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    • 4. 发明授权
    • Light emitting diode and fabricating method thereof
    • 发光二极管及其制造方法
    • US08604488B2
    • 2013-12-10
    • US13365217
    • 2012-02-02
    • Yi-Keng FuRen-Hao JiangYen-Hsiang FangBo-Chun ChenChia-Feng Lin
    • Yi-Keng FuRen-Hao JiangYen-Hsiang FangBo-Chun ChenChia-Feng Lin
    • H01L33/32
    • H01L33/22H01L33/0075H01L33/0079
    • A light emitting diode including a GaN substrate, a first type semiconductor layer, a light emitting layer, a second type semiconductor layer, a first electrode, and a second electrode is provided. The GaN substrate has a first surface and a second surface opposite thereto, and the second surface has a plurality of protuberances, the height of the protuberance is h μm and the distribution density of the protuberance on the second surface is d cm−2, wherein 9.87×107≦h2d, and h≦1.8. The first type semiconductor is disposed on the first surface of the GaN substrate. The light emitting layer is disposed on a partial region of the first semiconductor layer, and the wavelength of the light emitted by the light emitting layer is from 375 nm to 415 nm. The second semiconductor layer is disposed on the light emitting layer.
    • 提供了包括GaN衬底,第一类型半导体层,发光层,第二类型半导体层,第一电极和第二电极的发光二极管。 GaN衬底具有与其相对的第一表面和第二表面,并且第二表面具有多个突起,突起的高度为hmum,并且第二表面上的突起的分布密度为dcm-2,其中 9.87×107@h2d和h@1.8。 第一类型半导体被布置在GaN衬底的第一表面上。 发光层设置在第一半导体层的部分区域上,由发光层发射的光的波长为375nm〜415nm。 第二半导体层设置在发光层上。