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1. 发明授权

US3932689A Flexible adhesive composition and method for utilizing same and article formed therefrom 失效
标题翻译：柔性粘合剂组合物及其利用方法和由其形成的制品
公开(公告)号：US3932689A
公开(公告)日：1976-01-13
申请号：US444263
申请日：1974-02-21
申请人： Tsutomu Watanabe , Sigenori Yamaoka , Kochi Tanaka
发明人： Tsutomu Watanabe , Sigenori Yamaoka , Kochi Tanaka
IPC分类号： C08L9/02 , C08L25/00 , C08L29/14 , C08L57/10 , C08L63/00 , C09J109/02 , C09J161/06 , C09J163/00 , H05K1/00 , H05K3/38 , C09J3/14 , C09J3/16
CPC分类号： H05K3/386 , C08L57/10 , C09J109/02 , C09J161/06 , C09J163/00 , C08L25/00 , C08L29/14 , C08L63/00 , C08L9/02 , H05K1/0393 , H05K2201/0355 , Y10T428/31529 , Y10T428/31688 , Y10T428/31692 , Y10T428/31696 , Y10T428/31721
摘要： This invention provides an adhesive composition for use in flexible printed circuits, comprising a phenol-formaldehyde resin, a polyepoxy compound, an acrylonitrile-butadiene copolymer and/or a polyvinylacetal resin, and a styrenic copolymer containing as structural units maleic anhydride and/or an alkyl maleate. Being excellent in adhesive strength, flow property, rapid curability, and heat resistance after curing, the present composition is especially suitable for the continuous bonding of insulating plastic films, particularly a polyimide film, to conductor foils by use of a roll-laminator and gives heat-resistant metal-clad laminates excellent for flexible printed circuits which can be soldered at high temperatures. This invention further provides an adhesive composition having added thereto a compound consisting of an anhydride or a half-ester of cyclohexenepolycarboxylic acid in order to increase the flow property and adhesive strength of the adhesive composition at the time of bonding by means of a roll-laminator. All of the aforesaid adhesive composition not only permit the economical and technically advantageous production of laminates for heat resistant flexible printed circuits, but also can serve as an adhesive for either an overlay film for use in highly heat-resistant flexible printed circuits or an interlayer adhesive film.
摘要翻译：本发明提供一种用于柔性印刷电路的粘合剂组合物，其包含酚醛树脂，聚环氧化合物，丙烯腈 - 丁二烯共聚物和/或聚乙烯醇缩醛树脂，以及含有作为结构单元的马来酸酐和/或马来酸烷基酯。粘合强度，流动性，快速固化性和固化后的耐热性优异，本发明的组合物特别适用于使用辊式层压机将绝缘塑料膜，特别是聚酰亚胺膜连续地接合到导体箔上，并给出耐热金属复合层压板，适用于可在高温下焊接的柔性印刷电路。本发明还提供了一种粘合剂组合物，其中添加了由酸酐或环己烯多元羧酸的半酯组成的化合物，以便通过辊式层压机粘合时增加粘合剂组合物的流动性和粘合强度。所有上述粘合剂组合物不仅可以经济地和技术上有利地生产用于耐热柔性印刷电路的层压板，而且还可用作用于高耐热柔性印刷电路或层间粘合剂的覆盖膜的粘合剂电影。

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