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1. 发明授权

US5596485A Plastic packaged integrated circuit with heat spreader 失效
标题翻译：带散热器的塑料封装集成电路
公开(公告)号：US5596485A
公开(公告)日：1997-01-21
申请号：US405462
申请日：1995-03-16
申请人： Thomas P. Glenn , Roy D. Holloway
发明人： Thomas P. Glenn , Roy D. Holloway
IPC分类号： H01L23/367 , H01L23/40 , H01L23/433 , H05K7/20
CPC分类号： H01L23/367 , H01L23/40 , H01L23/4334 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181
摘要： A heat spreader with one or more integrally formed open regions discourages the formation of air bubbles in the encapsulant of a plastic packaged integrated circuit. Little or no air bubbles can be trapped between the heat spreader and the encapsulant surface. Any air bubbles that do form in the encapsulant can escape through the open regions of the heat spreader. The heat spreader of the invention is placed on the surface of a liquid encapsulant and the encapsulant fills the open regions of the heat spreader and covers the sides of the open regions. When the encapsulant hardens, a form fitting bond between the heat spreader and the upper surface of the encapsulant is created. This form fitting bond provides for secure attachment of the heat spreader to the surface of the encapsulant. One embodiment of the heat spreader of the invention includes integrally formed tabs with which a supplementary heat spreader, such as heat tower, is inserted for even greater heat dissipation capability.
摘要翻译：具有一个或多个整体形成的开放区域的散热器阻止在塑料封装集成电路的密封剂中形成气泡。在散热器和密封剂表面之间很少或没有气泡可以被捕获。在密封剂中形成的任何气泡可以通过散热器的开放区域逸出。本发明的散热器放置在液体密封剂的表面上，并且密封剂填充散热器的开放区域并覆盖开放区域的侧面。当密封剂硬化时，产生散热器与密封剂的上表面之间的形状配合。这种形式的配合键提供了散热器到密封剂表面的牢固附着。本发明的散热器的一个实施例包括一体形成的突片，其中插入有辅助散热器（例如热塔），以便更高的散热能力。

2. 发明授权

US06564454B1 Method of making and stacking a semiconductor package 有权
标题翻译：制造和堆叠半导体封装的方法
公开(公告)号：US06564454B1
公开(公告)日：2003-05-20
申请号：US09752244
申请日：2000-12-28
申请人： Thomas P. Glenn , Steven Webster , Roy D. Holloway
发明人： Thomas P. Glenn , Steven Webster , Roy D. Holloway
IPC分类号： H01K310
CPC分类号： H01L24/50 , H01L23/49572 , H01L23/49816 , H01L24/48 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/05599 , H01L2224/16225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/854 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/12043 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/3025 , H05K3/363 , H05K2201/0394 , H05K2201/096 , H05K2201/0969 , H05K2201/10477 , H05K2201/10681 , Y10T29/49144 , Y10T29/49149 , Y10T29/49165 , Y10T29/49179 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： Semiconductor packages and methods of making packages are disclosed. An exemplary method includes providing a printed circuit board having a first surface with circuit traces thereon, first apertures, and a second aperture. Each circuit trace overlies a first aperture, and an end of the circuit trace is near the second aperture. Solder balls are placed in each first aperture and fused to the overlying circuit trace. A die is placed in the second aperture. Each circuit trace may include a third aperture over the first aperture. Solder from the solder ball within the first aperture fills the overlying third aperture. A second package can be stacked on a first package. Solder balls of the second package each fuse with an underlying solder ball of the first package through a third aperture of the first package. The dies of the stacked packages may be positioned for optical communication with each other.
摘要翻译：公开了封装的半导体封装和方法。一种示例性方法包括提供具有第一表面的印刷电路板，其上具有电路迹线，第一孔和第二孔。每个电路迹线覆盖第一孔，电路迹线的一端靠近第二孔。焊球放置在每个第一孔中并与上覆电路迹线融合。模具被放置在第二孔中。每个电路迹线可以包括在第一孔上的第三孔。在第一孔内从焊球焊接填充上覆的第三孔。第二个包装可以堆放在第一个包装上。第二封装的焊球通过第一封装的第三孔与第一封装的底层焊球熔合。堆叠包装的管芯可以被定位成彼此进行光学连通。

3. 发明授权

US06448506B1 Semiconductor package and circuit board for making the package 有权
标题翻译：用于制造封装的半导体封装和电路板
公开(公告)号：US06448506B1
公开(公告)日：2002-09-10
申请号：US09752662
申请日：2000-12-28
申请人： Thomas P. Glenn , Steven Webster , Roy D. Holloway
发明人： Thomas P. Glenn , Steven Webster , Roy D. Holloway
IPC分类号： H05K116
CPC分类号： H01L25/0657 , H01L23/3128 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/45099 , H01L2224/48091 , H01L2224/854 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12043 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18165 , H01L2924/3025 , H05K1/0268 , H05K1/144 , H05K3/3436 , H05K3/363 , H05K2201/0394 , H05K2201/0969 , H05K2201/10681 , H05K2201/10734 , H05K2203/041 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Disclosed herein are semiconductor packages and stacks thereof. An example package includes an insulative substrate having a first surface, first apertures, a second aperture, and circuit traces on the first surface. A first portion of each circuit trace overlies a first aperture and an end of the circuit trace is near the second aperture. A solder ball is in each first aperture, fused to the overlying circuit trace. A semiconductor die is in the second aperture and is electrically connected to the ends of the traces. A third aperture may extend through the first portion of each circuit trace. A second package can be stacked on a first package. Solder balls of the second package each fuse with an underlying solder ball of the first package through a third aperture of the first package. The dies of the stacked packages may be positioned for optical communication with each other.
摘要翻译：本文公开了半导体封装及其堆叠。示例性封装包括具有第一表面，第一孔，第二孔和第一表面上的电路迹线的绝缘衬底。每个电路迹线的第一部分覆盖第一孔径，并且电路迹线的一端在第二孔附近。每个第一个孔中都有一个焊球，与上覆电路迹线融合。半导体管芯位于第二孔中并电连接到迹线的端部。第三孔可以延伸穿过每个电路迹线的第一部分。第二个包装可以堆放在第一个包装上。第二封装的焊球通过第一封装的第三孔与第一封装的底层焊球熔合。堆叠包装的管芯可以被定位成彼此进行光学连通。

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