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1. 发明授权

US4259684A Packages for microwave integrated circuits 失效
标题翻译：微波集成电路封装
公开(公告)号：US4259684A
公开(公告)日：1981-03-31
申请号：US951219
申请日：1978-10-13
申请人： Douglas J. Dean , Patrick F. T. Linford , John Savage
发明人： Douglas J. Dean , Patrick F. T. Linford , John Savage
IPC分类号： H01L23/057 , H01L23/10 , H01L23/66 , H01L23/02 , H01L23/12 , H01L39/02
CPC分类号： H01L23/10 , H01L23/057 , H01L23/66 , H01L2224/48091 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/3011
摘要： This disclosure relates to the packaging of microwave integrated circuits (MICs) whereby an MIC is hermetically sealed within an enclosure comprising a first plate of dielectric material which carries the circuit to be enclosed, a wall of dielectric material sealed to the surface of the first plate surrounding the circuit, and a second plate of dielectric material providing a lid sealed over the wall to complete the enclosure. The first plate carries planar conductors which define at least one microwave transmission line, e.g. microstrip, extending across the wall into the enclosure from outside to provide direct microwave coupling to the enclosed circuit and thereby obviating the usual need for transitions to and from coaxial cable.Part or all of the enclosed circuit may be contained within a recess provided by forming an aperture in the first plate and sealing a third plate of dielectric material across the aperture from below.The disclosure describes various techniques for reducing losses where the transmission line propagation paths traverse the wall on the surface of the first plate. The entire package may be fabricated using materials and techniques compatible with those used in fabricating MIC's, for example thick film.
摘要翻译：本发明涉及微波集成电路（MIC）的封装，其中MIC密封在外壳内，该外壳包括承载要封闭的电路的第一介电材料板，密封到第一板的表面的电介质材料壁围绕电路，以及第二介电材料板，提供密封在壁上以完成外壳的盖子。第一板承载限定至少一个微波传输线的平面导体，例如。微带，从外部延伸穿过壁进入外壳，以提供直接的微波耦合到封闭的电路，从而避免了对同轴电缆的转换的通常需要。封闭电路的一部分或全部可以包含在通过在第一板中形成孔并且从下方密封第三介电材料板穿过该孔而提供的凹槽内。本公开描述了用于在传输线传播路径穿过第一板的表面上的壁的情况下减少损耗的各种技术。可以使用与用于制造MIC的材料和技术相兼容的材料和技术来制造整个封装，例如厚膜。

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