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1. 发明申请

US20110267023A1 DC VOLTAGE CONVERSION MODULE, SEMICONDUCTOR MODULE, AND METHOD OF MAKING SEMICONDUCTOR MODULE 有权
标题翻译：直流电压转换模块，半导体模块和制造半导体模块的方法
公开(公告)号：US20110267023A1
公开(公告)日：2011-11-03
申请号：US12968977
申请日：2010-12-15
申请人： Gen MUTO , Seitaro MIZUHARA
发明人： Gen MUTO , Seitaro MIZUHARA
IPC分类号： G05F3/08 , H01L21/58 , H01L23/49
CPC分类号： H02M3/04 , H01L21/52 , H01L23/055 , H01L23/367 , H01L23/3677 , H01L23/373 , H01L25/16 , H01L2924/0002 , H01L2924/19105 , H02M7/003 , H01L2924/00
摘要： A DC voltage conversion module includes a substrate, an input terminal, an output terminal, a ground terminal, a DC voltage conversion control element mounted on the substrate, a coil mounted on the substrate and connected to the DC voltage conversion control element and the output terminal, an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal, and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal. The input terminal, the output terminal and the ground terminal project in a predetermined projecting direction parallel to each other. The ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction.
摘要翻译：直流电压转换模块包括基板，输入端子，输出端子，接地端子，安装在基板上的直流电压转换控制元件，安装在基板上并连接到直流电压转换控制元件和输出端的线圈端子，安装在基板上并连接到输入端子和接地端子的输入侧电容器，以及安装在基板上并连接到输出端子和接地端子的输出侧电容器。输入端子，输出端子和接地端子以相互平行的预定的突出方向突出。接地端子在垂直于突出方向的方向上布置在输入端子和输出端子之间。

2. 发明授权

US07943860B2 Material board for producing hybrid circuit board with metallic terminal plate and method for producing hybrid circuit board 有权
标题翻译：用于生产具有金属端子板的混合电路板的材料板和用于生产混合电路板的方法
公开(公告)号：US07943860B2
公开(公告)日：2011-05-17
申请号：US11663699
申请日：2005-08-09
申请人： Seitaro Mizuhara
发明人： Seitaro Mizuhara
IPC分类号： H05K1/11
CPC分类号： H01L25/162 , H01L21/4853 , H01L2924/0002 , H05K3/0052 , H05K3/305 , H05K3/3405 , H05K2201/09063 , H05K2201/0909 , H05K2201/1034 , H05K2203/0169 , Y10T29/49 , Y10T29/49117 , Y10T29/49149 , Y10T29/49155 , H01L2924/00
摘要： A material board for producing a hybrid circuit board includes a plurality of hybrid circuit board sections 1 on each of which an electronic component 2 is mounted and a metallic terminal plate 3 for external connection is bonded so as to project from the hybrid circuit board section. A frame portion 6 is defined between the hybrid circuit board sections, and the hybrid circuit board sections are integrally connected to the frame portion via a thin strip 8 provided at an intermediate portion of grooves 7 each surrounding a respective one of the hybrid circuit board sections entirely. In bonding the terminal plate 3 to the hybrid circuit board by soldering, the terminal plate is temporarily bonded to the frame portion 6 with an adhesive 9. The adhesive is prevented from spreading toward the end of the terminal plate. A hole or a recess 10 is formed in the frame portion 6 at a region with which the terminal plate 3 is to overlap and which is closer to an end of the terminal plate than a portion to which the adhesive 9 for temporarily bonding the terminal plate to the frame portion is to be applied is.
摘要翻译：用于制造混合电路板的材料板包括多个混合电路板部分1，每个混合电路板部分1安装有电子部件2，并且用于外部连接的金属端子板3从混合电路板部分突出。框架部分6限定在混合电路板部分之间，并且混合电路板部分经由设置在凹槽7的中间部分处的细条8一体地连接到框架部分，每个沟槽7围绕相应的一个混合电路板部分完全。在通过焊接将端子板3接合到混合电路板上时，端子板用粘合剂9暂时地接合到框架部分6.防止粘合剂向端子板的端部扩散。在端子板3重叠的区域处，在框架部6中形成有孔或凹部10，并且比将端子板临时接合的粘合剂9更靠近端子板的端部要施加到框架部分。

3. 发明授权

US07733668B2 Hybrid integrated circuit device and method for manufacturing same 有权
标题翻译：混合集成电路装置及其制造方法
公开(公告)号：US07733668B2
公开(公告)日：2010-06-08
申请号：US12083039
申请日：2006-10-02
申请人： Seitaro Mizuhara , Naoya Tanaka
发明人： Seitaro Mizuhara , Naoya Tanaka
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K1/141 , H01L23/49805 , H01L23/49811 , H01L25/16 , H01L2924/0002 , H05K1/145 , H05K3/0052 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09181 , H05K2201/10378 , H05K2201/2018 , Y10T29/4913 , H01L2924/00
摘要： A hybrid integrated circuit device includes: an insulating substrate (1) having a lower surface formed with wiring patterns including ends arranged along ends of the lower surface at a predetermined pitch (P); electronic components (3) mounted on the surfaces of the insulating substrate to be connected to the wiring patterns; a pair of insulating legs (2) arranged at the ends of the lower surface of the substrate (1), each insulating leg extending in parallel to the lower surface of the substrate (1); and a plurality of terminal electrodes (5) formed on each leg at the pitch and extending perpendicularly to the substrate, where the plurality of terminal electrodes are connected to the wiring patterns on the lower surface of the substrate (1). Each leg has a surface bonded to the substrate and formed with electrode films connected to the terminal electrodes. Each leg is fixed to the substrate by attaching the terminal electrodes to the wiring patterns on the lower surface of the substrate (1) by soldering or by an electroconductive paste.
摘要翻译：一种混合集成电路装置，包括：绝缘基板（1），其具有形成有布线图案的下表面，所述布线图案包括以预定间距（P）沿所述下表面的端部布置的端部; 电子部件（3），安装在所述绝缘基板的与所述布线图形连接的表面上; 布置在基板（1）的下表面的端部处的一对绝缘支脚（2），每个绝缘支脚平行于基板（1）的下表面延伸; 以及多个端子电极（5），其以间距形成在每个支脚上并垂直于基板延伸，其中多个端子电极连接到基板（1）的下表面上的布线图案。每个腿部具有与基板结合的表面，并且形成有连接到端子电极的电极膜。通过焊接或通过导电浆将端子电极附接到基板（1）的下表面上的布线图案，将每个支脚固定到基板。

4. 发明授权

US08897046B2 DC voltage conversion module, semiconductor module, and method of making semiconductor module 有权
标题翻译：直流电压转换模块，半导体模块和制造半导体模块的方法
公开(公告)号：US08897046B2
公开(公告)日：2014-11-25
申请号：US12968977
申请日：2010-12-15
申请人： Gen Muto , Seitaro Mizuhara
发明人： Gen Muto , Seitaro Mizuhara
IPC分类号： H02M1/00 , H01L23/055 , H01L25/16 , H01L23/367 , H02M7/00
CPC分类号： H02M3/04 , H01L21/52 , H01L23/055 , H01L23/367 , H01L23/3677 , H01L23/373 , H01L25/16 , H01L2924/0002 , H01L2924/19105 , H02M7/003 , H01L2924/00
摘要： A DC voltage conversion module includes a substrate, an input terminal, an output terminal, a ground terminal, a DC voltage conversion control element mounted on the substrate, a coil mounted on the substrate and connected to the DC voltage conversion control element and the output terminal, an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal, and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal. The input terminal, the output terminal and the ground terminal project in a predetermined projecting direction parallel to each other. The ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction.
摘要翻译：直流电压转换模块包括基板，输入端子，输出端子，接地端子，安装在基板上的直流电压转换控制元件，安装在基板上并连接到直流电压转换控制元件和输出端的线圈端子，安装在基板上并连接到输入端子和接地端子的输入侧电容器，以及安装在基板上并连接到输出端子和接地端子的输出侧电容器。输入端子，输出端子和接地端子以相互平行的预定的突出方向突出。接地端子在垂直于突出方向的方向上布置在输入端子和输出端子之间。

5. 发明申请

US20080278920A1 Hybrid Integrated Circuit Device and Method for Manufacturing Same 有权
标题翻译：混合集成电路装置及其制造方法
公开(公告)号：US20080278920A1
公开(公告)日：2008-11-13
申请号：US12083039
申请日：2006-10-02
申请人： Seitaro Mizuhara , Naoya Tanaka
发明人： Seitaro Mizuhara , Naoya Tanaka
IPC分类号： H05K7/00 , H05K3/30
CPC分类号： H05K1/141 , H01L23/49805 , H01L23/49811 , H01L25/16 , H01L2924/0002 , H05K1/145 , H05K3/0052 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K2201/09181 , H05K2201/10378 , H05K2201/2018 , Y10T29/4913 , H01L2924/00
摘要： A hybrid integrated circuit device includes: an insulating substrate (1) having a lower surface formed with wiring patterns including ends arranged along ends of the lower surface at a predetermined pitch (P); electronic components (3) mounted on the surfaces of the insulating substrate to be connected to the wiring patterns; a pair of insulating legs (2) arranged at the ends of the lower surface of the substrate (1), each insulating leg extending in parallel to the lower surface of the substrate (1); and a plurality of terminal electrodes (5) formed on each leg at the pitch and extending perpendicularly to the substrate, where the plurality of terminal electrodes are connected to the wiring patterns on the lower surface of the substrate (1). Each leg has a surface bonded to the substrate and formed with electrode films connected to the terminal electrodes. Each leg is fixed to the substrate by attaching the terminal electrodes to the wiring patterns on the lower surface of the substrate (1) by soldering or by an electroconductive paste.
摘要翻译：一种混合集成电路装置，包括：绝缘基板（1），其具有形成有布线图案的下表面，所述布线图案包括以预定间距（P）沿所述下表面的端部布置的端部; 电子部件（3），安装在所述绝缘基板的与所述布线图形连接的表面上; 布置在基板（1）的下表面的端部处的一对绝缘支脚（2），每个绝缘支脚平行于基板（1）的下表面延伸; 以及多个端子电极（5），其以间距形成在每个支脚上并垂直于基板延伸，其中多个端子电极连接到基板（1）的下表面上的布线图案。每个腿部具有与基板结合的表面，并且形成有连接到端子电极的电极膜。通过焊接或通过导电浆将端子电极附接到基板（1）的下表面上的布线图案，将每个支脚固定到基板。

6. 发明申请

US20080149380A1 Material Board for Producing Hybrid Circuit Board with Metallic Terminal Plate and Method for Producing Hybrid Circuit Board 有权
标题翻译：用金属端子板生产混合电路板的材料板和生产混合电路板的方法
公开(公告)号：US20080149380A1
公开(公告)日：2008-06-26
申请号：US11663699
申请日：2005-08-09
申请人： Seitaro Mizuhara
发明人： Seitaro Mizuhara
IPC分类号： H05K1/02 , H05K3/38
CPC分类号： H01L25/162 , H01L21/4853 , H01L2924/0002 , H05K3/0052 , H05K3/305 , H05K3/3405 , H05K2201/09063 , H05K2201/0909 , H05K2201/1034 , H05K2203/0169 , Y10T29/49 , Y10T29/49117 , Y10T29/49149 , Y10T29/49155 , H01L2924/00
摘要： A material board for producing a hybrid circuit board includes a plurality of hybrid circuit board sections 1 on each of which an electronic component 2 is mounted and a metallic terminal plate 3 for external connection is bonded so as to project from the hybrid circuit board section. A frame portion 6 is defined between the hybrid circuit board sections, and the hybrid circuit board sections are integrally connected to the frame portion via a thin strip 8 provided at an intermediate portion of grooves 7 each surrounding a respective one of the hybrid circuit board sections entirely. In bonding the terminal plate 3 to the hybrid circuit board by soldering, the terminal plate is temporarily bonded to the frame portion 6 with an adhesive 9. The adhesive is prevented from spreading toward the end of the terminal plate. A hole or a recess 10 is formed in the frame portion 6 at a region with which the terminal plate 3 is to overlap and which is closer to an end of the terminal plate than a portion to which the adhesive 9 for temporarily bonding the terminal plate to the frame portion is to be applied is.
摘要翻译：用于制造混合电路板的材料板包括多个混合电路板部分1，每个混合电路板部分1安装有电子部件2，并且用于外部连接的金属端子板3从混合电路板部分突出。框架部分6限定在混合电路板部分之间，并且混合电路板部分经由设置在凹槽7的中间部分处的细条8一体地连接到框架部分，每个沟槽7围绕相应的一个混合电路板部分完全。在通过焊接将端子板3接合到混合电路板上时，端子板用粘合剂9暂时地接合到框架部分6.防止粘合剂向端子板的端部扩散。在端子板3重叠的区域处，在框架部6中形成有孔或凹部10，并且比将端子板临时接合的粘合剂9更靠近端子板的端部要施加到框架部分。

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