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1. 发明授权

US5808358A Packaging electrical circuits 失效
公开(公告)号：US5808358A
公开(公告)日：1998-09-15
申请号：US715785
申请日：1996-09-19
申请人： Patrizio Vinciarelli , Robert E. Belland , George J. Ead , Fred M. Finnemore , Lance L. Andrus
发明人： Patrizio Vinciarelli , Robert E. Belland , George J. Ead , Fred M. Finnemore , Lance L. Andrus
IPC分类号： H05K3/34 , H01L21/58 , H01L21/60 , H01L23/06 , H01L23/36 , H01L23/373 , H01L23/498 , H01L23/552 , H01L23/58 , H01L23/62 , H05K9/00 , H01L23/053 , H01L23/12 , H01L23/14
CPC分类号： H01L24/83 , H01L23/06 , H01L23/36 , H01L23/3735 , H01L23/49833 , H01L23/552 , H01L23/585 , H01L23/62 , H01L24/29 , H01L2224/05553 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45015 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/48799 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/8385 , H01L2224/83907 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/157 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H05K3/341
摘要： A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap. A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device. A method for use in making a package for electrical circuits includes attaching an electrical insulator within a recess of a first metallic component. The method also includes registering a second metallic component within the recess using a template tool and bonding the second metallic component to the insulator. A third component is soldered to the second metallic component. A structure including an electrical conductor and a sheet of conductive material including a punt soldered to the electrical conductor.

2. 发明授权

US6159772A Packaging electrical circuits 失效
标题翻译：包装电路
公开(公告)号：US6159772A
公开(公告)日：2000-12-12
申请号：US89438
申请日：1998-06-03
申请人： Patrizio Vinciarelli , Robert E. Belland , George J. Ead , Fred M. Finnemore , Lance L. Andrus
发明人： Patrizio Vinciarelli , Robert E. Belland , George J. Ead , Fred M. Finnemore , Lance L. Andrus
IPC分类号： H05K3/34 , H01L21/58 , H01L21/60 , H01L23/06 , H01L23/36 , H01L23/373 , H01L23/498 , H01L23/552 , H01L23/58 , H01L23/62 , H05K9/00
CPC分类号： H01L24/83 , H01L23/06 , H01L23/36 , H01L23/3735 , H01L23/49833 , H01L23/552 , H01L23/585 , H01L23/62 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/05553 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45015 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/48799 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/8385 , H01L2224/83907 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/157 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H05K3/341 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2924/20752 , H01L2224/05599
摘要： A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap. A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device. A method for use in making a package for electrical circuits includes attaching an electrical insulator within a recess of a first metallic component. The method also includes registering a second metallic component within the recess using a template tool and bonding the second metallic component to the insulator. A third component is soldered to the second metallic component. A structure including an electrical conductor and a sheet of conductive material including a punt soldered to the electrical conductor.
摘要翻译：将具有金属表面的第一部件焊接到具有金属表面的第二部件的方法包括将第一部件的金属表面保持在第二部件的金属表面上的放置区域上方的位置，以在第二部件的表面之间形成间隙。该方法还包括在间隙内回流焊料。包括导热基板，附接到基板的电绝缘体和安装在绝缘体上的金属屏蔽的结构。该结构还包括具有功率耗散电子器件的集成功率器件，以及通过焊接点与屏蔽件连接的第一金属层。衬底包括孔，并且集成的功率器件安装有位于孔内的功率消耗装置。基板还包括电连接到集成功率器件的第二金属层的导电电流。用于制造用于电路的封装的方法包括将电绝缘体附接在第一金属部件的凹部内。该方法还包括使用模板工具将凹陷内的第二金属部件对准，并将第二金属部件接合到绝缘体。第三组分被焊接到第二金属组分。一种包括电导体和包括焊接到电导体的平面的导电材料片的结构。

3. 发明授权

US6096981A Packaging electrical circuits 失效
标题翻译：包装电路
公开(公告)号：US6096981A
公开(公告)日：2000-08-01
申请号：US90270
申请日：1998-06-03
申请人： Patrizio Vinciarelli , Robert E. Belland , George J. Ead , Fred M. Finnemore , Lance L. Andrus
发明人： Patrizio Vinciarelli , Robert E. Belland , George J. Ead , Fred M. Finnemore , Lance L. Andrus
IPC分类号： H05K3/34 , H01L21/58 , H01L21/60 , H01L23/06 , H01L23/36 , H01L23/373 , H01L23/498 , H01L23/552 , H01L23/58 , H01L23/62 , H05K9/00
CPC分类号： H01L24/83 , H01L23/06 , H01L23/36 , H01L23/3735 , H01L23/49833 , H01L23/552 , H01L23/585 , H01L23/62 , H01L24/29 , H01L2224/05553 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45015 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/48799 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/8385 , H01L2224/83907 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/157 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H05K3/341
摘要： A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator is set forth. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device. A further structure including an electrical conductor and a sheet of conductive material including a punt soldered to the electrical conductor is presented.
摘要翻译：阐述了一种包括导热基板，附着在基板上的电绝缘体和安装在绝缘体上的金属屏蔽的结构。该结构还包括具有功率耗散电子器件的集成功率器件，以及通过焊接点与屏蔽件连接的第一金属层。衬底包括孔，并且集成的功率器件安装有位于孔内的功率消耗装置。基板还包括电连接到集成功率器件的第二金属层的导电电流。提出了包括电导体和包括焊接到电导体的平面的导电材料片的另外的结构。

4. 发明授权

US6119923A Packaging electrical circuits 失效
标题翻译：包装电路
公开(公告)号：US6119923A
公开(公告)日：2000-09-19
申请号：US89770
申请日：1998-06-03
申请人： Patrizio Vinciarelli , Robert E. Belland , George J. Ead , Fred M. Finnemore , Lance L. Andrus
发明人： Patrizio Vinciarelli , Robert E. Belland , George J. Ead , Fred M. Finnemore , Lance L. Andrus
IPC分类号： H05K3/34 , H01L21/58 , H01L21/60 , H01L23/06 , H01L23/36 , H01L23/373 , H01L23/498 , H01L23/552 , H01L23/58 , H01L23/62 , H05K9/00 , B23K31/00
CPC分类号： H01L24/83 , H01L23/06 , H01L23/36 , H01L23/3735 , H01L23/49833 , H01L23/552 , H01L23/585 , H01L23/62 , H01L24/29 , H01L2224/05553 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45015 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/48799 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/8385 , H01L2224/83907 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/157 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H05K3/341
摘要： A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap.A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device.A method for use in making a package for electrical circuits includes attaching an electrical insulator within a recess of a first metallic component. The method also includes registering a second metallic component within the recess using a template tool and bonding the second metallic component to the insulator. A third component is soldered to the second metallic component.A structure including an electrical conductor and a sheet of conductive material including a punt soldered to the electrical conductor
摘要翻译：将具有金属表面的第一部件焊接到具有金属表面的第二部件的方法包括将第一部件的金属表面保持在第二部件的金属表面上的放置区域上方的位置，以在第二部件的表面之间形成间隙。该方法还包括在间隙内回流焊料。包括导热基板，附接到基板的电绝缘体和安装在绝缘体上的金属屏蔽的结构。该结构还包括具有功率耗散电子器件的集成功率器件，以及通过焊接点与屏蔽件连接的第一金属层。衬底包括孔，并且集成的功率器件安装有位于孔内的功率消耗装置。基板还包括电连接到集成功率器件的第二金属层的导电电流。用于制造用于电路的封装的方法包括将电绝缘体附接在第一金属部件的凹部内。该方法还包括使用模板工具将凹陷内的第二金属部件对准，并将第二金属部件接合到绝缘体。第三组分被焊接到第二金属组分。一种包括电导体和包括焊接到电导体的平面的导电材料片的结构

5. 发明授权

US5906310A Packaging electrical circuits 失效
公开(公告)号：US5906310A
公开(公告)日：1999-05-25
申请号：US523873
申请日：1995-09-05
申请人： Patrizio Vinciarelli , Robert E. Belland , George J. Ead , Fred M. Finnemore , Lance L. Andrus
发明人： Patrizio Vinciarelli , Robert E. Belland , George J. Ead , Fred M. Finnemore , Lance L. Andrus
IPC分类号： H05K3/34 , H01L21/58 , H01L21/60 , H01L23/06 , H01L23/36 , H01L23/373 , H01L23/498 , H01L23/552 , H01L23/58 , H01L23/62 , H05K9/00
CPC分类号： H01L24/83 , H01L23/06 , H01L23/36 , H01L23/3735 , H01L23/49833 , H01L23/552 , H01L23/585 , H01L23/62 , H01L24/29 , H01L2224/05553 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45015 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/48799 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/8385 , H01L2224/83907 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/157 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H05K3/341
摘要： A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap.A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device.A method for use in making a package for electrical circuits includes attaching an electrical insulator within a recess of a first metallic component. The method also includes registering a second metallic component within the recess using a template tool and bonding the second metallic component to the insulator. A third component is soldered to the second metallic component.A structure including an electrical conductor and a sheet of conductive material including a punt soldered to the electrical conductor.

6. 发明授权

US4000393A Thermal printhead assembly 失效
标题翻译：热敏打印头组件
公开(公告)号：US4000393A
公开(公告)日：1976-12-28
申请号：US501919
申请日：1974-08-29
申请人： Michael J. Cochran , Larry D. Propst , Richard D. Harris , Robert E. Belland , John W. Richardson , Stephen P. Hamilton
发明人： Michael J. Cochran , Larry D. Propst , Richard D. Harris , Robert E. Belland , John W. Richardson , Stephen P. Hamilton
IPC分类号： H05B3/06 , H05B1/00
CPC分类号： H05B3/06
摘要： A method of assembling, positioning, and making connections to a thermal printhead is disclosed. A substrate is provided upon which heating elements or mesas are mounted. Leads from these heating elements are continued on the same side of the substrate as the one on which the elements are located. The leads are brought to terminal pads where connections may be made to the logic circuit which selectively energizes the heating elements to form numerals or characters on heat sensitive paper. A flat flexible cable with conductor ends exposed is held in place so that the exposed conductor ends make contact with the terminal pads of one or more of such substrates. The substrates and cable are clamped together by two metal plates. This entire assembly is mounted on a spring-loaded pivot arrangement so as to hold the heating elements against the heat sensitive paper on an advancing platen. Connections may be made between the cable conductors and the printing logic to allow the heating elements to be energized.
摘要翻译：公开了一种组合，定位和连接热敏打印头的方法。设置有加热元件或台面安装的基板。来自这些加热元件的引线在与元件所在的基板相同的一侧上继续。引线被带到端子焊盘，其中可以对逻辑电路进行连接，逻辑电路选择性地激励加热元件以在热敏纸上形成数字或字符。导体端部露出的扁平柔性电缆被固定到位，使得暴露的导体端部与一个或多个这样的基板的端子焊盘接触。基板和电缆通过两个金属板夹在一起。该整个组件安装在弹簧加载的枢转装置上，以将加热元件保持在前进压板上的热敏纸上。可以在电缆导体和打印逻辑之间进行连接，以允许加热元件被通电。

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