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    • 7. 发明授权
    • Field effect transistor
    • 场效应晶体管
    • US06707120B1
    • 2004-03-16
    • US09097991
    • 1998-06-16
    • Payman AminzadehReza ArghavaniPeter Moon
    • Payman AminzadehReza ArghavaniPeter Moon
    • H01L2976
    • H01L29/6659H01L21/3144H01L29/4983H01L29/6656
    • A method of fabricating a field effect transistor with increased resistance to hot carrier damage is disclosed. An oxide is grown on the gate electrode. This oxide is strengthened by nitridation and anneal. After a lightly doped drain implant, a second side oxide and a conformal nitride layer are deposited. Then, the conformal nitride is anisotropically etched to form spacers for masking a high dose drain implant. An NMOS transitor fabricated with this process has been found to be forty percent less susceptible to hot carrier damage than a conventional lightly doped drain process. Also, this process has proven to be more manufacturable than one in which the side oxide is nitrided and re-oxidized.
    • 公开了一种制造具有增加的抗热载体损伤的场效应晶体管的方法。 在栅电极上生长氧化物。 该氧化物通过氮化和退火得到加强。 在轻掺杂漏极注入之后,沉积第二侧面氧化物和共形氮化物层。 然后,各向异性蚀刻共形氮化物以形成用于掩蔽高剂量漏极植入物的间隔物。 已经发现用该方法制造的NMOS过渡器比传统的轻掺杂漏极工艺对热载体损伤的敏感性低40%。 此外,该方法已证明比侧氧化物被氮化并再次氧化的方法更可制造。