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1. 发明授权

US07750448B2 Semiconductor package and method for manufacturing the same 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US07750448B2
公开(公告)日：2010-07-06
申请号：US12237639
申请日：2008-09-25
申请人： Shimpei Yoshioka , Naotake Watanabe
发明人： Shimpei Yoshioka , Naotake Watanabe
IPC分类号： H01L23/495
CPC分类号： H01L23/492 , H01L23/051 , H01L2924/0002 , H01L2924/01079 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： A semiconductor package includes a semiconductor device having a first main surface and a second main surface, a first electrode plate provided on the first main surface, a second electrode plate provided on the second main surface, and a wiring substrate provided between the semiconductor device and the first electrode plate, in which a plurality of opening portions in the side surface of a protruding portion provided on the first electrode plate are engaged respectively with a plurality of engaging portions which face the opening portions and which are provided on the inner side surface of an intrusion opening portion in the wiring substrate into which the protruding portion is intruded.
摘要翻译：半导体封装包括具有第一主表面和第二主表面的半导体器件，设置在第一主表面上的第一电极板，设置在第二主表面上的第二电极板，以及设置在半导体器件和第一电极板，其中设置在第一电极板上的突出部分的侧表面中的多个开口部分分别与面对开口部分的多个接合部分接合，并且设置在第一电极板的内侧表面上所述布线基板中的入射开口部分突出部分被插入其中。

2. 发明授权

US06255672B1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US06255672B1
公开(公告)日：2001-07-03
申请号：US09199780
申请日：1998-11-25
申请人： Shimpei Yoshioka , Yasuhito Saito
发明人： Shimpei Yoshioka , Yasuhito Saito
IPC分类号： H01L21332
CPC分类号： H01L25/072 , H01L2224/16 , H01L2224/73253 , H01L2224/73255 , H01L2924/01005 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/30107 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device includes a pair of semiconductor switching elements and a board. Each semiconductor switching element has positive and control electrodes formed on one surface and a negative electrode formed on the other surface. The positive and control electrodes of one of the semiconductor switching elements are joined to the board, and the negative electrode of the other semiconductor switching element, which faces in a direction opposite to that of one of the semiconductor switching elements, is joined to the board.
摘要翻译：半导体器件包括一对半导体开关元件和基板。每个半导体开关元件具有形成在一个表面上的正极和控制电极以及形成在另一个表面上的负极。半导体开关元件中的一个的正极和控制电极接合到板，并且另一个半导体开关元件的面向与一个半导体开关元件的方向相反的方向的负极接合到板。

3. 发明授权

US5579502A Memory card apparatus using EEPROMS for storing data and an interface buffer for buffering data transfer between the EEPROMS and an external device 失效
标题翻译：使用EEPROMS存储数据的存储卡装置和用于缓冲EEPROMS和外部设备之间的数据传输的接口缓冲器
公开(公告)号：US5579502A
公开(公告)日：1996-11-26
申请号：US505369
申请日：1995-07-21
申请人： Kazuo Konishi , Shimpei Yoshioka , Setsuo Terasaki , Hiroaki Matsubara , Koji Maruyama , Toshiaki Sato , Takaaki Suyama
发明人： Kazuo Konishi , Shimpei Yoshioka , Setsuo Terasaki , Hiroaki Matsubara , Koji Maruyama , Toshiaki Sato , Takaaki Suyama
IPC分类号： G06F11/16 , G11C16/10 , G11C29/00 , H04N5/907 , G06F12/04
CPC分类号： G11C29/765 , G06F11/141 , G11C16/102 , H04N5/907 , G06F2212/2022 , G11C29/76
摘要： A memory card apparatus using EEPROMs as semiconductor memories. Externally input data are temporarily recorded in a buffer memory and are subsequently written in the EEPROMs. Verify processing is automatically performed between the buffer memory and the EEPROMs. Similarly, data read out from the EEPROMs are temporarily recorded in the buffer memory and are subsequently output to an external unit. Even with the EEPROMs, it seems that this memory card can be used in the same manner as a memory card using an SRAM, when viewed from the outside of the card.
摘要翻译：使用EEPROM作为半导体存储器的存储卡装置。外部输入数据临时记录在缓冲存储器中，随后写入EEPROM。在缓冲存储器和EEPROM之间自动执行验证处理。类似地，从EEPROM读出的数据被临时记录在缓冲存储器中，随后被输出到外部单元。即使使用EEPROM，当从卡的外部观察时，似乎该存储卡可以以与使用SRAM的存储卡相同的方式使用。

4. 发明申请

US20050057901A1 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof 失效
标题翻译：逆变器装置及其装置的制造方法以及其逆变器装置的电动汽车
公开(公告)号：US20050057901A1
公开(公告)日：2005-03-17
申请号：US10813444
申请日：2004-03-31
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
IPC分类号： H01L23/373 , H01L25/07 , H01L25/18 , H02M7/48 , H02M7/5387
CPC分类号： H02M7/003 , H01L25/18 , H01L2224/49111 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , Y10T29/49002 , Y10T29/4902 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261 , H01L2924/00
摘要： By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.
摘要翻译：通过提供并联连接并构成逆变器的一个臂的多个半导体芯片; 连接所述多个半导体芯片的一侧的面的第一导体; 所述多个半导体芯片的另一侧的面连接的宽导体; 连接到所述宽导体的第二导体; 以及通过绝缘树脂片将所述第一导体和第二导体连接到的冷却器，半导体芯片中产生的热损失的一部分被热传导到第一导体，并且然后被热传导到冷却器，产生冷却，而另一个其一部分被热传导到宽导体，然后被传导到第二导体，由此被传导到冷却器，从而产生冷却。

5. 发明授权

US5745912A Memory card apparatus including a link table for managing the correspondency between the recorded contents in the memory card and that in the link table 失效
标题翻译：存储卡装置，包括用于管理存储卡中记录的内容与链接表中的记录内容之间的对应关系的链接表
公开(公告)号：US5745912A
公开(公告)日：1998-04-28
申请号：US704354
申请日：1996-08-28
申请人： Kazuo Konishi , Shimpei Yoshioka , Koji Maruyama , Tomoyuki Maekawa , Toshiaki Sato
发明人： Kazuo Konishi , Shimpei Yoshioka , Koji Maruyama , Tomoyuki Maekawa , Toshiaki Sato
IPC分类号： G06K7/00 , G06K19/07 , G06K19/073 , G07F7/10 , H04N1/21 , G06F12/16
CPC分类号： H04N1/2112 , G06K19/07 , G06K7/0008 , G06Q20/341 , G07F7/082 , G07F7/1008 , H04N1/2158 , H04N2101/00
摘要： A memory card apparatus has an EEPROM as a semiconductor memory. Each time data is written in the EEPROM, link data representing a recording location of the data is written and managed in a link table. The link table has a flag region with a flag which is set when data write in the EEPROM is requested and is reset when the link data has completely been written in the link table. In case of card removal during operation or power failure, the flag set in the flag region of the link table is not reset and remains. Thus, by checking the flag area of the link table, the occurrence of card removal during operation or power failure can be detected, and various countermeasures can be conducted. Thus, the correspondency between the recorded contents in the EEPROM and the contents in the link table can be maintained as much as possible.
摘要翻译：存储卡装置具有作为半导体存储器的EEPROM。每当将数据写入EEPROM时，表示数据的记录位置的链接数据在链接表中被写入和管理。链接表具有带有标志的标记区域，当在EEPROM中写入数据时被设置，并且当链接数据已被完全写入链接表时被复位。在操作或电源故障时卡删除的情况下，设置在链接表的标志区域中的标志不会复位并保留。因此，通过检查链接表的标志区域，可以检测到在操作或电源故障期间卡的移除的发生，并且可以进行各种对策。因此，可以尽可能地保持EEPROM中记录的内容与链接表中的内容之间的对应关系。

6. 发明授权

US5483491A Memory card device 失效
标题翻译：存储卡设备
公开(公告)号：US5483491A
公开(公告)日：1996-01-09
申请号：US211635
申请日：1994-04-08
申请人： Shimpei Yoshioka , Kazuo Konishi , Koji Maruyama , Toshiaki Sato
发明人： Shimpei Yoshioka , Kazuo Konishi , Koji Maruyama , Toshiaki Sato
IPC分类号： G06F12/16 , G06F3/08 , G06K19/07 , G11C5/00 , G11C16/02 , G11C17/00 , G11C29/00 , G11C11/40
CPC分类号： G11C29/76
摘要： The present invention relates to a memory card apparatus. When one of blocks of a data area of an EEPROM is detected as a defective block, a save area is searched for a vacant block, and data, which is to be written to the defective block, is written to the vacant block of the data area. When the save area is occupied and one of blocks of the data area is detected as a defective block, the data area is searched for a vacant block, and data, which is to be written to the defective block, is written to the vacant block of the data area. When a block of the data area is used for saving the defective block and a vacant block is generated in the save area by erasing data, data of the block of the data area used for saving the defective block is transferred to the vacant block.
摘要翻译： PCT No.PCT / JP92 / 01565 Sec。 371日期1994年4月8日 102（e）日期1994年4月8日PCT提交于1992年11月30日PCT公布。 WO / 9311491 PCT出版物日期：1993年6月10日。存储卡装置技术领域本发明涉及一种存储卡装置。当检测到EEPROM的数据区块中的一个块作为缺陷块时，搜索空闲块的保存区域，并且要写入缺陷块的数据被写入数据的空闲块区。当保存区域被占用并且数据区域的块中的一个被检测为缺陷块时，搜索数据区域的空闲块，并且要写入缺陷块的数据被写入空闲块的数据区。当通过擦除数据将数据区块用于保存缺陷块并在保存区域中产生空闲块时，用于保存缺陷块的数据区块的数据被传送到空块。

7. 发明申请

US20090079046A1 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US20090079046A1
公开(公告)日：2009-03-26
申请号：US12237639
申请日：2008-09-25
申请人： Shimpei YOSHIOKA , Naotake WATANABE
发明人： Shimpei YOSHIOKA , Naotake WATANABE
IPC分类号： H01L23/495 , H01L21/60
CPC分类号： H01L23/492 , H01L23/051 , H01L2924/0002 , H01L2924/01079 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： A semiconductor package includes a semiconductor device having a first main surface and a second main surface, a first electrode plate provided on the first main surface, a second electrode plate provided on the second main surface, and a wiring substrate provided between the semiconductor device and the first electrode plate, in which a plurality of opening portions in the side surface of a protruding portion provided on the first electrode plate are engaged respectively with a plurality of engaging portions which face the opening portions and which are provided on the inner side surface of an intrusion opening portion in the wiring substrate into which the protruding portion is intruded.
摘要翻译：半导体封装包括具有第一主表面和第二主表面的半导体器件，设置在第一主表面上的第一电极板，设置在第二主表面上的第二电极板，以及设置在半导体器件和第一电极板，其中设置在第一电极板上的突出部分的侧表面中的多个开口部分分别与面对开口部分的多个接合部分接合，并且设置在第一电极板的内侧表面上所述布线基板中的入射开口部分突出部分被插入其中。

8. 发明申请

US20070165383A1 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof 失效
标题翻译：逆变器装置及其装置的制造方法以及其逆变器装置的电动汽车
公开(公告)号：US20070165383A1
公开(公告)日：2007-07-19
申请号：US11723826
申请日：2007-03-22
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L25/18 , H01L2224/49111 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , Y10T29/49002 , Y10T29/4902 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261 , H01L2924/00
摘要： By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.
摘要翻译：通过提供并联连接并构成逆变器的一个臂的多个半导体芯片; 连接所述多个半导体芯片的一侧的面的第一导体; 所述多个半导体芯片的另一侧的面连接的宽导体; 连接到所述宽导体的第二导体; 以及通过绝缘树脂片将所述第一导体和第二导体连接到的冷却器，半导体芯片中产生的热损失的一部分被热传导到第一导体，并且被热传导到冷却器，产生冷却，而另一个其一部分被热传导到宽导体，然后被传导到第二导体，由此被传导到冷却器，从而产生冷却。

9. 发明授权

US6161195A EEPROM memory card device having defect relieving means 失效
标题翻译：具有缺陷消除装置的EEPROM存储卡装置
公开(公告)号：US6161195A
公开(公告)日：2000-12-12
申请号：US57805
申请日：1993-05-07
申请人： Kazuo Konishi , Shimpei Yoshioka , Koji Maruyama , Tomoyuki Maekawa , Toshiaki Sato
发明人： Kazuo Konishi , Shimpei Yoshioka , Koji Maruyama , Tomoyuki Maekawa , Toshiaki Sato
IPC分类号： G11C29/00 , G06F11/00
CPC分类号： G11C29/765
摘要： This invention provides a memory card device using an EEPROM as a semiconductor memory. When a data write-in defective area is detected in the storage area of the EEPROM, a space area is retrieved from the storage area of the EEPROM as a relieving area and data to be written into the data write-in defective area is written into the relieving area. Then, when the relieving area becomes full and a data write-in defective area is detected in the storage area of the EEPROM, another space area is retrieved from the storage area of the EEPROM as a new relieving area and data to be written into the data write-in defective area is written into the new relieving area.
摘要翻译：本发明提供一种使用EEPROM作为半导体存储器的存储卡装置。当在EEPROM的存储区域中检测到数据写入缺陷区域时，从EEPROM的存储区域检索空间区域作为缓和区域，写入数据写入缺陷区域的数据被写入缓解区域。然后，当缓存区域变满并且在EEPROM的存储区域中检测到数据写入缺陷区域时，从EEPROM的存储区域检索另一个空间区域作为新的缓冲区域和要写入到EEPROM的数据数据写入缺陷区域被写入新的缓解区域。

10. 发明授权

US07487581B2 Method of manufacturing an inverter device 失效
标题翻译：制造逆变器装置的方法
公开(公告)号：US07487581B2
公开(公告)日：2009-02-10
申请号：US11723826
申请日：2007-03-22
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
IPC分类号： H01F7/06
CPC分类号： H02M7/003 , H01L25/18 , H01L2224/49111 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , Y10T29/49002 , Y10T29/4902 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261 , H01L2924/00
摘要： By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor said first conductor and second conductor are connected connected to said wide conductor; and a cooler to which through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.
摘要翻译：通过提供并联连接并构成逆变器的一个臂的多个半导体芯片; 连接所述多个半导体芯片的一侧的面的第一导体; 所述多个半导体芯片的另一侧的面连接的宽导体; 第二导体，所述第一导体和第二导体连接到所述宽导体; 以及冷却器，通过绝缘树脂片将半导体芯片中产生的热损失的一部分热传导到第一导体，然后热传导到冷却器，产生冷却，而另一部分被热传导到宽导体，然后连接到第二导体，从而将其传导到冷却器，产生冷却。

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