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    • 1. 发明授权
    • Semiconductor laser diode and manufacturing method therefor
    • 半导体激光二极管及其制造方法
    • US5658823A
    • 1997-08-19
    • US359657
    • 1994-12-20
    • Seung-kee Yang
    • Seung-kee Yang
    • H01S5/00H01S5/042H01S5/20H01S5/22H01S5/223H01S5/30H01L21/020
    • H01S5/22H01S5/0425H01S5/2081H01S5/2214H01S5/2231
    • A self-align structured laser diode and manufacturing method including the steps of forming a multiple epitaxy layer including an activation layer on a semiconductor substrate; forming a rectangular ridge on a top surface of the multiple epitaxy layer; depositing a passivation layer having a predetermined thickness on the multiple epitaxy layer having the ridge; depositing a photoresist on the passivation layer; exposing the entire photoresist on the top surface of the ridge or the portion of the entire photoresist overlapping the top surface of the ridge and the upper portion of the photoresist deposited on the side surface of the ridge perpendicular to the top surface of the ridge to a predetermined depth; removing the exposed portion of the photoresist; removing the exposed passivation layer; removing the photoresist that remains in both sides of the ridge; and forming a current injection layer in the top surface of the resultant structure.
    • 一种自对准结构的激光二极管及其制造方法,包括以下步骤:在半导体衬底上形成包括激活层的多重外延层; 在所述多个外延层的顶表面上形成矩形脊; 在具有所述脊的多个外延层上沉积具有预定厚度的钝化层; 在所述钝化层上沉积光致抗蚀剂; 暴露在脊的顶表面上的整个光致抗蚀剂或者与脊的顶表面重叠的整个光致抗蚀剂的部分和沉积在垂直于脊的顶表面的脊的侧表面上的光致抗蚀剂的上部暴露于 预定深度; 去除光致抗蚀剂的暴露部分; 去除暴露的钝化层; 去除残留在脊的两侧的光致抗蚀剂; 以及在所得结构的顶表面中形成电流注入层。
    • 2. 发明授权
    • Optical apparatus using vertical light receiving element
    • 使用垂直光接收元件的光学设备
    • US06921956B2
    • 2005-07-26
    • US10671195
    • 2003-09-25
    • Seung-Kee YangByung-Ok JeonHwa-Young KangDo-Young Rhee
    • Seung-Kee YangByung-Ok JeonHwa-Young KangDo-Young Rhee
    • G02B6/42H01L31/0232
    • G02B6/4214H01S5/02236H01S5/02248H01S5/0683
    • An optical apparatus having a vertical light receiving element is disclosed. The optical apparatus is configured to couple light generated from a light source using the vertical light receiving element, then transforms the received light signals into an electric signal. The optical apparatus includes: a vertical photo detector having a photo-absorption layer; and an optical bench on which the photo detector is disposed. The optical bench having a first groove and a second groove formed adjacent to each other, the first groove having a predetermined inclination and being formed at an edge of a first surface of the optical bench, and the first surface being opposite to a second surface of the optical bench, on which the photo detector is disposed, such that a light signal incident to the first groove is refracted at a predetermined angle by the first groove; and the light signal, which has been refracted by the first groove, is totally reflected by the second groove. As a result, that the light signal is substantially and vertically incident into the photo-absorption layer.
    • 公开了具有垂直光接收元件的光学装置。 光学装置被配置为使用垂直光接收元件耦合从光源产生的光,然后将接收到的光信号转换为电信号。 光学装置包括:具有光吸收层的垂直光电检测器; 以及设置有光电检测器的光学台。 所述光学工作台具有彼此相邻形成的第一凹槽和第二凹槽,所述第一凹槽具有预定的倾斜度并且形成在所述光学平台的第一表面的边缘处,并且所述第一表面与所述第一表面的第二表面相对 设置光电检测器的光学台,使得入射到第一凹槽的光信号由第一凹槽以预定角度折射; 并且已被第一凹槽折射的光信号被第二凹槽完全反射。 结果,光信号基本上和垂直地入射到光吸收层中。
    • 3. 发明授权
    • Method for fabricating avalanche photodiode
    • 制造雪崩光电二极管的方法
    • US06492239B2
    • 2002-12-10
    • US09839930
    • 2001-04-20
    • Seung-Kee YangDong-Soo Bang
    • Seung-Kee YangDong-Soo Bang
    • H01L2120
    • H01L31/1075
    • An avalanche photodiode fabricating method with a simplified fabrication process and an improved reproducibility is disclosed. The method for fabricating an avalanche photodiode includes the steps of: (a) sequentially stacking, on an n-type InP substrate, an, InP buffer layer, an InGaAs absorption layer, an n-type InGaAsP grading layer, an n-type InP current adjusting layer, and an InP amplifying layer; (b) forming a protection layer on the InP amplifying layer, etching a light-receiving area of the protection layer and the InP amplifying layer to a predetermined depth, and partially etching the protection layer to expose a FGR forming area of the InP amplifying layer; (c) diffusing a diffusion source in the etched light-receiving area and the exposed FGR forming area; (d) forming a reflection suppressing layer on the diffusion layer formed on the light-receiving area by diffusing the diffusion source, the FGR layer and the exposed amplifying layer; (e) forming an upper electrode layer to a predetermined depth from the reflection suppressing layer to the diffusion layer formed on the light-receiving area; and, (f) forming a lower electrode layer on a back of the substrate.
    • 公开了一种具有简化的制造工艺和改进的再现性的雪崩光电二极管制造方法。 制造雪崩光电二极管的方法包括以下步骤:(a)在n型InP衬底上依次堆叠InP缓冲层,InGaAs吸收层,n型InGaAsP分级层,n型InP 电流调节层和InP放大层; (b)在InP放大层上形成保护层,将保护层的光接收区域和InP放大层蚀刻到预定深度,并部分地蚀刻保护层以暴露InP放大层的FGR形成区域 ; (c)在蚀刻的光接收区域和暴露的FGR形成区域中扩散漫射源; (d)通过扩散扩散源,FGR层和曝光的放大层,在形成在受光区上的扩散层上形成反射抑制层; (e)从形成在所述受光区域上的所述反射抑制层到所述扩散层的上部电极层形成预定深度; 和(f)在基板的背面形成下电极层。
    • 5. 发明申请
    • Light receiving element and method of manufacturing the same
    • 光接收元件及其制造方法
    • US20050145965A1
    • 2005-07-07
    • US11053488
    • 2005-02-08
    • Seung-Kee YangAhn-Goo Choo
    • Seung-Kee YangAhn-Goo Choo
    • H01L31/10G02B6/42H01L31/0232
    • H01L31/02327H01L31/02161H01L31/022408H01L31/035281Y02E10/50
    • A light receiving element for converting a received light signal into an electric signal and its manufacturing method are disclosed. The light receiving element includes a semiconductor substrate of a first conduction type; a semiconductor layer of a second conduction type; and a photo-absorption layer interposed between the semiconductor substrate and the semiconductor layer of the second conduction type. The semiconductor substrate comprises: a first groove having an inclination with respect to an incidence plane of the light signal so that the light signal can be refracted when the light signal has been incident to the first groove; and a second groove by which the light signal having been refracted by the first groove is reflected fully and then absorbed into the photo-absorption layer, so that a vertical-incidence drift of the light signal toward the photo-absorption layer is minimized.
    • 公开了一种用于将接收的光信号转换为电信号的光接收元件及其制造方法。 光接收元件包括第一导电类型的半导体衬底; 第二导电类型的半导体层; 以及插入在半导体衬底和第二导电类型的半导体层之间的光吸收层。 半导体衬底包括:相对于光信号的入射平面具有倾斜度的第一凹槽,使得当光信号已经入射到第一凹槽时,光信号可以被折射; 并且由第一凹槽折射的光信号被完全反射并随后被吸收到光吸收层中的第二凹槽,使得光信号朝向光吸收层的垂直入射漂移最小化。
    • 7. 发明授权
    • Photodiode detector and fabrication method thereof
    • 光电二极管检测器及其制造方法
    • US06780532B2
    • 2004-08-24
    • US10315586
    • 2002-12-10
    • Seung-Kee YangJea-Myung Baek
    • Seung-Kee YangJea-Myung Baek
    • B32B900
    • H01L31/0203H01L31/0735H01L31/184Y02E10/544
    • Disclosed is a photodiode detector including: an InP substrate; a u-In0.53Ga0.47As layer grown and stacked on the InP substrate; an u-Inp layer stacked on an upper portion of the u-In0.53Ga0.47As layer; a SiNx insulation layer stacked on an upper portion of u-Inp layer; an additional insulation layer stacked on an upper portion of the SiNx insulation layer; a P-InP layer formed by Zn diffusing on an u-Inp layer portion below an opening formed on a predetermined position between the additional insulation layer and the SiNx insulation layer; a P-metal layer positioned on an upper portion of the additional insulation layer; and an N-metal layer formed on a lower portion of the InP substrate together with a non-reflection layer. The photodiode detector of the present invention, forms BCB material having a low dielectric constant, which is relatively thick, on the upper portion of the SiNx insulation layer, thereby obtaining the desired capacitance.
    • 公开了一种光电二极管检测器,包括:InP衬底; 在InP衬底上生长和堆叠的u-In 0.53 Ga 0.47 As层; u-Inp层,堆叠在u-In0.53Ga0.47As层的上部; 层叠在u-Inp层的上部的SiNx绝缘层; 层叠在SiNx绝缘层的上部的附加绝缘层; 通过Zn扩散在形成在附加绝缘层和SiNx绝缘层之间的预定位置处的开口下方的u-Inp层部分上形成的P-InP层; 位于所述附加绝缘层的上部的P金属层; 以及与非反射层一起形成在InP衬底的下部的N金属层。 本发明的光电二极管检测器在SiNx绝缘层的上部形成相对厚的低介电常数的BCB材料,从而获得所需的电容。
    • 8. 发明授权
    • Semiconductor laser diode
    • 半导体激光二极管
    • US5640410A
    • 1997-06-17
    • US535933
    • 1995-09-28
    • Seung-kee Yang
    • Seung-kee Yang
    • H01S5/00H01S5/042H01S5/20H01S5/22H01S5/223H01S5/30H01S3/19
    • H01S5/22H01S5/0425H01S5/2081H01S5/2214H01S5/2231
    • A self-align structured laser diode and manufacturing method including the steps of forming a multiple epitaxy layer including an activation layer on a semiconductor substrate; forming a rectangular ridge on a top surface of the multiple epitaxy layer; depositing a passivation layer having a predetermined thickness on the multiple epitaxy layer having the ridge; depositing a photoresist on the passivation layer; exposing the entire photoresist on the top surface of the ridge or the portion of the entire photoresist overlapping the top surface of the ridge and the upper portion of the photoresist deposited on the side surface of the ridge perpendicular to the top surface of the ridge to a predetermined depth; removing the exposed portion of the photoresist; removing the exposed passivation layer; removing the photoresist that remains in both sides of the ridge; and forming a current injection layer in the top surface of the resultant structure.
    • 一种自对准结构的激光二极管及其制造方法,包括以下步骤:在半导体衬底上形成包括激活层的多重外延层; 在所述多个外延层的顶表面上形成矩形脊; 在具有所述脊的多个外延层上沉积具有预定厚度的钝化层; 在所述钝化层上沉积光致抗蚀剂; 暴露在脊的顶表面上的整个光致抗蚀剂或者与脊的顶表面重叠的整个光致抗蚀剂的部分和沉积在垂直于脊的顶表面的脊的侧表面上的光致抗蚀剂的上部暴露于 预定深度; 去除光致抗蚀剂的暴露部分; 去除暴露的钝化层; 去除残留在脊的两侧的光致抗蚀剂; 以及在所得结构的顶表面中形成电流注入层。
    • 10. 发明授权
    • Light receiving element and method of manufacturing the same
    • 光接收元件及其制造方法
    • US07161221B2
    • 2007-01-09
    • US10657371
    • 2003-09-08
    • Seung-Kee YangAhn-Goo Choo
    • Seung-Kee YangAhn-Goo Choo
    • H01L31/0232
    • H01L31/02327H01L31/02161H01L31/022408H01L31/035281Y02E10/50
    • A light receiving element for converting a received light signal into an electric signal and its manufacturing method are disclosed. The light receiving element includes a semiconductor substrate of a first conduction type; a semiconductor layer of a second conduction type; and a photo-absorption layer interposed between the semiconductor substrate and the semiconductor layer of the second conduction type. The semiconductor substrate comprises: a first groove having an inclination with respect to an incidence plane of the light signal so that the light signal can be refracted when the light signal has been incident to the first groove; and a second groove by which the light signal having been refracted by the first groove is reflected fully and then absorbed into the photo-absorption layer, so that a vertical-incidence drift of the light signal toward the photo-absorption layer is minimized.
    • 公开了一种用于将接收的光信号转换为电信号的光接收元件及其制造方法。 光接收元件包括第一导电类型的半导体衬底; 第二导电类型的半导体层; 以及插入在半导体衬底和第二导电类型的半导体层之间的光吸收层。 半导体衬底包括:相对于光信号的入射平面具有倾斜度的第一凹槽,使得当光信号已经入射到第一凹槽时,光信号可以被折射; 并且由第一凹槽折射的光信号被完全反射并随后被吸收到光吸收层中的第二凹槽,使得光信号朝向光吸收层的垂直入射漂移最小化。