专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US6145422A Method of positioning work piece and system therefor 失效
标题翻译：定位工件及其系统的方法
公开(公告)号：US6145422A
公开(公告)日：2000-11-14
申请号：US196154
申请日：1998-11-20
申请人： Shozo Katamachi , Shinji Shibaoka
发明人： Shozo Katamachi , Shinji Shibaoka
IPC分类号： B23Q16/00 , B28D5/00 , B28D5/04 , B26D1/50
CPC分类号： B23Q16/001 , B28D5/0058 , B28D5/0088 , B28D5/045
摘要： A work piece such as a semiconductor ingot is positioned and bonded to a work piece bonding block by a bonding jig which is provided separately from a wire saw in such a manner that the central axis of the work piece and respective horizontal and vertical surfaces of the work piece bonding block come into parallel to each other. Then, the work piece bonding block is positioned and mounted at a mounting jig which is provided on a cutting-feeding table of the wire saw and which has horizontal and vertical reference surfaces perpendicularly intersecting a cutting plane, so that the central axis of the work piece automatically and perpendicularly intersects the cutting plane. Then, the mounting jig is tilted to tilt the work piece by a tilting mechanism in such a manner that the central axis is inclined against the cutting plane at a predetermined angle on the basis of shift value data of the crystal orientation with the central axis of the work piece a reference, which has previously been measured outside the wire saw.
摘要翻译：通过与线锯分开设置的接合夹具将诸如半导体锭的工件定位并结合到工件接合块，使得工件的中心轴线和工件的相应的水平和垂直表面工件粘结块彼此平行。然后，将工件接合块定位并安装在安装夹具上，该安装夹具设置在线锯的切割进给台上，并且具有与切割平面垂直相交的水平和垂直参考表面，使得工件的中心轴线片自动垂直于切割平面相交。然后，通过倾斜机构使安装夹具倾斜以使工件倾斜，使得中心轴基于具有中心轴的晶体取向的偏移值数据以预定角度倾斜于切割平面工件参考，其以前已经在线锯外测量。

2. 发明授权

US5904136A Wire saw and slicing method thereof 失效
标题翻译：线锯及切片方法
公开(公告)号：US5904136A
公开(公告)日：1999-05-18
申请号：US866097
申请日：1997-05-30
申请人： Shinji Nagatsuka , Shinji Shibaoka , Jiro Tsuchishima
发明人： Shinji Nagatsuka , Shinji Shibaoka , Jiro Tsuchishima
IPC分类号： B28D5/00 , B28D5/04 , H01L21/304 , B28D1/08
CPC分类号： B28D5/045 , B28D5/0088
摘要： The crystal orientation of a workpiece is determined and a tilt angle of the workpiece is adjusted based on the determined crystal orientation at the outside of a wire saw, and then the workpiece is attached to a workpiece feed table of the wire saw so that the slicing can be started.
摘要翻译：确定工件的晶体取向，并且基于在线锯外部确定的晶体取向来调整工件的倾斜角度，然后将工件附接到线锯的工件馈送台，使得切片可以开始

3. 发明授权

US06067976A Wafer cut method with wire saw apparatus and apparatus thereof 失效
标题翻译：线切割装置及其装置的切片方法
公开(公告)号：US06067976A
公开(公告)日：2000-05-30
申请号：US854701
申请日：1997-05-12
申请人： Ichiro Katayama , Shinji Shibaoka , Shozo Katamachi
发明人： Ichiro Katayama , Shinji Shibaoka , Shozo Katamachi
IPC分类号： B28D5/04 , B28D1/08
CPC分类号： B28D5/045
摘要： The moving direction of the wire line 15A at the cut portion 44 for cutting the columnar semiconductor ingot 18 corresponds to the vertical-downward direction. And, the semiconductor ingot 18 supported with the cut-feed means 20 is fed horizontally so as to be pushed in perpendicular to said wire line 15A, and the processing liquid 42 is supplied to the wire line 15A from the grind liquid supply nozzle 40 placed at the upper side of the cut portion 44. Therefore, the processing liquid 42 supplied to the wire line 15A flows along the wire line 15A, so that the processing liquid 42 can be surely supplied to the cut portion 44.
摘要翻译：在用于切割柱状半导体锭18的切割部分44处的导线15A的移动方向对应于垂直向下的方向。并且，用切割进给装置20支撑的半导体锭18被水平地供给，以便被垂直于所述线线15A推动，并且处理液体42从放置的研磨液供给喷嘴40供给到线路15A 因此，提供给线路15A的处理液体42沿着线路线15A流动，从而可以将处理液体42可靠地供给至切断部44。

4. 发明授权

US5857454A Wire saw and method of slicing ingot by wire saw 失效
标题翻译：线锯和线锯切片方法
公开(公告)号：US5857454A
公开(公告)日：1999-01-12
申请号：US675894
申请日：1996-07-05
申请人： Shinji Shibaoka
发明人： Shinji Shibaoka
IPC分类号： B28D5/00 , B28D5/04 , B24D3/00
CPC分类号： B28D5/0088 , B28D5/045
摘要： An ingot mounting block consists of an attachment block, a horizontal rocking block and a vertical rocking block. The horizontal rocking block is provided in such a manner to rock horizontally with regard to the attachment block. The vertical rocking block is provided in such a manner to rock vertically with regard to the attachment block. A semiconductor ingot is positioned at the top of the vertical rocking block and is secured thereto. During an alignment of a crystal orientation, the horizontal rocking block and the vertical rocking block are previously inclined at a predetermined angle with regard to the attachment block, and then they are attached to a work feed table of a wire saw.
摘要翻译：铸锭安装块由附接块，水平摇摆块和垂直摇摆块组成。以相对于附接块水平摇摆的方式设置水平摇摆块。垂直摆动块以相对于附接块垂直摇摆的方式设置。半导体锭位于垂直摇摆块的顶部并固定在其上。在晶体取向的对准期间，水平摆动块和垂直摆动块预先相对于附接块倾斜预定角度，然后它们附接到线锯的工作进给台。

5. 发明授权

US5295331A Method of chamfering semiconductor wafer 失效
标题翻译：倒角半导体晶圆的方法
公开(公告)号：US5295331A
公开(公告)日：1994-03-22
申请号：US977889
申请日：1992-11-18
申请人： Katsuo Honda , Yoshio Kamoshita , Shinji Shibaoka , Katsuhiro Tago
发明人： Katsuo Honda , Yoshio Kamoshita , Shinji Shibaoka , Katsuhiro Tago
IPC分类号： B24B9/06 , H01L21/304 , B24B1/00
CPC分类号： H01L21/02021 , B24B9/065
摘要： According to the present invention, the rotary axis O--O of a grindstone 22 is inclined to the rotary axis P--P of a semiconductor wafer 20 through an angle .theta. in a direction of the tangent line of the semiconductor wafer. Accordingly, a moving direction of abrasive grains of the grindstone 22 is divided into two including a component force A.sub.1 in the grinding direction and a component force A.sub.2 in the perpendicular direction, and these component forces increase the number of acting abrasive grains, so that the accuracy of the chamfering shape and the surface roughness can be improved. According to the present invention, the peripheral edge of the rotating semiconductor wafer is chamfered while the rotating grindstone 22 is reciprocatingly moved along the inclined grinding surface 24, whereby the number of the acting abrasive grains are increased, so that the accuracy of the chamfering shape and the surface roughness can be improved.
摘要翻译：根据本发明，磨石22的旋转轴O-O相对于半导体晶片20的旋转轴P-P在半导体晶片的切线方向上以角度（θ）倾斜。因此，磨石22的磨粒的移动方向分为磨削方向上的分力A1和垂直方向的分力A2，这些分力增加了作用磨粒的数量，可以提高倒角形状和表面粗糙度的精度。根据本发明，旋转的半导体晶片的周边边缘被倒角，同时旋转的磨石22沿着倾斜研磨表面24往复移动，由此增加作用磨粒的数量，使得倒角形状的精度可以提高表面粗糙度。

6. 发明授权

US5893308A Method of positioning work piece and system therefor 失效
标题翻译：定位工件及其系统的方法
公开(公告)号：US5893308A
公开(公告)日：1999-04-13
申请号：US852605
申请日：1997-05-07
申请人： Shozo Katamachi , Shinji Shibaoka
发明人： Shozo Katamachi , Shinji Shibaoka
IPC分类号： B23Q16/00 , B28D5/00 , B28D5/04 , B26D1/50
CPC分类号： B23Q16/001 , B28D5/0058 , B28D5/0088 , B28D5/045 , Y10T83/04 , Y10T83/148 , Y10T83/6577 , Y10T83/6612 , Y10T83/9292
摘要： A work piece such as a semiconductor ingot is positioned and bonded to a work piece bonding block by means of a bonding jig which is provided separately from a wire saw in such a manner that the central axis of the work piece and respective horizontal and vertical surfaces of the work piece bonding block come into parallel to each other. Then, the work piece bonding block is positioned and mounted at a mounting jig which is provided on a cutting-feeding table of the wire saw and which has horizontal and vertical reference surfaces perpendicularly intersecting a cutting plane, so that the central axis of the work piece automatically and perpendicularly intersects the cutting plane. Then, the mounting jig is tilted to tilt the work piece by a tilting mechanism in such a manner that the central axis is inclined against the cutting plane at a predetermined angle on the basis of shift value data of the crystal orientation with the central axis of the work piece a reference, which has previously been measured outside the wire saw.
摘要翻译：通过与线锯分开设置的接合夹具将诸如半导体锭的工件定位并结合到工件接合块，使得工件的中心轴线和相应的水平和垂直表面的工件接合块彼此平行。然后，将工件接合块定位并安装在安装夹具上，该安装夹具设置在线锯的切割进给台上，并且具有与切割平面垂直相交的水平和垂直参考表面，使得工件的中心轴线片自动垂直于切割平面相交。然后，通过倾斜机构使安装夹具倾斜以使工件倾斜，使得中心轴基于具有中心轴的晶体取向的偏移值数据以预定角度倾斜于切割平面工件参考，其以前已经在线锯外测量。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式