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1. 发明授权

US09082752B2 Electronic device 有权
标题翻译：电子设备
公开(公告)号：US09082752B2
公开(公告)日：2015-07-14
申请号：US13631762
申请日：2012-09-28
申请人： Rung-An Chen
发明人： Rung-An Chen
IPC分类号： H05K7/20 , H01L23/427 , H01L23/24
CPC分类号： H01L23/4275 , H01L23/24 , H01L2924/0002 , H05K7/20463 , H01L2924/00
摘要： An electronic device includes a circuit board, a heat generating component positioned on the circuit board, a casing receiving the circuit board and the heat generating component, and a working medium. The working medium is contained in the casing and covers the heat generating component. The working medium is electrically insulated and phase-change material, and represents solid state at normal temperature.
摘要翻译：电子设备包括电路板，位于电路板上的发热元件，容纳电路板和发热元件的外壳以及工作介质。工作介质包含在壳体中并覆盖发热部件。工作介质是电绝缘和相变材料，在常温下代表固态。

2. 发明授权

US08270166B2 Heat dissipation device for electronic apparatus 有权
标题翻译：电子设备散热装置
公开(公告)号：US08270166B2
公开(公告)日：2012-09-18
申请号：US12899738
申请日：2010-10-07
申请人： Rung-An Chen
发明人： Rung-An Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D2021/0028 , F28F1/30 , F28F2215/12 , G06F1/20 , H01L23/467 , H01L25/0655 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus includes a circuit board, a first and a second electronic components installed on the circuit board, and a heat dissipation device. The heat dissipation device includes a centrifugal fan defining a first air outlet and a second air outlet, a first fin assembly disposed at the first outlet of the centrifugal fan, a second fin assembly disposed at the second outlet of the centrifugal fan and thermally contacting the second electronic component, and a heat pipe. The heat pipe includes an evaporating section, a first condensing section and a second condensing section located at two ends of the evaporating section. The evaporating section thermally contacts the first electronic component. The first condensing section is thermally attached to the second fin assembly, and the second condensing section is thermally attached to the first fin assembly.
摘要翻译：电子设备包括电路板，安装在电路板上的第一和第二电子部件以及散热装置。散热装置包括限定第一空气出口和第二空气出口的离心风扇，设置在离心风扇的第一出口处的第一翅片组件，设置在离心风扇的第二出口处的第二翅片组件，第二电子部件和热管。热管包括位于蒸发部的两端的蒸发部，第一冷凝部和第二冷凝部。蒸发部与第一电子部件热接触。第一冷凝部分热连接到第二翅片组件，并且第二冷凝部分热附接到第一翅片组件。

3. 发明申请

US20120099278A1 ELECTRONIC APPARATUS WITH HEAT DISSIPATION DEVICE 有权
标题翻译：具有散热装置的电子装置
公开(公告)号：US20120099278A1
公开(公告)日：2012-04-26
申请号：US12975250
申请日：2010-12-21
申请人： RUNG-AN CHEN , CHIEN-YU CHAO
发明人： RUNG-AN CHEN , CHIEN-YU CHAO
IPC分类号： H05K7/20 , F28D15/04 , F28F13/00
CPC分类号： H01L23/427 , F28D15/0233 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary electronic apparatus includes a casing, and an electronic component and a heat dissipation device received in the casing. The casing includes a bottom plate and an opposite top plate. The heat dissipation device includes a centrifugal fan defining an air outlet for airflow out, a heat sink arranged at the air outlet, and a heat pipe. A height of the heat sink along a direction parallel to a rotation axis of the centrifugal fan is less than that of the air outlet. The heat pipe includes an evaporation section thermally attached to the electronic component and a condensation section thermally attached to the heat sink.
摘要翻译：示例性电子设备包括壳体，以及容纳在壳体中的电子部件和散热装置。壳体包括底板和相对的顶板。散热装置包括限定用于气流的空气出口的离心式风扇，布置在出气口处的散热器和热管。沿着与离心式风扇的旋转轴平行的方向的散热器的高度小于空气出口的高度。热管包括热连接到电子部件的蒸发部分和热连接到散热器的冷凝部分。

4. 发明申请

US20120018132A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20120018132A1
公开(公告)日：2012-01-26
申请号：US12916627
申请日：2010-10-31
申请人： RUNG-AN CHEN
发明人： RUNG-AN CHEN
IPC分类号： F28D15/02 , F28F7/00 , F28F13/12
CPC分类号： F28D15/0275 , F28D15/0233 , F28D2021/0028 , F28F1/20 , F28F2215/04 , F28F2250/08
摘要： An exemplary heat dissipation device includes a centrifugal fan and a fin assembly. An air outlet is defined in the centrifugal fan. The fin assembly is located at the air outlet of the centrifugal fan. The fin assembly includes a first fin unit and two second fin units. The first fin unit includes a plurality of first fins made of a first material. Each of the second fin units includes a plurality of second fins made of a second material. A heat conductive efficiency of the first material exceeds that of the second material.
摘要翻译：示例性的散热装置包括离心风扇和翅片组件。在离心风机中定义出风口。翅片组件位于离心风机的出风口处。翅片组件包括第一翅片单元和两个第二翅片单元。第一翅片单元包括由第一材料制成的多个第一翅片。每个第二翅片单元包括由第二材料制成的多个第二翅片。第一材料的导热效率超过第二材料的导热效率。

5. 发明申请

US20110279971A1 PORTABLE COMPUTER 审中-公开
标题翻译：便携式计算机
公开(公告)号：US20110279971A1
公开(公告)日：2011-11-17
申请号：US12820084
申请日：2010-06-21
申请人： CHIN-HSIEN CHEN , RUNG-AN CHEN
发明人： CHIN-HSIEN CHEN , RUNG-AN CHEN
IPC分类号： H05K7/00
CPC分类号： G06F1/1656 , A61F7/007 , A61F2007/0036 , A61F2007/0096
摘要： An exemplary portable computer includes a casing and temperature control unit received in the casing. The casing includes a first outer portion and a second outer portion having different surface temperatures. The temperature control unit includes a controller, two temperature sensing wires and a heater. The heater is located at the first outer portion and coupled to the controller. The temperature sensing wires each includes a first end and a second end. The first ends are coupled to the controller, and the second ends respectively attaches the first and second outer portions for detecting the surface temperatures thereof. During operation, the controller reads the surface temperatures of the first and second outer portions via the temperature sensing wires, respectively, and outputs a control signal to the heater, thereby controlling operation of the heater to reduce a temperature difference between the first and second outer portions.
摘要翻译：示例性便携式计算机包括容纳在壳体中的壳体和温度控制单元。壳体包括具有不同表面温度的第一外部部分和第二外部部分。温度控制单元包括控制器，两个温度感测线和加热器。加热器位于第一外部部分并且耦合到控制器。温度感测线各自包括第一端和第二端。第一端连接到控制器，并且第二端分别附接第一和第二外部以检测其表面温度。在操作期间，控制器分别通过温度检测线读取第一和第二外部部分的表面温度，并向加热器输出控制信号，从而控制加热器的操作，以减小第一和第二外部之间的温度差部分。

6. 发明申请

US20100025018A1 HEAT DISSIPATION DEVICE 审中-公开
标题翻译：散热装置
公开(公告)号：US20100025018A1
公开(公告)日：2010-02-04
申请号：US12241072
申请日：2008-09-30
申请人： Rung-An Chen
发明人： Rung-An Chen
IPC分类号： F28D15/00
CPC分类号： F28F1/24 , F28D15/0275
摘要： An exemplary heat dissipation device includes a heat pipe and a plurality of fins. Each fin includes a main body and two edges bent from the main body. The edges of a rear fin contact a front adjacent fin. The main body defines a through hole receiving the heat pipe and a flange extends outwardly from a periphery of the through hole. A portion of the flange along a circumferential direction is shorter than the edge. A gap between the portion of the flange of the rear fin and the front adjacent fin receives excess solder forced out between the flanges of the fins and the heat pipe.
摘要翻译：示例性的散热装置包括热管和多个翅片。每个翅片包括主体和从主体弯曲的两个边缘。后翅片的边缘接触前相邻的翅片。主体限定了一个容纳热管的通孔，并且凸缘从通孔的周边向外延伸。凸缘沿圆周方向的一部分比边缘短。后翅片的凸缘的部分与前相邻的翅片之间的间隙在翅片的凸缘和热管之间容纳多余的焊料。

7. 发明申请

US20140016267A1 ELECTRONIC DEVICE WITH HEAT INSULATION LAYER 审中-公开
标题翻译：具有热绝缘层的电子器件
公开(公告)号：US20140016267A1
公开(公告)日：2014-01-16
申请号：US13660029
申请日：2012-10-25
申请人： HENG-SHENG LIN , RUNG-AN CHEN
发明人： HENG-SHENG LIN , RUNG-AN CHEN
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： An exemplary electronic device includes an electronic component, a heat dissipation device, a casing, and a heat insulation layer. The heat dissipation device is positioned on the electronic component for dissipating heat generated by the electronic component. The electronic component and the heat dissipation device are located at an inner side of the casing. The heat insulation layer is located on the heat dissipation device and is close to the casing. The heat insulation layer is made of aerogel material.
摘要翻译：示例性的电子设备包括电子部件，散热装置，壳体和隔热层。散热装置位于电子部件上，用于散发由电子部件产生的热量。电子部件和散热装置位于壳体的内侧。隔热层位于散热装置上，靠近外壳。绝热层由气凝胶材料制成。

8. 发明申请

US20130327502A1 PHASE CHANGE TYPE HEAT DISSIPATING DEVICE 有权
标题翻译：相变型散热装置
公开(公告)号：US20130327502A1
公开(公告)日：2013-12-12
申请号：US13631764
申请日：2012-09-28
申请人： RUNG-AN CHEN
发明人： RUNG-AN CHEN
IPC分类号： F28D15/02
CPC分类号： F28D15/02 , F28D15/0233 , F28D15/0275 , F28D20/02 , H01L23/427 , H01L23/4275 , H01L2924/0002 , Y02E60/145 , H01L2924/00
摘要： A phase change type heat dissipating device for dissipating heat from a heat generating component includes a casing, a working medium received in the casing and a heat pipe connected to the casing. The heat pipe includes an evaporator section and a condenser section. The working medium is electrically insulated and phase change material, and represents solid state at normal temperature. The heat generating component is received in the casing, and the evaporator section of the heat pipe extends into the casing and contacts the working medium.
摘要翻译：用于从发热部件散热的相变型散热装置包括壳体，容纳在壳体中的工作介质和连接到壳体的热管。热管包括蒸发器部分和冷凝器部分。工作介质为电绝缘和相变材料，在常温下为固态。发热部件被容纳在壳体中，并且热管的蒸发器部分延伸到壳体中并与工作介质接触。

9. 发明授权

US08205665B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US08205665B2
公开(公告)日：2012-06-26
申请号：US12396482
申请日：2009-03-03
申请人： Rung-An Chen
发明人： Rung-An Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , F28F1/24 , F28F3/02 , F28F2215/04 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat sink having a first fin unit and a second fin unit adjoining each other. The first fin unit includes a plurality of parallel stacked first fins each including a main body and two flanges extending perpendicularly from two opposite sides of the main body. The second fin unit includes a plurality of parallel stacked second fins each including a main body and two flanges extending perpendicularly from two opposite sides of the main body. The first fin unit and the second fin unit are arranged back-to-back. The main body of an outmost first fin adjacent to the second fin unit abuts the main body of an outmost second fin adjacent to the first fin unit. An interval between two neighboring first fins is smaller than that between two neighboring second fins.
摘要翻译：散热装置包括散热器，该散热器具有彼此邻接的第一散热片单元和第二散热片单元。第一翅片单元包括多个平行堆叠的第一翅片，每个散热片包括主体和从主体的两个相对侧垂直延伸的两个凸缘。第二翅片单元包括多个平行堆叠的第二翅片，每个散热片包括主体和从主体的两个相对侧垂直延伸的两个凸缘。第一翅片单元和第二翅片单元背对背布置。与第二翅片单元相邻的最外侧的第一翅片的主体与第一翅片单元相邻的最外侧的第二翅片的主体邻接。两个相邻的第一散热片之间的间隔小于两个相邻的第二散热片之间的间隔。

10. 发明申请

US20090284929A1 HEAT DISSIPATION ASSEMBLY 审中-公开
标题翻译：散热装置
公开(公告)号：US20090284929A1
公开(公告)日：2009-11-19
申请号：US12169644
申请日：2008-07-09
申请人： RUNG-AN CHEN
发明人： RUNG-AN CHEN
IPC分类号： H05K7/20
CPC分类号： H01L23/34 , H01L23/367 , H01L23/3737 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation assembly (10) includes a heat sink (20) and a cover (30). The heat sink includes a base (22) and a plurality of fins (24) formed on a bottom surface of the base. A depression (220) is formed in a top surface of the base and has thermal interface material (40) received therein. The cover is removably secured to the top surface of the base of the heat sink and covers the depression.
摘要翻译：散热组件（10）包括散热器（20）和盖（30）。散热器包括基部（22）和形成在基部的底表面上的多个翅片（24）。在基座的顶面形成有凹部（220），并具有容纳在其中的热界面材料（40）。盖可拆卸地固定在散热器底座的上表面并覆盖凹陷。

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