专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10343634B1 Extendable bumpers for vehicles 有权
公开(公告)号：US10343634B1
公开(公告)日：2019-07-09
申请号：US15418208
申请日：2017-01-27
申请人： Erik Mikael Fermer , Alice C. Watts , Joel Frederic Jensen , Ronald Jack Smith , Mark B. Rober , Sung Hoon Kim , David Jennings Dostal , Russell Cranstoun Mead, Jr. , Todd Elliot Lewis , Jesse T. Buehler , Nathaniel J. Dennis , Tommaso P. Rivellini , Robert R. Mayer , Anthony S. Montevirgen , Donald J. Parr , Bryce A. Woollard , Adam J. Golman , Kevin P. Makowski , Daniel E. Rivera
发明人： Erik Mikael Fermer , Alice C. Watts , Joel Frederic Jensen , Ronald Jack Smith , Mark B. Rober , Sung Hoon Kim , David Jennings Dostal , Russell Cranstoun Mead, Jr. , Todd Elliot Lewis , Jesse T. Buehler , Nathaniel J. Dennis , Tommaso P. Rivellini , Robert R. Mayer , Anthony S. Montevirgen , Donald J. Parr , Bryce A. Woollard , Adam J. Golman , Kevin P. Makowski , Daniel E. Rivera
IPC分类号： B60R19/38 , B60R19/34
摘要： An apparatus includes a vehicle structure, a bumper, an elongate structural member, and an extension portion. The elongate structural member is able to crush longitudinally in response to application of force in a longitudinal direction. The extension portion is able to crush longitudinally in response to application of force in the longitudinal direction, is connected to the elongate structural member such that the elongate structural member and the extension portion support the bumper with respect to the vehicle structure, and is operable to move the bumper between an extended position and a retracted position with respect to the vehicle structure to change a distance between the bumper and the vehicle structure.

2. 发明授权

US6132019A Door assembly for a computer 有权
标题翻译：电脑门组件
公开(公告)号：US6132019A
公开(公告)日：2000-10-17
申请号：US372660
申请日：1999-08-11
申请人： Sung Kim , Colin Alexander Davis , Ronald Jack Smith , Steven G. Siefert
发明人： Sung Kim , Colin Alexander Davis , Ronald Jack Smith , Steven G. Siefert
IPC分类号： G06F1/18 , A47B97/00
CPC分类号： G06F1/181
摘要： A door assembly that includes a door that is operable to alternatively expose and cover an opening in the bezel of a computer. The door assembly includes a carriage that slides up and down that pivotally couples to the door. Upon pressing against the lower portion of the door, the door pivots and the carriage and the door automatically slide down such that the door no longer covers the opening in the bezel. When an upward force is applied to the door, the door and the carriage move upward and into the closed position. As the door reaches the opening in the bezel, a spring forces the door against the bezel and into the closed position. The door is easily opened and closed and the door is out of the way when the door is in the open position.
摘要翻译：一种门组件，其包括可操作以交替地暴露和覆盖计算机的挡板中的开口的门。门组件包括滑动上下滑动的滑架，该滑架可枢转地连接到门。当压靠门的下部时，门枢转，托架和门自动向下滑动，使得门不再覆盖在挡板中的开口。当向门施加向上的力时，门和托架向上移动并进入关闭位置。当门到达挡板上的开口时，弹簧迫使门抵靠挡板并进入关闭位置。当门处于打开位置时，门很容易打开和关闭，门就不通了。

3. 发明授权

US07440281B2 Thermal interface apparatus 有权
标题翻译：热接口设备
公开(公告)号：US07440281B2
公开(公告)日：2008-10-21
申请号：US11344657
申请日：2006-02-01
申请人： Sean Ashley Bailey , Richard Lidio Blanco, Jr. , David Edwards , Supratik Guha , Michael David Hillman , Yves C. Martin , Phillip Lee Mort , Roger Schmidt , Prabjit Singh , Ronald Jack Smith , Gregory L. Tice , Theodore Gerard van Kessel
发明人： Sean Ashley Bailey , Richard Lidio Blanco, Jr. , David Edwards , Supratik Guha , Michael David Hillman , Yves C. Martin , Phillip Lee Mort , Roger Schmidt , Prabjit Singh , Ronald Jack Smith , Gregory L. Tice , Theodore Gerard van Kessel
IPC分类号： H05K7/20
CPC分类号： H01L23/42 , H01L23/26 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.
摘要翻译：一种用于将热量从计算机部件传导到散热器的装置。本发明可以包括热界面材料（TIM）。本发明还可以包括至少部分地包围TIM的密封件或垫圈。垫圈可以有助于将TIM保持在其侧壁内，从而在计算机部件上或附近保持适当的位置。通常，垫圈可以放置在计算机部件（或者硅板或计算机部件所在的其它材料）和散热器之间。插入件可以放置在垫圈内并且限定孔。芯片位于孔中并因此在空间上相对于插入件定位。 TIM邻接计算机组件和散热器。干燥剂可以位于垫圈内并吸收任何通过垫片扩散或迁移的水分。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式