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1. 发明授权

US08779576B2 Wafer level package and methods of fabricating the same 有权
标题翻译：晶圆级封装及其制造方法
公开(公告)号：US08779576B2
公开(公告)日：2014-07-15
申请号：US13037159
申请日：2011-02-28
申请人： Sang-wook Park , Nam-seog Kim , Seung-duk Baek
发明人： Sang-wook Park , Nam-seog Kim , Seung-duk Baek
IPC分类号： H01L23/48 , H01L23/00 , H01L23/31
CPC分类号： H01L24/02 , H01L23/3192 , H01L24/05 , H01L24/13 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/05012 , H01L2224/05548 , H01L2224/13021 , H01L2224/13022 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： In one embodiment, a wafer level package includes a rerouting pattern formed on a semiconductor substrate and a first encapsulant pattern overlying the rerouting pattern. The first encapsulant pattern has a via hole to expose a portion of the rerouting pattern. The package additionally includes an external connection terminal formed on the exposed portion of the rerouting pattern. An upper section of the sidewall and a sidewall of the external connection terminal may be separated by a gap distance. The gap distance may increase toward an upper surface of the encapsulant pattern.
摘要翻译：在一个实施例中，晶片级封装包括形成在半导体衬底上的重新布线图案和覆盖重新布线图案的第一封装图案。第一密封剂图案具有通孔以暴露重新布置图案的一部分。该封装还包括形成在重新布线图案的暴露部分上的外部连接端子。侧壁的上部和外部连接端子的侧壁可以间隔距离。间隙距离可以朝向密封剂图案的上表面增加。

2. 发明授权

US08669794B2 Circuit for detecting a voltage change using a time-to-digital converter 有权
标题翻译：用于使用时间 - 数字转换器检测电压变化的电路
公开(公告)号：US08669794B2
公开(公告)日：2014-03-11
申请号：US13401296
申请日：2012-02-21
申请人： Sang Wook Park , Ashwin Raghunathan , Marzio Pedrali-Noy
发明人： Sang Wook Park , Ashwin Raghunathan , Marzio Pedrali-Noy
IPC分类号： H03L7/06
CPC分类号： G01R19/255 , G04F10/005
摘要： A circuit for detecting a voltage change is described. The circuit includes a supply insensitive pulse generator that generates a pulse signal. The circuit also includes a time-to-digital converter coupled to the supply insensitive pulse generator. The time-to-digital converter generates a digital signal based on the pulse signal and a voltage. The circuit also includes a controller coupled to the time-to-digital converter that detects a voltage change based on the digital signal.
摘要翻译：描述用于检测电压变化的电路。电路包括产生脉冲信号的电源不敏感脉冲发生器。电路还包括耦合到不敏感脉冲发生器的时间 - 数字转换器。时间 - 数字转换器基于脉冲信号和电压产生数字信号。电路还包括耦合到时间 - 数字转换器的控制器，其基于数字信号来检测电压变化。

3. 发明授权

US08664762B2 Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package 有权
标题翻译：半导体封装，包括半导体封装的电气和电子设备以及半导体封装的制造方法
公开(公告)号：US08664762B2
公开(公告)日：2014-03-04
申请号：US13594841
申请日：2012-08-26
申请人： Jong-gi Lee , Sang-wook Park , Ji-seok Hong
发明人： Jong-gi Lee , Sang-wook Park , Ji-seok Hong
IPC分类号： H01L23/48
CPC分类号： H01L24/19 , H01L21/561 , H01L21/568 , H01L23/3114 , H01L23/5389 , H01L24/20 , H01L24/96 , H01L25/0655 , H01L2224/12105 , H01L2224/2101 , H01L2224/211 , H01L2224/215 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： In one embodiment, a semiconductor package may include a semiconductor chip having a chip pad formed on a first surface thereof, a sealing member for sealing the semiconductor chip and exposing the first surface of the semiconductor chip, a conductive wiring overlying a part of the first surface of the semiconductor chip and directly contacting a part of an upper surface of the sealing member. The conductive wiring further contacts the pad. The semiconductor package may also include an encapsulant covering the conductive wiring and having openings for exposing parts of the conductive wiring.
摘要翻译：在一个实施例中，半导体封装可以包括：半导体芯片，其具有形成在其第一表面上的芯片焊盘，用于密封半导体芯片并暴露半导体芯片的第一表面的密封构件，覆盖第一并且直接接触密封部件的上表面的一部分。导电布线还接触垫。半导体封装还可以包括覆盖导电布线并具有露出导电布线部分的开口的密封剂。

4. 发明授权

US08516053B2 Multimedia play apparatus and method 有权
标题翻译：多媒体播放装置及方法
公开(公告)号：US08516053B2
公开(公告)日：2013-08-20
申请号：US12832586
申请日：2010-07-08
申请人： Sang Wook Park , Noh Sam Park , Jong Hyun Jang , Kwang Roh Park
发明人： Sang Wook Park , Noh Sam Park , Jong Hyun Jang , Kwang Roh Park
IPC分类号： G06F15/16
CPC分类号： H04N5/775 , G11B27/11 , G11B2020/10537 , H04N21/242 , H04N21/4788 , H04N21/4882
摘要： Provided are a multimedia play apparatus and method. The multimedia play apparatus and method enable synchronization between an audio and a video through existing multimedia play time information, and even in a multimedia service that simultaneously provides multimedia and a message, the multimedia play apparatus and method enable synchronization between multimedia and a message that occurs by terminal characteristics between different environments and different users on the basis of existing multimedia play time information and multimedia meaning information. Moreover, by performing synchronization between multimedia and a message on the basis of the multimedia meaning information, the multimedia play apparatus and method can prevent the damage of a multimedia service that provides multimedia and a message together because of a spoiler corresponding to a malicious message.
摘要翻译：提供了一种多媒体播放装置和方法。多媒体播放装置和方法通过现有的多媒体播放时间信息实现音频和视频之间的同步，即使在同时提供多媒体和消息的多媒体服务中，多媒体播放装置和方法也可以实现多媒体与发生的消息之间的同步根据现有多媒体播放时间信息和多媒体含义信息的不同环境和不同用户之间的终端特性。此外，通过基于多媒体含义信息进行多媒体和消息之间的同步，多媒体播放装置和方法可以防止由于与恶意消息对应的扰流器而将多媒体和消息一起提供的多媒体服务的损坏。

5. 发明授权

US08507275B2 Method of inducing differentiation of embryonic stem cells into hemangioblast 有权
标题翻译：诱导胚胎干细胞分化为成血管细胞的方法
公开(公告)号：US08507275B2
公开(公告)日：2013-08-13
申请号：US12858747
申请日：2010-08-18
申请人： Yong-Mahn Han , Sang-Wook Park , Eun-Young Lee
发明人： Yong-Mahn Han , Sang-Wook Park , Eun-Young Lee
IPC分类号： C12N5/00 , C12N5/02 , C12N5/08 , A01N61/00 , A01N37/18
CPC分类号： C12N5/069 , C12N5/0647 , C12N5/0691 , C12N5/0692 , C12N2501/115 , C12N2501/155 , C12N2501/165 , C12N2501/999 , C12N2506/02 , C12N2506/28
摘要： The present invention relates to a composition for inducing embryonic stem cell differentiation comprising a MEK/ERK (mitogen-activated protein kinase kinase/extracellular regulated kinase) signal transduction inhibitor and BMP (bone morphogenetic protein), and a method for inducing differentiation of embryonic stem cells into mesodermal cells using the same. Further, the mesodermal cells obtained by the above method are able to differentiate into various mesenchymal tissue cells. In particular, the present invention relates to a method for inducing differentiation into hemangioblast by culturing the mesodermal cells obtained by the above method in the presence of VEGF (vascular endothelial cell growth factor) and bFGF (basic fibroblast growth factor). The differentiated hemangioblasts can be further differentiated into vascular endothelial cells, vascular smooth muscle cells, and hematopoietic stem cells under various culture conditions.
摘要翻译：本发明涉及一种用于诱导胚胎干细胞分化的组合物，其包含MEK / ERK（丝裂原活化蛋白激酶激酶/细胞外调节激酶）信号转导抑制剂和BMP（骨形态发生蛋白）），以及诱导胚胎干细胞分化的方法细胞使用相同的细胞进入中胚层细胞。此外，通过上述方法获得的中胚层细胞能够分化成各种间充质组织细胞。特别地，本发明涉及通过在VEGF（血管内皮细胞生长因子）和bFGF（碱性成纤维细胞生长因子）的存在下培养通过上述方法获得的中胚层细胞来诱导分化为成血管细胞成分的方法。分化的成血管细胞可以在各种培养条件下进一步分化成血管内皮细胞，血管平滑肌细胞和造血干细胞。

6. 发明申请

US20130149817A1 FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSES OF SEMICONDUCTOR DEVICES THEREIN 审中-公开
标题翻译：半导体器件的制造方法及其半导体器件的拾取器件
公开(公告)号：US20130149817A1
公开(公告)日：2013-06-13
申请号：US13559141
申请日：2012-07-26
申请人： Chang-Seong JEON , Sang-Sick PARK , Sang-Wook PARK , Teak-Hoon LEE , Kwang-Chul CHOI
发明人： Chang-Seong JEON , Sang-Sick PARK , Sang-Wook PARK , Teak-Hoon LEE , Kwang-Chul CHOI
IPC分类号： H01L21/762
CPC分类号： H01L21/67144 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L25/50 , H01L2224/13101 , H01L2224/16145 , H01L2224/75822 , H01L2224/75823 , H01L2224/8117 , H01L2225/06513 , H01L2225/06541 , H01L2924/10253 , H01L2924/014 , H01L2924/00014
摘要： A fabricating method of a semiconductor device may include forming a semiconductor die on a supporting wafer, and picking up the die from the wafer by attaching to the die a transfer unit, the transfer unit including a head unit configured to enable twisting movement, and performing the twisting movement. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer; and picking up the first semiconductor device from the wafer, moving the first semiconductor device onto a second semiconductor device, and bonding the first semiconductor device to the second semiconductor device while maintaining the first semiconductor device oriented so that a surface faces upwardly. A fabricating method of a semiconductor device may include forming a first semiconductor device on a supporting wafer, attaching to the first semiconductor device a transfer unit configured to enable twisting movement, and performing the twisting movement.
摘要翻译：半导体器件的制造方法可以包括在支撑晶片上形成半导体管芯，并且通过将转移单元附接到管芯而从晶片上拾取管芯，所述转移单元包括构造成能够进行扭转运动的头单元，以及执行扭转运动。半导体器件的制造方法可以包括在支撑晶片上形成第一半导体器件; 以及从所述晶片拾取所述第一半导体器件，将所述第一半导体器件移动到第二半导体器件上，并且将所述第一半导体器件接合到所述第二半导体器件，同时保持所述第一半导体器件定向成使得表面朝上。半导体器件的制造方法可以包括在支撑晶片上形成第一半导体器件，附接到第一半导体器件，被配置为能够进行扭转运动并执行扭转运动的转移单元。

7. 发明申请

US20130121758A1 APPARATUS FOR FIXING AN INSULATION PANEL OF A CARGO AND INSULATION PANEL THEREOF 有权
标题翻译：用于固定货物和绝缘面板的绝缘面板的装置
公开(公告)号：US20130121758A1
公开(公告)日：2013-05-16
申请号：US13737481
申请日：2013-01-09
申请人： Ki-Hun Joh , Sang-Eon Chun , Chang-Seon Bang , Dai-Gil Lee , Byung-Chul Kim , Bu-Gi Kim , Jin-Gyu Kim , Soon-Ho Yoon , Sang-Wook Park , Kwan-Ho Lee , Seong-Su Kim , Byoung-Jung Kim , Po-Chul Kim , Ha-Na Yu , Min-Woo Lim , In-Uk Hwang
发明人： Ki-Hun Joh , Sang-Eon Chun , Chang-Seon Bang , Dai-Gil Lee , Byung-Chul Kim , Bu-Gi Kim , Jin-Gyu Kim , Soon-Ho Yoon , Sang-Wook Park , Kwan-Ho Lee , Seong-Su Kim , Byoung-Jung Kim , Po-Chul Kim , Ha-Na Yu , Min-Woo Lim , In-Uk Hwang
IPC分类号： F16B17/00
CPC分类号： F16B17/00 , B63B3/68 , B63B25/02 , F16B2200/503 , F16B2200/506 , F17C13/004 , F17C2203/0358 , F17C2209/22 , F17C2221/033 , F17C2223/0161 , F17C2270/0107 , Y10T403/28 , Y10T403/54 , Y10T403/7075
摘要： A fixing apparatus for fixing a cargo insulation panel to a hull is provided. The fixing apparatus includes a fixing plate adhered to one face of the insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets being fixed by stud bolts arranged on the hull, and coupling means being configured to couple the fixing brackets to the fixing plate. The fixing apparatus can improve the continuity of the insulation panel, enhance the adhesiveness and airtightness with a member such as supple triplex, easily adjust adjacent insulation panels vertically or laterally. The fixing apparatus also solves the problem of damage caused by interference or the inconvenience of transportation by allowing the fixing bracket to be inserted during the transportation of the insulation panel.
摘要翻译：提供了一种用于将货物隔热板固定到船体的定影装置。定影装置包括固定板，该固定板粘附在绝缘板的一个面上，多个固定支架突出到固定板的外侧，固定支架的突出部分由布置在船体上的双头螺栓固定，耦合装置被配置为将固定支架连接到固定板上。定影装置可以提高绝缘面板的连续性，通过诸如柔软三重体的部件增强粘合性和气密性，可以垂直或侧向地简单地调整相邻的绝缘面板。定影装置还解决了在绝缘板的输送期间允许固定支架插入的由干涉引起的损坏或运输的不便的问题。

8. 发明申请

US20130087917A1 SEMICONDUCTOR PACKAGE 有权
标题翻译：半导体封装
公开(公告)号：US20130087917A1
公开(公告)日：2013-04-11
申请号：US13550949
申请日：2012-07-17
申请人： Young-kun Jee , Sun-kyoung Seo , Sang-wook Park , Ji-hwan Hwang
发明人： Young-kun Jee , Sun-kyoung Seo , Sang-wook Park , Ji-hwan Hwang
IPC分类号： H01L23/498 , H01L23/48
CPC分类号： H01L24/03 , H01L24/05 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L2224/02175 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/0347 , H01L2224/0361 , H01L2224/03614 , H01L2224/03622 , H01L2224/0401 , H01L2224/05007 , H01L2224/05023 , H01L2224/05025 , H01L2224/05082 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05547 , H01L2224/05557 , H01L2224/05562 , H01L2224/05565 , H01L2224/05568 , H01L2224/05611 , H01L2224/05647 , H01L2224/05655 , H01L2224/05686 , H01L2224/05687 , H01L2224/06181 , H01L2224/10145 , H01L2224/13023 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/16145 , H01L2224/16148 , H01L2224/16237 , H01L2224/16503 , H01L2224/81191 , H01L2224/81385 , H01L2224/81395 , H01L2224/8181 , H01L2224/81815 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/01029 , H01L2924/01327 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1438 , H01L2924/1443 , H01L2924/15311 , H01L2924/15787 , H01L2924/05042 , H01L2924/00 , H01L2224/05552
摘要： A semiconductor package includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a connection member to electrically connect the first semiconductor chip and the second semiconductor chip. The connection member may include a connection pad disposed on the first semiconductor chip, a connection pillar disposed on the second semiconductor chip, and a bonding member to connect the connection pad and the connection pillar. An anti-contact layer may be formed on at least one surface of the connection pad.
摘要翻译：半导体封装包括第一半导体芯片，设置在第一半导体芯片上的第二半导体芯片和用于电连接第一半导体芯片和第二半导体芯片的连接构件。连接构件可以包括设置在第一半导体芯片上的连接焊盘，设置在第二半导体芯片上的连接柱和用于连接连接焊盘和连接柱的接合构件。可以在连接焊盘的至少一个表面上形成抗接触层。

9. 发明申请

US20120249262A1 POWER COMBINER, POWER AMPLIFYING MODULE HAVING THE SAME, AND SIGNAL TRANSCEIVING MODULE 有权
标题翻译：动力组合机，功率放大模块及信号收发模块
公开(公告)号：US20120249262A1
公开(公告)日：2012-10-04
申请号：US13220229
申请日：2011-08-29
申请人： Ki Joong Kim , Youn Suk Kim , Jun Goo Won , Jae Hyouck Choi , Sang Wook Park , Chul Hwan Yoon
发明人： Ki Joong Kim , Youn Suk Kim , Jun Goo Won , Jae Hyouck Choi , Sang Wook Park , Chul Hwan Yoon
IPC分类号： H03H7/46 , H04B1/38 , H03F3/68
CPC分类号： H03H7/42 , H01L23/66 , H01L25/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/49111 , H01L2924/19107 , H03F3/211 , H03F3/602 , H03F2200/537 , H03F2200/541 , H03H7/48 , H05K1/165 , H01L2924/00014
摘要： There are provided a power combiner implemented by a printed circuit board, a power amplifying module having the same, and a signal transceiving module. The power combiner includes: a primary wiring unit formed on one surface of a printed circuit board, receiving a plurality of balance signals having positive balance signals and negative balance signals, and including a plurality of positive primary wirings and a plurality of negative primary wirings, wherein the plurality of positive primary wirings are spaced apart from each other by a predetermined interval, the plurality of negative primary wirings are spaced apart from each other by a predetermined interval, one ends of the plurality of positive primary wirings are connected in common to thereby receive the plurality of positive balance signals, one ends of the plurality of negative primary wirings are connected in common to thereby receive the plurality of negative balance signals, and the other ends of the plurality of positive primary wirings and the other ends of the plurality of negative primary wirings are connected to each other to thereby form a loop; and a secondary wiring unit formed on the other surface of the printed circuit board, and including a secondary wiring combining powers of the plurality of balance signals from the primary wirings forming the loop to thereby output a single end signal.
摘要翻译：提供了由印刷电路板实现的功率组合器，具有该功率组合器的功率放大模块和信号收发模块。功率组合器包括：形成在印刷电路板的一个表面上的主要布线单元，接收具有正平衡信号和负平衡信号的多个平衡信号，并且包括多个正的主布线和多个负的主布线，其中所述多个正的主要布线彼此隔开预定的间隔，所述多个负的主布线彼此隔开预定的间隔，所述多个正的主布线的一端共同连接，从而接收多个正平衡信号，多个负的主要布线的一端共同连接，从而接收多个负平衡信号，并且多个正的主布线的另一端和多个正平衡信号的另一端负的主布线彼此连接，从而形成环路; 以及形成在印刷电路板的另一个表面上的辅助布线单元，并且包括从形成环路的主布线组合多个平衡信号的功率从而输出单端信号的次级布线。

10. 发明申请

US20120211621A1 APPARATUS FOR FIXING AN INSULATION PANEL OF A CARGO AND INSULATION PANEL THEREOF 审中-公开
标题翻译：用于固定货物和绝缘面板的绝缘面板的装置
公开(公告)号：US20120211621A1
公开(公告)日：2012-08-23
申请号：US13456003
申请日：2012-04-25
申请人： Ki-Hun Joh , Sang-Eon Chun , Chang-Seon Bang , Dai-Gil Lee , Byung-Chul Kim , Bu-Gi Kim , Jin-Gyu Kim , Soon-Ho Yoon , Sang-Wook Park , Kwan-Ho Lee , Seong-Su Kim , Byoung-Jung Kim , Po-Chul Kim , Ha-Na Yu , Min-Woo Lim , In-Uk Hwang
发明人： Ki-Hun Joh , Sang-Eon Chun , Chang-Seon Bang , Dai-Gil Lee , Byung-Chul Kim , Bu-Gi Kim , Jin-Gyu Kim , Soon-Ho Yoon , Sang-Wook Park , Kwan-Ho Lee , Seong-Su Kim , Byoung-Jung Kim , Po-Chul Kim , Ha-Na Yu , Min-Woo Lim , In-Uk Hwang
IPC分类号： F16B5/00
CPC分类号： F16B17/00 , B63B3/68 , B63B25/02 , F16B2200/503 , F16B2200/506 , F17C13/004 , F17C2203/0358 , F17C2209/22 , F17C2221/033 , F17C2223/0161 , F17C2270/0107 , Y10T403/28 , Y10T403/54 , Y10T403/7075
摘要： An apparatus for a cargo insulation panel and an insulation panel using the fixing apparatus are provided. By providing a fixing apparatus of a cargo insulation panel and an insulation panel using the fixing apparatus, which include a fixing plate adhered to one face of the insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets being fixed by stud bolts arranged on the hull, and coupling means being configured to couple the fixing brackets to the fixing plate, the present invention can improve the continuity of the insulation panel, enhance the adhesiveness and airtightness with a member such as supple triplex, easily adjust adjacent insulation panels vertically or laterally, and solve the problem of damage by interference or the inconvenience of transportation by allowing the fixing bracket to be inserted during the transportation of the insulation panel.
摘要翻译：提供了一种用于货物隔离板和使用定影装置的绝缘板的装置。通过提供一种货物隔热板的定影装置和使用该定影装置的绝缘板，该定影装置包括固定板，该固定板粘附在绝缘板的一个面上，多个固定支架突出到固定板的外侧，突出的部分固定支架通过布置在船体上的双头螺栓固定，联接装置构造成将固定支架连接到固定板上，本发明可以提高绝缘板的连续性，增强与诸如柔软三重，可以垂直或横向轻松调整相邻的隔离板，并通过在隔离板的运输过程中插入固定支架，解决干扰造成的损坏或运输不便的问题。

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