： H05K1/0353 , H05K1/0326 , Y10T428/31525 , Y10T428/31529
摘要： A metal-clad laminate as a base board for a flexible printed circuit, consisting of a metal foil and a base sheet composed of a fibrous base material impregnated with a resin composition comprising a polyepoxy compound and a styrene copolymer containing structural units of maleic anhydride and/or a monoalkyl maleate. The said resin composition cures rapidly, so that the fibrous base material impregnated with said composition can be laminated in a continuous way with a metal foil and, moreover, the composition imparts to the resulting laminate flexibility and heat resistance suitable for flexible printed circuits. Said resin composition may comprise, in addition to the above-said components, a reactive epoxy diluent, an acrylonitrile-butadiene copolymer, and/or a mixture of a saturated polyester resin and a polyisocyanate compound, in order to improve the flexiblity and adhesion of the base sheet to metal foil. A prepreg obtained by impregnating the fibrous base material with the above-resin composition is not only suitable for manufacturing a flexible printed circuit base board excellent in soldering heat-resistance, bending resistance, and parts-loadability, but also usable as a heat-resistant cover-lay for flexible printed circuits or as an interlayer adhesive sheet.
摘要翻译：作为柔性印刷电路基板的覆金属层压板，由金属箔和基材片构成，该金属箔和基材片由浸渍有包含聚环氧化合物和含有马来酸酐结构单元的苯乙烯共聚物的树脂组合物的纤维基材构成， /或马来酸单烷基酯。所述树脂组合物快速固化，从而浸渍有所述组合物的纤维基材可以与金属箔以连续的方式层压，此外，组合物赋予所得到的层压板柔性和适用于柔性印刷电路的耐热性。除了上述组分之外，所述树脂组合物可以包含反应性环氧稀释剂，丙烯腈 - 丁二烯共聚物和/或饱和聚酯树脂和多异氰酸酯化合物的混合物，以便提高柔韧性和粘合性基片与金属箔。通过用上述树脂组合物浸渍纤维基材而获得的预浸料不仅适用于制造焊接耐热性，耐弯曲性和零件加载性优异的柔性印刷电路基板，而且也可用作耐热性用于柔性印刷电路的覆盖层或作为层间粘合片。

3. 发明授权

US3932689A Flexible adhesive composition and method for utilizing same and article formed therefrom 失效
标题翻译：柔性粘合剂组合物及其利用方法和由其形成的制品
公开(公告)号：US3932689A
公开(公告)日：1976-01-13
申请号：US444263
申请日：1974-02-21
申请人： Tsutomu Watanabe , Sigenori Yamaoka , Kochi Tanaka
发明人： Tsutomu Watanabe , Sigenori Yamaoka , Kochi Tanaka
IPC分类号： C08L9/02 , C08L25/00 , C08L29/14 , C08L57/10 , C08L63/00 , C09J109/02 , C09J161/06 , C09J163/00 , H05K1/00 , H05K3/38 , C09J3/14 , C09J3/16
CPC分类号： H05K3/386 , C08L57/10 , C09J109/02 , C09J161/06 , C09J163/00 , C08L25/00 , C08L29/14 , C08L63/00 , C08L9/02 , H05K1/0393 , H05K2201/0355 , Y10T428/31529 , Y10T428/31688 , Y10T428/31692 , Y10T428/31696 , Y10T428/31721
摘要： This invention provides an adhesive composition for use in flexible printed circuits, comprising a phenol-formaldehyde resin, a polyepoxy compound, an acrylonitrile-butadiene copolymer and/or a polyvinylacetal resin, and a styrenic copolymer containing as structural units maleic anhydride and/or an alkyl maleate. Being excellent in adhesive strength, flow property, rapid curability, and heat resistance after curing, the present composition is especially suitable for the continuous bonding of insulating plastic films, particularly a polyimide film, to conductor foils by use of a roll-laminator and gives heat-resistant metal-clad laminates excellent for flexible printed circuits which can be soldered at high temperatures. This invention further provides an adhesive composition having added thereto a compound consisting of an anhydride or a half-ester of cyclohexenepolycarboxylic acid in order to increase the flow property and adhesive strength of the adhesive composition at the time of bonding by means of a roll-laminator. All of the aforesaid adhesive composition not only permit the economical and technically advantageous production of laminates for heat resistant flexible printed circuits, but also can serve as an adhesive for either an overlay film for use in highly heat-resistant flexible printed circuits or an interlayer adhesive film.
摘要翻译：本发明提供一种用于柔性印刷电路的粘合剂组合物，其包含酚醛树脂，聚环氧化合物，丙烯腈 - 丁二烯共聚物和/或聚乙烯醇缩醛树脂，以及含有作为结构单元的马来酸酐和/或马来酸烷基酯。粘合强度，流动性，快速固化性和固化后的耐热性优异，本发明的组合物特别适用于使用辊式层压机将绝缘塑料膜，特别是聚酰亚胺膜连续地接合到导体箔上，并给出耐热金属复合层压板，适用于可在高温下焊接的柔性印刷电路。本发明还提供了一种粘合剂组合物，其中添加了由酸酐或环己烯多元羧酸的半酯组成的化合物，以便通过辊式层压机粘合时增加粘合剂组合物的流动性和粘合强度。所有上述粘合剂组合物不仅可以经济地和技术上有利地生产用于耐热柔性印刷电路的层压板，而且还可用作用于高耐热柔性印刷电路或层间粘合剂的覆盖膜的粘合剂电影。

4. 发明授权

US4401499A Crosslinked resin of epoxy compound and isocyanate and process for producing same 失效
标题翻译：环氧化合物和异氰酸酯的交联树脂及其制备方法
公开(公告)号：US4401499A
公开(公告)日：1983-08-30
申请号：US326306
申请日：1981-12-01
申请人： Shoroku Kaneko , Sigenori Yamaoka , Masuo Mizuno , Yukihiro Okabe
发明人： Shoroku Kaneko , Sigenori Yamaoka , Masuo Mizuno , Yukihiro Okabe
IPC分类号： C08G18/58 , C08G59/14 , C08G59/40 , B32B31/00
CPC分类号： C08G18/58 , C08G59/1477 , C08G59/4028
摘要： A crosslinked resin excellent in heat resistance, toughness, moisture resistance and adhesiveness can be obtained by the use of an epoxy compound having both alcoholic hydroxyl groups and epoxy groups in its molecule and an isocyanate compound having isocyanate groups in its molecule by first reacting the alcoholic hydroxyl groups of said epoxy compound and the isocyanate groups of said isocyanate compound to produce an epoxy prepolymer having urethane linkages stable at room temperature, followed by dissociating the urethane linkages of the prepolymer to regenerate the isocyanate groups and reacting said isocyanate groups with the epoxy groups of said epoxy compound. By carrying out the above-mentioned reaction between the isocyante groups and the epoxy groups in the presence of at least one member selected from the group consisting of amine compounds, carboxylic acid anhydrides, phenol novolac compounds and polyvinyl-phenol compounds and/or a bisimide compound, a crosslinked resin having higher heat resistance can be produced. Said prepolymer is excellent in storage stability and suitable for use in the production of laminates.
摘要翻译：通过在其分子中使用具有醇羟基和环氧基的环氧化合物和分子中具有异氰酸酯基的异氰酸酯化合物，可以通过首先使酒精反应来获得耐热性，韧性，耐湿性和粘合性优异的交联树脂所述环氧化合物的羟基和所述异氰酸酯化合物的异氰酸酯基，以产生具有在室温下具有氨基甲酸酯键稳定的环氧预聚物，随后将预聚物的氨基甲酸酯键解离以再生异氰酸酯基团并使所述异氰酸酯基与环氧基反应的所述环氧化合物。通过在选自胺化合物，羧酸酐，苯酚酚醛清漆化合物和聚乙烯基苯酚化合物和/或双酰亚胺中的至少一种的存在下进行异氰基和环氧基之间的上述反应化合物，可以制备具有较高耐热性的交联树脂。所述预聚物的储存稳定性优异，适用于层压制品的生产。

5. 发明授权

US3985928A Heat-resistant laminating resin composition and method for using same 失效
标题翻译：耐热层压树脂组合物及其使用方法
公开(公告)号：US3985928A
公开(公告)日：1976-10-12
申请号：US572451
申请日：1975-04-28
申请人： Tsutomu Watanabe , Sigenori Yamaoka
发明人： Tsutomu Watanabe , Sigenori Yamaoka
IPC分类号： B32B15/08 , C08G59/00 , C08G59/40 , C08J5/24 , C08L33/00 , C08L33/02 , C08L35/00 , C08L63/00 , C08L79/08 , H05K1/03 , C09J7/00
CPC分类号： C08L35/00 , C08G59/4042 , C08J5/24 , C08L63/00 , C08L79/085 , H05K1/0346 , C08J2379/08 , Y10S428/901 , Y10S428/92 , Y10T428/31525 , Y10T428/31529 , Y10T428/31623 , Y10T428/31721 , Y10T442/2713 , Y10T442/3512
摘要： A heat-resistant resin composition suitable for use in multilayer super high density printed circuit boards, comprising a polyaminobismaleimide, a polyepoxy compound, and an aromatic vinyl copolymer containing as structural unit maleic anhydride and/or an alkyl maleate. This resin composition is excellent in thermal resistance and dimensional stability, which are important properties of a resin composition for practical use in lamination, and when used in lamination, exhibits favorable flow and curing properties so that it can be easily and economically processed under conventional laminating conditions. When used as a multilayer printed circuit board material, it is also characterized by excellent adhesion to a copper foil, particularly in bonding an inner circuit copper foil to the board. Although particularly suitable for use in multilayer printed circuit boards of numerous layers (eight or more layers) bearing highly packed circuits and as an interlayer adhesive sheet, the present resin composition can be used in general heat-resistant printed circuit boards and in general heat-resistant structural laminates.
摘要翻译：一种适用于多层超高密度印刷电路板的耐热树脂组合物，其包含聚氨基双马来酰亚胺，聚环氧化合物和含有马来酸酐和/或马来酸烷基酯的结构单元的芳族乙烯基共聚物。该树脂组合物具有优异的耐热性和尺寸稳定性，这是用于层压的实际应用的树脂组合物的重要性质，并且当用于层压时，表现出良好的流动性和固化性，从而可以在常规层压下容易且经济地加工条件。当用作多层印刷电路板材料时，其特征还在于对铜箔具有优异的粘合性，特别是将内部电路铜箔粘合到基板上。虽然特别适用于承载高密封电路的多层（八层或更多层）的多层印刷电路板和作为层间粘合片，但是本发明的树脂组合物可用于通常的耐热印刷电路板中，抗结构层压板。

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