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    • 5. 发明授权
    • Pin array assembly and method of manufacture
    • 针阵列组装及制造方法
    • US06455352B1
    • 2002-09-24
    • US09653672
    • 2000-09-01
    • Joel PikarskyPeter HeskethGennadiy Yershov
    • Joel PikarskyPeter HeskethGennadiy Yershov
    • H01L2144
    • B01L3/0244B01L3/0255B01L2200/12
    • An improved pin array assembly and method of manufacture of the pin array assembly are provided. A pin array assembly includes a single crystal silicon wafer. The single crystal silicon wafer is formed to define a base and an array of pins. Each of the pins has a shaft and a tip surface. The pin shaft is hydrophobic and the pin tip surface is hydrophilic. The method of manufacture of the pin array assembly includes the steps of forming an initial shape of a single crystal silicon wafer to define a base and an array of pins. The initial shape of a single crystal silicon wafer is etched and the array of pins is polished. The step of forming an initial shape of a single crystal silicon wafer to define a base and an array of pins includes mechanically sawing the single crystal silicon wafer to define a base and an array of pins. Chemical treatment of the pins is performed to make the shaft of the pins hydrophobic and to make the pin tip surfaces hydrophilic.
    • 提供了一种改进的针阵列组件以及销阵列组件的制造方法。 针阵列组件包括单晶硅晶片。 形成单晶硅晶片以限定基部和引脚阵列。 每个销具有轴和尖端表面。 针轴是疏水的,针尖表面是亲水的。 引脚阵列组件的制造方法包括以下步骤:形成单晶硅晶片的初始形状以限定基座和引脚阵列。 蚀刻单晶硅晶片的初始形状并抛光销的阵列。 形成单晶硅晶片的初始形状以限定基部和引脚阵列的步骤包括机械地锯切单晶硅晶片以限定基部和引脚阵列。 执行销的化学处理以使销的轴疏水并使销尖表面亲水。