专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5948603A Method of processing black and white silver halide photographic light sensitive material 失效
标题翻译：处理黑白卤化银照相感光材料的方法
公开(公告)号：US5948603A
公开(公告)日：1999-09-07
申请号：US975128
申请日：1997-11-20
申请人： Shinji Uchihiro , Shoji Nishio
发明人： Shinji Uchihiro , Shoji Nishio
IPC分类号： G03C5/305 , G03C5/31 , G03C5/29
CPC分类号： G03C5/3053 , G03C5/305 , G03C5/31
摘要： Disclosed is a method of processing an exposed black and white photographic light-sensitive material employing an automatic processor, the method comprising the steps of developing the exposed material with a developer, the developer is replenished with a developer replenisher; fixing the developed material with a fixer; washing the fixed material; and drying the washed material, wherein the developer contains a developing agent, a compound represented by the following formula (III) and at least one of a compound represented by the following formula (I) and a compound represented by the following formula (II): ##STR1##
摘要翻译：公开了一种使用自动处理器处理曝光的黑白照相感光材料的方法，该方法包括以下步骤：用显影剂显影曝光材料，显影剂补充显影剂补充液; 用定影器固定开发的材料; 洗固定材料; 和干燥洗涤过的物质，其中显影剂含有显影剂，由下式（III）表示的化合物和由下式（I）表示的化合物和由下式（II）表示的化合物中的至少一种）：

2. 发明授权

US5976774A Solid processing composition for silver halide light sensitive photographic material and preparing method thereof 失效
标题翻译：卤化银感光感光材料的固体处理组合物及其制备方法
公开(公告)号：US5976774A
公开(公告)日：1999-11-02
申请号：US107150
申请日：1998-06-30
申请人： Shinji Uchihiro
发明人： Shinji Uchihiro
IPC分类号： B01J2/10 , G03C5/26 , G03C5/305 , G03C5/38 , G03C5/50
CPC分类号： G03C5/265 , G03C5/3053 , G03C5/38
摘要： A method for preparing a solid processing composition in the form of granules for a silver halide black-and-white photographic material is disclosed, comprising the steps of:(i) mixing powdery photographic processing chemicals,(ii) granulating a mixture of the processing chemicals while stirring to form granules, and(iii) drying the granules,wherein in step (ii), granulation is carried out with the addition of water in an amount of 4 to 6% by weight, based on the processing chemicals; said granules having a bulk density of not less than 1.1 g/cm.sup.3.
摘要翻译：公开了制备用于卤化银黑白照相材料的颗粒形式的固体处理组合物的方法，包括以下步骤：（i）将粉末状摄影处理化学品混合，（ii）将处理的混合物化学品，同时搅拌以形成颗粒，和（iii）干燥颗粒，其中在步骤（ii）中，基于处理化学品，加入4至6重量％的水进行造粒; 所述颗粒的堆积密度不小于1.1g / cm 3。

3. 发明授权

US6001546A Manufacturing method for solid processing composition for processing silver halide light-sensitive photographic material 失效
标题翻译：用于处理卤化银感光感光材料的固体处理组合物的制造方法
公开(公告)号：US6001546A
公开(公告)日：1999-12-14
申请号：US184098
申请日：1998-10-30
申请人： Tetsuya Suzuki , Kouki Kawashima , Shinji Uchihiro , Akira Tanizaki
发明人： Tetsuya Suzuki , Kouki Kawashima , Shinji Uchihiro , Akira Tanizaki
IPC分类号： G03C5/26 , G03C5/29 , G03C5/30 , G03C5/305 , G03C5/38
CPC分类号： G03C5/265 , G03C5/30 , G03C5/305 , G03C5/38
摘要： A manufacturing method for a solid processing composition for processing a silver halide photographic light sensitive material, wherein the composition is manufactured by using a stirring granulation method, and at least part of said stirring granulation is performed in the temperature range of 35.degree. C. to 120.degree. C.The manufacturing method for the solid processing composition mentioned above, wherein the content of the added solution in the stirring granulation process is 0.01 to 2.0 weight % of the total weight of said solid processing composition and wherein not less than 60% of the total weight of said solid processing composition has particle size of 1.0 .mu.m to 150 .mu.m.The solid processing composition mentioned above may contain reductone derivative, sugar derivative and polyethylene glycol derivative.
摘要翻译：一种用于处理卤化银照相感光材料的固体处理组合物的制造方法，其中通过使用搅拌造粒方法制造组合物，并且至少部分所述搅拌造粒在35℃至 120℃。上述固体处理组合物的制造方法，其中，搅拌造粒法中的添加溶液的含量为所述固体处理组合物总重量的0.01〜2.0重量％，其中不少于60重量％所述固体处理组合物的总重量为1.0〜150μm的粒径。上述固体处理组合物可以含有还原酮衍生物，糖衍生物和聚乙二醇衍生物。

4. 发明授权

US5955247A Method for processing silver halide photographic light-sensitive material 失效
标题翻译：卤化银照相感光材料的处理方法
公开(公告)号：US5955247A
公开(公告)日：1999-09-21
申请号：US111167
申请日：1998-07-07
申请人： Shinji Uchihiro
发明人： Shinji Uchihiro
IPC分类号： G03C1/06 , G03C5/26 , G03C5/29 , G03C5/30 , G03C5/38
CPC分类号： G03C5/265 , G03C5/383 , G03C1/061 , G03C5/30
摘要： A method for processing a black-and-white silver halide photographic light-sensitive material by a monobath processing method. The processing method comprises the steps ofproviding a solid composition which comprises a first part containing a developing agent represented by Formula A and optionally a dihydroxybenzene compound, and a second part containing a fixing agent, and both of the first part and the second part are each coated with a coating material,dissolving the solid composition into water in order to make a monobath processing solution,processing a silver halide photographic light-sensitive material comprising a compound represented by Formula H with the monobath processing solution, ##STR1##
摘要翻译：通过一条线处理方法处理黑白卤化银摄影感光材料的方法。该处理方法包括提供固体组合物的步骤，该组合物包括含有由式A表示的显影剂和任选的二羟基苯化合物的第一部分和含有固定剂的第二部分，第一部分和第二部分均为每个涂覆有涂层材料，将固体组合物溶解在水中以形成单条加工溶液，用包含由式H表示的化合物与卤化物处理溶液一起处理卤化银照相感光材料，

5. 发明授权

US07147746B2 Preparing method of IC card and IC card 失效
标题翻译： IC卡和IC卡的准备方法
公开(公告)号：US07147746B2
公开(公告)日：2006-12-12
申请号：US10418645
申请日：2003-04-17
申请人： Shinji Uchihiro , Ryoji Hattori
发明人： Shinji Uchihiro , Ryoji Hattori
IPC分类号： C09J5/06
CPC分类号： G06K19/07718 , G06K19/07745 , H01L2924/0002 , H01L2924/00
摘要： A method of preparing an IC card, which comprises a first sheet material and a second sheet material and an adhesive agent layer between the first sheet material and the second sheet material, the adhesive agent layer having therein an IC module fixed with a moisture hardenable adhesive agent, the method comprising: a pasting step to paste the first sheet material and the second sheet material while providing the IC module between the first sheet material and the second sheet material with the moisture hardenable adhesive agent to form a pasted sheet; a first storing step to store the pasted sheet under a temperature of 10 to 30° C. and a relative humidity of 20 to 80%; and a second storing step to store the pasted sheet under a temperature of 20 to 50° C. and a relative humidity of 40 to 100% after the first storing step.
摘要翻译：一种制备IC卡的方法，其包括第一片材和第二片材，以及在第一片材和第二片材之间的粘合剂层，其中具有固定有湿固化性粘合剂的IC模块的粘合剂层所述方法包括：粘贴步骤，以将所述第一片材和所述第二片材之间的所述IC模块与所述湿固化性粘合剂一起提供，以粘贴所述第一片材和所述第二片材，以形成粘贴片; 第一存储步骤，在10至30℃的温度和相对湿度为20至80％的条件下储存所述粘贴的片材; 以及第二存储步骤，在第一存储步骤之后，在20至50℃的温度和相对湿度为40至100％的条件下存储粘贴的片材。

6. 发明授权

US07021550B2 Preparing method of IC card and IC card 有权
标题翻译： IC卡和IC卡的准备方法
公开(公告)号：US07021550B2
公开(公告)日：2006-04-04
申请号：US10460857
申请日：2003-06-13
申请人： Shinji Uchihiro , Ryoji Hattori
发明人： Shinji Uchihiro , Ryoji Hattori
IPC分类号： G06K19/06
CPC分类号： G06K19/07716 , G06K19/07718 , G06K19/07745 , H01L2224/16 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12044 , H01L2924/3025 , H01L2924/00
摘要： A method for preparing an IC card, the IC card has an IC module within an adhesive layer between first substrate and second substrate. In the method, an adhesive containing diphenylmethanediisocyanate an amount of less than percent by weight based on the whole amount the adhesive and having an elongation at fracture adhesive of 150–1,500 percent after complete curing is employed, and the blanc IC card sheet is cut when an elongation at fracture of the adhesive of 5–500 percent prior to complete curing.
摘要翻译：一种用于制备IC卡的方法，IC卡在第一基板和第二基板之间的粘合剂层内具有IC模块。在该方法中，使用含有二苯基甲烷二异氰酸酯的粘合剂的量相对于全部量的全部量的粘合剂并且在完全固化后具有150-1,500％的断裂粘合剂的伸长率，并且将blanc IC卡片切割在完全固化之前粘合剂的断裂伸长率为5-500％。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式