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1. 发明授权

US06742561B2 Apparatus for die bonding 有权
标题翻译：用于芯片焊接的装置
公开(公告)号：US06742561B2
公开(公告)日：2004-06-01
申请号：US10116786
申请日：2002-04-04
申请人： Shi Baek Nam , Dong Kuk Kim
发明人： Shi Baek Nam , Dong Kuk Kim
IPC分类号： H01L2144
CPC分类号： H01L24/32 , H01L23/49513 , H01L23/49562 , H01L23/49575 , H01L24/29 , H01L24/75 , H01L24/83 , H01L2224/29083 , H01L2224/2919 , H01L2224/32013 , H01L2224/32225 , H01L2224/83101 , H01L2224/83192 , H01L2224/8385 , H01L2924/01004 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , Y10S414/141 , Y10T29/41 , Y10T29/49121 , Y10T29/53178 , Y10T156/1077 , Y10T156/1093 , Y10T156/1097 , Y10T156/1098 , Y10T156/133 , Y10T156/1339 , Y10T156/1751 , Y10T156/1778 , H01L2924/00 , H01L2924/01026 , H01L2924/01028 , H01L2924/3512
摘要： The present invention provides an apparatus for bonding a semiconductor chip to substrate using a non-conductive adhesive tape. The non-conductive adhesive tape may be a polyimide tape. The apparatus may include a tape provider having a reel on which the non-adhesive tape may be spooled, rollers, and a tape cutter which cuts the tape to a suitable size. A tape holder and a tape presser may also be provided to hold the tape in place while the tape cutter cuts the tape. A tape pick-up tool may be provided to transfer the cut tape to a die bonding area on the substrate. The tape holder and the tape pick-up tool may include a suction opening for providing a suction force. The apparatus may further include a die pick up tool for transferring a semiconductor chip from a semiconductor chip provider to the adhesive tape affixed to the substrate.
摘要翻译：本发明提供一种使用非导电性胶带将半导体芯片与基板接合的装置。非导电胶带可以是聚酰亚胺胶带。该设备可以包括具有卷轴的带式供应器，非卷材上的非胶带，辊子以及将胶带切割成合适尺寸的带切割器。还可以提供带固定器和带式压带器，以在带切割器切割带时将带保持在适当位置。可以提供带拾取工具以将切割的带传送到基板上的芯片粘合区域。带固定器和拾取工具可以包括用于提供抽吸力的抽吸开口。该装置还可以包括用于将半导体芯片从半导体芯片提供器传送到固定到基板的粘合带的芯片拾取工具。

2. 发明申请

US20050104168A1 Molded leadless package having improved reliability and high thermal transferability, and sawing type molded leadless package and method of manufacturing the same 有权
标题翻译：具有改善的可靠性和高的热转印性的成型无引线封装，以及锯切型模制无引线封装及其制造方法
公开(公告)号：US20050104168A1
公开(公告)日：2005-05-19
申请号：US10987550
申请日：2004-11-12
申请人： Yoon-hwa Choi , Shi-baek Nam , O-seob Jeon , Rajeev Joshi , Maria Estacio
发明人： Yoon-hwa Choi , Shi-baek Nam , O-seob Jeon , Rajeev Joshi , Maria Estacio
IPC分类号： H01L23/31 , H01L23/433 , H01L23/495
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/315 , H01L23/49568 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/351 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided are a molded leadless package, and a sawing type molded leadless package and method of manufacturing same. The molded leadless package includes a lead frame pad having first and second surfaces opposite to each other. A semiconductor chip is adhered to the first surface of the lead frame pad. A lead is electrically coupled to the semiconductor chip. A molding material covers the lead frame pad, the semiconductor chip, and the lead and exposes a portion of the lead and a portion of the second surface of the lead frame pad. A step difference is formed between a surface of the molding material covering the second surface of the lead frame pad and the second surface of the lead frame pad itself. The sawing type molded leadless package includes a short-circuit preventing member that is post-shaped or convex, and protruding from the lower surface of the die pad.
摘要翻译：提供了一种模制无引线封装和锯切型模制无引线封装及其制造方法。模制的无引线封装包括具有彼此相对的第一和第二表面的引线框架焊盘。半导体芯片粘附到引线框架焊盘的第一表面。引线电耦合到半导体芯片。模制材料覆盖引线框架焊盘，半导体芯片和引线，并且暴露引线的一部分和引线框架焊盘的第二表面的一部分。在覆盖引线框架焊盘的第二表面的成型材料的表面与引线框架焊盘本身的第二表面之间形成台阶差。锯切型成型无引线封装包括后形状或凸形并从管芯焊盘的下表面突出的防短路部件。

3. 发明授权

US06756689B2 Power device having multi-chip package structure 有权
标题翻译：功率器件具有多芯片封装结构
公开(公告)号：US06756689B2
公开(公告)日：2004-06-29
申请号：US10337872
申请日：2003-01-08
申请人： Shi-baek Nam , O-seob Jun
发明人： Shi-baek Nam , O-seob Jun
IPC分类号： H01L2314
CPC分类号： H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/49111 , H01L2224/73265 , H01L2924/01006 , H01L2924/01012 , H01L2924/01023 , H01L2924/01039 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： A power device having a multi-chip package structure and a manufacturing method therefor are provided. In the power device, a transistor, which is a switching device, and a control integrated circuit (IC) chip, which is a driving device, are mounted together in a package, thereby requiring a high insulation withstand voltage between the transistor chip and the control IC chip. The power device and the manufacturing method can simplify a packaging process by attaching the control IC chip on a chip pad of a lead frame using an insulating adhesive tape at a level with the transistor chip. Furthermore, the overall size of a package in the power device can be reduced by attaching the control IC chip on top of the transistor chip using the insulating adhesive tape. In the case of attaching the control IC chip on the top of the transistor chip, a liquid non-conductive adhesive can be used instead of an insulating adhesive tape.
摘要翻译：提供一种具有多芯片封装结构的功率器件及其制造方法。在功率器件中，作为开关器件的晶体管和作为驱动器件的控制集成电路（IC）芯片一起安装在封装中，从而在晶体管芯片和晶体管芯片之间需要高绝缘耐受电压控制IC芯片。功率器件和制造方法可以通过使用绝缘胶带将控制IC芯片附接到引线框架的芯片焊盘上而与晶体管芯片处于一个级别来简化封装处理。此外，通过使用绝缘胶带将控制IC芯片安装在晶体管芯片的顶部上，可以减小功率器件中的封装的总体尺寸。在将控制IC芯片安装在晶体管芯片的顶部的情况下，可以使用液体不导电粘合剂代替绝缘胶带。

4. 发明授权

US5965947A Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads 失效
标题翻译：半导体封装的结构，其包括与导电粘合剂的芯片焊盘接合的芯片和与包含绝缘珠的非导电粘合剂粘合的芯片
公开(公告)号：US5965947A
公开(公告)日：1999-10-12
申请号：US914270
申请日：1997-08-19
申请人： Shi-baek Nam , Seung-kon Mok , Dae-hoon Kwon
发明人： Shi-baek Nam , Seung-kon Mok , Dae-hoon Kwon
IPC分类号： H01L23/52 , H01L21/52 , H01L21/58 , H01L21/60 , H01L25/07 , H01L25/18 , H01L23/34 , H01L23/28
CPC分类号： H01L24/83 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/06134 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/83136 , H01L2224/8319 , H01L2224/8385 , H01L2224/92247 , H01L24/45 , H01L24/73 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/10253 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181
摘要： In a semiconductor package which includes a plurality of semiconductor chips of different kinds, some of the chips are bonded to die bonding pad by means of a conductive adhesive, while the other chips are bonded by means of a non-conductive adhesive that contains highly insulating beads. Encapsulation of the package is by a molding compound. A nitride film or an organic insulating film is disposed on a back side of the chips bonded by the non-conductive adhesive to improve the withstand voltage between these chips and the die pad.
摘要翻译：在包括多种不同种类的半导体芯片的半导体封装中，一些芯片通过导电粘合剂粘合到芯片接合焊盘，而其它芯片通过非导电粘合剂粘合，该非导电粘合剂包含高度绝缘珠子包装的封装是通过模塑料。氮化物膜或有机绝缘膜设置在通过非导电粘合剂粘合的芯片的背面，以提高这些芯片与芯片焊盘之间的耐受电压。

5. 发明授权

US6025651A Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads 失效
标题翻译：使用环氧树脂模制复合垫的半导体封装结构和制造环氧树脂模塑复合垫的方法
公开(公告)号：US6025651A
公开(公告)日：2000-02-15
申请号：US90861
申请日：1998-06-05
申请人： Shi-baek Nam
发明人： Shi-baek Nam
IPC分类号： H01L25/07 , H01L21/48 , H01L21/56 , H01L23/495 , H01L25/18 , H01L23/34 , H01L23/29
CPC分类号： H01L24/32 , H01L21/4803 , H01L23/49506 , H01L23/49513 , H01L2224/2919 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48137 , H01L2224/73257 , H01L2224/73265 , H01L2224/83136 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181
摘要： A semiconductor package has a controlling IC attached to a die pad using an epoxy molding compound (EMC) pad. The EMC pad is formed so as to be slightly larger than the controlling IC. EMC pads are cut from an EMC pad pattern which is formed from a predetermined number of EMC tablets. The EMC pad pattern is molded by heating and pressing the EMC tablets into a wafer shape having a thickness of approximately 0.3 mm and a diameter of approximately 100 mm. Such a thin EMC pad is capable of providing sufficient dielectric strength, and allows for manufacturing of semiconductor packages at lower cost. In addition, conventional equipment can be used to fabricate the semiconductor packages. The packages are flexible, and even a thin package is not easily broken.
摘要翻译：半导体封装具有使用环氧树脂模塑复合（EMC）焊盘附接到管芯焊盘的控制IC。 EMC焊盘形成为比控制IC略大。 EMC垫片是从预定数量的EMC平板电脑形成的EMC焊盘图案切割出来的。通过将EMC片加热并压制成厚度为约0.3mm，直径为约100mm的晶片形状来模制EMC焊盘图案。这种薄的EMC焊盘能够提供足够的介电强度，并允许以较低成本制造半导体封装。此外，常规设备可用于制造半导体封装。包装是灵活的，甚至薄包装也不容易破损。

6. 发明申请

US20070181984A1 SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS 审中-公开
标题翻译：适用于高压应用的半导体封装
公开(公告)号：US20070181984A1
公开(公告)日：2007-08-09
申请号：US11695794
申请日：2007-04-03
申请人： Joon-seo Son , Shi-baek Nam , O-seob Jeon
发明人： Joon-seo Son , Shi-baek Nam , O-seob Jeon
IPC分类号： H01L23/495
CPC分类号： H01L23/49562 , H01L23/3107 , H01L2924/0002 , H01L2924/13091 , H01L2924/1815 , H01L2924/00
摘要： A semiconductor package has a structure in which a leadframe pad to which a semiconductor die is attached and inner leads electrically connected to the leadframe pad are covered by a molded housing, and outer leads extending from the inner leads protrude from a side surface of the molded housing to the outside. The outer leads include a first outer lead disposed in a central portion of the molded housing, second and third outer leads respectively disposed in a right and left of the first outer lead. The second and third outer leads each have bent portions in portions where they are adjacent to the side surface of the molded housing, the bent portions protruding to increase a space between the first outer lead and the bent portions in the molded housing. At least one of the bent portions of the second and third outer leads is covered by an extended portion of the molded housing.
摘要翻译：半导体封装具有其中附接有半导体管芯的引线框焊盘和与引线框垫片电连接的内部引线被模制壳体覆盖的结构，并且从内部引线延伸的外部引线从模制的侧表面突出住房到外面。外引线包括设置在模制壳体的中心部分中的第一外引线，分别设置在第一外引线的左右的第二外引线和第三外引线。第二和第三外引线各自具有与模制壳体的侧表面相邻的部分的弯曲部分，弯曲部分突出以增加模制壳体中的第一外引线和弯曲部分之间的空间。第二和第三外部引线的至少一个弯曲部分被模制外壳的延伸部分覆盖。

7. 发明授权

US07315077B2 Molded leadless package having a partially exposed lead frame pad 有权
标题翻译：模制无引线封装，具有部分露出的引线框架焊盘
公开(公告)号：US07315077B2
公开(公告)日：2008-01-01
申请号：US10987550
申请日：2004-11-12
申请人： Yoon-hwa Choi , Shi-baek Nam , O-seob Jeon , Rajeev Dinkar Joshi , Maria Cristina B. Estacio
发明人： Yoon-hwa Choi , Shi-baek Nam , O-seob Jeon , Rajeev Dinkar Joshi , Maria Cristina B. Estacio
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L23/3107 , H01L23/315 , H01L23/49568 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05554 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/351 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided are a molded leadless package, and a sawing type molded leadless package and method of manufacturing same. The molded leadless package includes a lead frame pad having first and second surfaces opposite to each other. A semiconductor chip is adhered to the first surface of the lead frame pad. A lead is electrically coupled to the semiconductor chip. A molding material covers the lead frame pad, the semiconductor chip, and the lead and exposes a portion of the lead and a portion of the second surface of the lead frame pad. A step difference is formed between a surface of the molding material covering the second surface of the lead frame pad and the second surface of the lead frame pad itself. The sawing type molded leadless package includes a short-circuit preventing member that is post-shaped or convex, and protruding from the lower surface of the die pad.
摘要翻译：提供了一种模制无引线封装和锯切型模制无引线封装及其制造方法。模制的无引线封装包括具有彼此相对的第一和第二表面的引线框架焊盘。半导体芯片粘附到引线框架焊盘的第一表面。引线电耦合到半导体芯片。模制材料覆盖引线框架焊盘，半导体芯片和引线，并且暴露引线的一部分和引线框架焊盘的第二表面的一部分。在覆盖引线框架焊盘的第二表面的成型材料的表面与引线框架焊盘本身的第二表面之间形成台阶差。锯切型成型无引线封装包括后形状或凸形并从管芯焊盘的下表面突出的防短路部件。

8. 发明授权

US07199461B2 Semiconductor package suitable for high voltage applications 有权
标题翻译：半导体封装适用于高压应用
公开(公告)号：US07199461B2
公开(公告)日：2007-04-03
申请号：US10762075
申请日：2004-01-21
申请人： Joon-seo Son , Shi-baek Nam , O-seob Jeon
发明人： Joon-seo Son , Shi-baek Nam , O-seob Jeon
IPC分类号： H01L23/52 , H01L23/495 , H05K7/20
CPC分类号： H01L23/49562 , H01L23/3107 , H01L2924/0002 , H01L2924/13091 , H01L2924/1815 , H01L2924/00
摘要： A semiconductor package has a structure in which a leadframe pad to which a semiconductor die is attached and inner leads electrically connected to the leadframe pad are covered by a molded housing, and outer leads extending from the inner leads protrude from a side surface of the molded housing to the outside. The outer leads include a first outer lead disposed in a central portion of the molded housing, second and third outer leads respectively disposed in a right and left of the first outer lead. The second and third outer leads each have bent portions in portions where they are adjacent to the side surface of the molded housing, the bent portions protruding to increase a space between the first outer lead and the bent portions in the molded housing. At least one of the bent portions of the second and third outer leads is covered by an extended portion of the molded housing.
摘要翻译：半导体封装具有其中附接有半导体管芯的引线框焊盘和与引线框垫片电连接的内部引线被模制壳体覆盖的结构，并且从内部引线延伸的外部引线从模制的侧表面突出住房到外面。外引线包括设置在模制壳体的中心部分中的第一外引线，分别设置在第一外引线的左右的第二外引线和第三外引线。第二和第三外引线各自具有与模制壳体的侧表面相邻的部分的弯曲部分，弯曲部分突出以增加模制壳体中的第一外引线和弯曲部分之间的空间。第二和第三外部引线的至少一个弯曲部分被模制外壳的延伸部分覆盖。

9. 发明授权

US06621152B2 Thin, small-sized power semiconductor package 有权
公开(公告)号：US06621152B2
公开(公告)日：2003-09-16
申请号：US09896120
申请日：2001-07-02
申请人： Yoon-hwa Choi , Shi-baek Nam
发明人： Yoon-hwa Choi , Shi-baek Nam
IPC分类号： H01L2302
CPC分类号： H01L24/73 , H01L23/3107 , H01L23/49551 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05571 , H01L2224/05573 , H01L2224/16245 , H01L2224/29007 , H01L2224/29111 , H01L2224/29139 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73207 , H01L2224/73257 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/181 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2224/05599 , H01L2924/00012
摘要： A power semiconductor package is provided. The power semiconductor package includes a chip, leads, conductive media, and a molding material. The leads have a groove in the shape of a hemisphere or a down-set. The package further includes an adhesive. The package can increase solder joint reliability and thermal performance. Also, the size of the package can be reduced, and sawing can be performed so that a burr does not occur.

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