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1. 发明申请

US20120107575A1 TOUCH PANEL HAVING A SEAMLESS OUTER SURFACE AND ITS MANUFACTURING METHOD 审中-公开
标题翻译：具有无缝外表面的触控面板及其制造方法
公开(公告)号：US20120107575A1
公开(公告)日：2012-05-03
申请号：US13282542
申请日：2011-10-27
申请人： SHENG-HUNG YI
发明人： SHENG-HUNG YI
IPC分类号： B32B3/00 , H01H11/00
CPC分类号： G06F3/041 , G06F1/1626 , G06F2203/04103 , Y10T29/49105 , Y10T428/24802
摘要： A touch panel having a seamless outer surface and its manufacturing method are disclosed. The method includes: binding step, placing step, and placing step. Provide a film and a shell. This film has a decorated area and a non-decorated area. Bond this film onto the shell to form an exterior seamless structure. Providing a touch panel and a screen displaying portion, place them together so as to form an internal structure. Finally, place the internal structure into a hollow area of the exterior seamless structure with glue for expelling any air clearance so that the exterior seamless structure and the internal structure are combined as a final product. It has a smooth surface with less shrinkage and is good for decoration. It can reduce thickness significantly. Light transmittance at hollow area is relatively larger. Plus, the sensitivity of the touch panel will perform a better response.
摘要翻译：公开了具有无缝外表面的触摸面板及其制造方法。该方法包括：结合步骤，放置步骤和放置步骤。提供电影和外壳。这部电影有装饰区和非装饰区。将该胶片粘贴到外壳上以形成外部无缝结构。提供触摸面板和屏幕显示部分，将它们放在一起以形成内部结构。最后，将内部结构放入外部无缝结构的中空区域，用胶水排出任何空气间隙，使外部无缝结构和内部结构结合成最终产品。它具有光滑的表面，收缩率较小，适合装饰。它可以显着降低厚度。中空区域的透光率相对较大。此外，触摸屏的灵敏度将会更好的响应。

2. 发明申请

US20110278050A1 NON-DELETERIOUS TECHNIQUE FOR CREATING CONTINUOUS CONDUCTIVE CIRCUITS UPON THE SURFACES OF A NON-CONDUCTIVE SUBSTRATE 有权
标题翻译：用于在非导电基板的表面上创建连续导电电路的非永久性技术
公开(公告)号：US20110278050A1
公开(公告)日：2011-11-17
申请号：US13035531
申请日：2011-02-25
申请人： SHENG-HUNG YI , PEN-YI LIAO
发明人： SHENG-HUNG YI , PEN-YI LIAO
IPC分类号： H05K1/03 , H05K3/06 , H05K1/09
CPC分类号： H05K3/188 , C25D5/02 , C25D5/10 , H05K3/027 , H05K3/185 , H05K3/24 , H05K2203/107 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156
摘要： A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.
摘要翻译：在非导电衬底上制造连续导电电路的非有害方法可以开始于在非导电衬底的表面上施加金属基底层。可以基于电路设计在金属基底层内形成电路图案。包括电路图案的金属基层可以与非导电基底上的金属基底层的其余部分物理分离。包围电路图案的非导电性基板表面的区域可以称为电镀区域。非导电性基板表面的其余部分可以称为非电镀区域。可以在金属基底层上添加第一金属层。可以在电镀区域的第一金属层上添加第二金属层。第二金属层可以导电并限制在非电镀区域的第一金属层上的形成。

3. 发明申请

US20100215938A1 METHOD OF SELECTIVE PLASTIC INSERT MOLDING ON METAL COMPONENT 审中-公开
标题翻译：金属部件选择性塑料插件成型方法
公开(公告)号：US20100215938A1
公开(公告)日：2010-08-26
申请号：US12706176
申请日：2010-02-16
申请人： Shaupoh WANG , Sheng-Hung YI , Yi-Chung SU
发明人： Shaupoh WANG , Sheng-Hung YI , Yi-Chung SU
IPC分类号： B32B7/08
CPC分类号： B29C45/14311 , B29C45/14778 , B29C2045/14327 , B29K2705/00 , B29L2031/3437 , H04M1/026 , Y10T428/249923
摘要： This invention discloses a method of selective plastic insert molding on metal component and its product. A metal joint component is bonded with a metal component. After which, the joint component is submerged in plastic so that the molded plastic can be secured on the metal component firmly. Hence, a desired plastic structure can be formed on the metal component. This invention can shorten the manufacturing process and reduce the cost. In addition, it solves the traditional bonding problem between the plastic and the metal component as well as the problem concerning processing time and high cost.
摘要翻译：本发明公开了一种金属部件及其制品的选择性塑料插入成型方法。金属接头部件与金属部件接合。此后，将接头部件浸没在塑料中，使得模制塑料可以牢固地固定在金属部件上。因此，可以在金属部件上形成期望的塑性结构。本发明可以缩短制造过程并降低成本。此外，它解决了塑料和金属部件之间的传统粘合问题以及加工时间和成本高的问题。

4. 发明申请

US20120217145A1 CAPACITIVE TOUCH SENSITIVE HOUSING AND METHOD FOR MAKING THE SAME 有权
标题翻译：电容敏感触摸屏及其制作方法
公开(公告)号：US20120217145A1
公开(公告)日：2012-08-30
申请号：US13285219
申请日：2011-10-31
申请人： Sheng-Hung YI , Pen-Yi LIAO
发明人： Sheng-Hung YI , Pen-Yi LIAO
IPC分类号： H01H13/705 , H01H11/00
CPC分类号： H03K17/962 , G06F3/03547 , G06F3/044 , G06F2203/0339 , H03K2017/9602 , H03K2217/960755
摘要： A capacitive touch sensitive housing comprises: a housing wall; an array of capacitive touch sensor pads formed on the housing wall; a plurality of conductive bonding pads formed on the housing wall; and a plurality of conductive lines formed on the housing wall. Each conductive line extends from a respective one of the touch sensor pads to a respective one of the bonding pads and cooperates with the respective one of the capacitive touch sensor pads and the respective one of the bonding pads to define a touch sensor unit having a layered structure including an active metal layer and an electroless deposited metal layer. The active metal layer contains an active metal capable of initiating electroless deposition.
摘要翻译：一种电容式触敏壳体，包括：壳体壁; 形成在壳体壁上的电容式触摸传感器焊盘阵列; 形成在所述壳体壁上的多个导电接合焊盘; 以及形成在壳体壁上的多条导线。每个导电线从相应的一个触摸传感器焊盘延伸到相应的一个接合焊盘，并且与电容式触摸传感器焊盘和相应的一个接合焊盘相应的一个配合以限定具有分层的触摸传感器单元包括活性金属层和无电沉积金属层的结构。活性金属层含有能够引发无电沉积的活性金属。

5. 发明申请

US20120273261A1 CIRCUIT SUBSTRATE HAVING A CIRCUIT PATTERN AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：具有电路图案的电路基板及其制造方法
公开(公告)号：US20120273261A1
公开(公告)日：2012-11-01
申请号：US13547494
申请日：2012-07-12
申请人： Sheng-Hung YI , Pen-Yi LIAO
发明人： Sheng-Hung YI , Pen-Yi LIAO
IPC分类号： H05K1/09 , H05K1/03 , H05K3/10 , H05K1/02
CPC分类号： H05K3/0026 , B23K26/362 , B23K26/364 , B23K26/402 , B23K2101/34 , B23K2101/40 , B23K2103/50 , B23K2103/56 , C23C18/1603 , C23C18/1653 , C23C18/1689 , C23C18/2013 , C25D3/12 , C25D3/38 , C25D3/46 , C25D3/48 , C25D5/02 , C25D5/54 , C25D7/12 , C25F5/00 , H05K3/0041 , H05K3/027 , H05K3/067 , H05K3/107 , H05K3/185 , H05K3/24 , H05K3/4661 , H05K2201/09036 , H05K2201/09363 , H05K2203/0392 , H05K2203/107 , Y10T29/49155
摘要： A circuit substrate includes: an insulative substrate formed with a pattern of a recess, the recess being defined by a recess-defining wall that has a bottom wall surface and a surrounding wall surface extending upwardly from the bottom wall surface; a patterned metallic layer structure including at least a patterned active metal layer disposed within the recess, formed on the bottom wall surface of the recess-defining wall, and spaced apart from the surrounding wall surface of the recess-defining wall, the patterned active metal layer containing an active metal capable of initiating electroless plating; and a primary metal layer plated on the patterned metallic layer structure.
摘要翻译：电路基板包括：形成有凹槽图案的绝缘基板，所述凹部由凹口限定壁限定，所述凹槽限定壁具有从所述底壁表面向上延伸的底壁表面和周围壁表面; 图案化的金属层结构，其至少包括设置在凹部内的图案化的有源金属层，形成在凹陷限定壁的底壁表面上，并且与凹陷限定壁的周围壁表面间隔开，图案化的活性金属含有能够引发化学镀的活性金属的层; 以及镀在图案化金属层结构上的主金属层。

6. 发明申请

US20120177942A1 COMPOSITE STRUCTURE AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：复合结构及其制造方法
公开(公告)号：US20120177942A1
公开(公告)日：2012-07-12
申请号：US13344796
申请日：2012-01-06
申请人： Chia-Ming CHANG , Shih-Chang YEH , Chung-Ho LIU , Sheng-Hung YI
发明人： Chia-Ming CHANG , Shih-Chang YEH , Chung-Ho LIU , Sheng-Hung YI
IPC分类号： B32B5/18 , B05D5/00 , B05D3/02
CPC分类号： H04M1/0277 , H05K5/0008 , Y10T428/12479
摘要： A composite structure for an electronic device includes: a metallic base part made from a metallic material and having at least one bonding region; at least one porous protrusion made from a sintered metal powder and bonded to and protruding from the bonding region; and at least one feature molded over the porous protrusion.
摘要翻译：一种用于电子设备的复合结构包括：由金属材料制成并具有至少一个接合区域的金属基部; 至少一个由烧结金属粉末制成的多孔突起，并且粘合并从接合区域突出; 以及模制在所述多孔突起上的至少一个特征。

7. 发明授权

US08692790B2 Capacitive touch sensitive housing and method for making the same 有权
标题翻译：电容式触控式外壳及其制作方法
公开(公告)号：US08692790B2
公开(公告)日：2014-04-08
申请号：US13285219
申请日：2011-10-31
申请人： Sheng-Hung Yi , Pen-Yi Liao
发明人： Sheng-Hung Yi , Pen-Yi Liao
IPC分类号： G06F3/041
CPC分类号： H03K17/962 , G06F3/03547 , G06F3/044 , G06F2203/0339 , H03K2017/9602 , H03K2217/960755
摘要： A capacitive touch sensitive housing comprises: a housing wall; an array of capacitive touch sensor pads formed on the housing wall; a plurality of conductive bonding pads formed on the housing wall; and a plurality of conductive lines formed on the housing wall. Each conductive line extends from a respective one of the touch sensor pads to a respective one of the bonding pads and cooperates with the respective one of the capacitive touch sensor pads and the respective one of the bonding pads to define a touch sensor unit having a layered structure including an active metal layer and an electroless deposited metal layer. The active metal layer contains an active metal capable of initiating electroless deposition.
摘要翻译：一种电容式触敏壳体，包括：壳体壁; 形成在壳体壁上的电容式触摸传感器焊盘阵列; 形成在所述壳体壁上的多个导电接合焊盘; 以及形成在壳体壁上的多条导线。每个导电线从相应的一个触摸传感器焊盘延伸到相应的一个接合焊盘，并且与电容式触摸传感器焊盘和相应的一个接合焊盘相应的一个配合以限定具有分层的触摸传感器单元包括活性金属层和无电沉积金属层的结构。活性金属层含有能够引发无电沉积的活性金属。

8. 发明申请

US20100284132A1 TOUCH PANEL MODULE AND METHOD OF MAKING THE SAME 审中-公开
标题翻译：触控面板模块及其制作方法
公开(公告)号：US20100284132A1
公开(公告)日：2010-11-11
申请号：US12776151
申请日：2010-05-07
申请人： Sheng-Hung YI , Yen-Chou Chen , Wen-Pao Yang
发明人： Sheng-Hung YI , Yen-Chou Chen , Wen-Pao Yang
IPC分类号： H05K5/00 , G06F3/044 , B29C45/14
CPC分类号： G06F3/044 , B29C45/14467 , B29C45/14639 , B29C45/14688 , B29C45/14811 , B29C2045/14696 , B29K2995/002 , B29K2995/0026 , B29L2031/3475
摘要： A touch panel module includes a capacitive touch panel and a seamless shell body. The capacitive touch panel includes a touch surface actuated by a touch action. The seamless shell body is formed by a molding material, and includes a touch portion which is transparent and a peripheral portion which is integrally formed with the touch portion, wherein the touch portion is molded to the capacitive touch panel. A method of making the touch panel module is also disclosed.
摘要翻译：触摸面板模块包括电容式触摸面板和无缝壳体。电容式触摸面板包括通过触摸动作驱动的触摸表面。无缝壳体由成型材料形成，并且包括透明的触摸部分和与触摸部分一体形成的周边部分，其中触摸部分模制到电容式触摸面板。还公开了制造触摸面板模块的方法。

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