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1. 发明授权

US5316970A Generation of ionized air for semiconductor chips 失效
标题翻译：生成半导体芯片的电离空气
公开(公告)号：US5316970A
公开(公告)日：1994-05-31
申请号：US895181
申请日：1992-06-05
申请人： John S. Batchelder , Vaughn P. Gross , Robert A. Gruver , Philip C. D. Hobbs , Kenneth D. Murray
发明人： John S. Batchelder , Vaughn P. Gross , Robert A. Gruver , Philip C. D. Hobbs , Kenneth D. Murray
IPC分类号： B01J19/00 , B01J19/12 , H01L21/00 , H01L21/304 , H05F3/06
CPC分类号： H01L21/67028 , H05F3/06 , Y10S430/138 , Y10S438/909
摘要： Ionization of air without the use of corona discharge tips, thereby to avoid the generation of particulates from corrosion of the corona tips, is accomplished by use of a laser beam focussed to a small focal volume of intense electric field adjacent a semiconductor chip. The electric field is sufficiently intense to ionize air. In the manufacture of a semiconductor circuit chip, during those steps which are conducted in an air environment, opportunity exists to remove from a surface of a chip, or wafer, charge acquired during the manufacturing process. The ionized air is passed along the chip surface. Ions in the air discharge local regions of the chip surface which have become charged by steps of a manufacturing process. By way of further embodiment of the invention, the ionization may be produced by injection of molecules of water into the air, which molecules are subsequently ionized by a laser beam and directed toward the chip via a light shield with the aid of a magnetic field.
摘要翻译：通过使用聚焦于与半导体芯片相邻的强电场的小焦点体积的激光束来实现空气的离子化，而不使用电晕放电尖端，从而避免由于电晕尖端的腐蚀而产生微粒。电场足够强以使空气电离。在半导体电路芯片的制造中，在空气环境中进行的那些步骤中，存在从制造过程中获取的芯片或晶片的表面去除电荷的机会。电离空气沿芯片表面通过。芯片表面的空气放电局部区域中的离子通过制造过程的步骤而被充电。通过本发明的进一步的实施方式，电离可以通过将水分子注入到空气中来产生，该分子随后通过激光束被电离，并借助于磁场通过光屏指向芯片。

2. 发明授权

US5432670A Generation of ionized air for semiconductor chips 失效
标题翻译：生成半导体芯片的电离空气
公开(公告)号：US5432670A
公开(公告)日：1995-07-11
申请号：US166509
申请日：1993-12-13
申请人： John S. Batchelder , Vaughn P. Gross , Robert A. Gruver , Philip C. D. Hobbs , Kenneth D. Murray
发明人： John S. Batchelder , Vaughn P. Gross , Robert A. Gruver , Philip C. D. Hobbs , Kenneth D. Murray
IPC分类号： B01J19/00 , B01J19/12 , H01L21/00 , H01L21/304 , H05F3/06
CPC分类号： H01L21/67028 , H05F3/06 , Y10S430/138 , Y10S438/909
摘要： Ionization of air without the use of corona discharge tips, thereby to avoid the generation of particulates from corrosion of the corona tips, is accomplished by use of a laser beam focussed to a small focal volume of intense electric field adjacent a semiconductor chip. The electric field is sufficiently intense to ionize air. In the manufacture of a semiconductor circuit chip, during those steps which are conducted in an air environment, opportunity exists to remove from a surface of a chip, or wafer, charge acquired during the manufacturing process. The ionized air is passed along the chip surface. Ions in the air discharge local regions of the chip surface which have become charged by steps of a manufacturing process. By way of further embodiment of the invention, the ionization may be produced by injection of molecules of water into the air, which molecules are subsequently ionized by a laser beam and directed toward the chip via a light shield with the aid of a magnetic field.
摘要翻译：通过使用聚焦于与半导体芯片相邻的强电场的小焦点体积的激光束来实现空气的离子化，而不使用电晕放电尖端，从而避免由于电晕尖端的腐蚀而产生微粒。电场足够强以使空气电离。在半导体电路芯片的制造中，在空气环境中进行的那些步骤中，存在从制造过程中获取的芯片或晶片的表面去除电荷的机会。电离空气沿芯片表面通过。芯片表面的空气放电局部区域中的离子通过制造过程的步骤而被充电。通过本发明的进一步的实施方式，电离可以通过将水分子注入到空气中来产生，该分子随后通过激光束被电离，并借助于磁场通过光屏指向芯片。

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