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1. 发明授权

US06468356B1 Method for removing molding residues in the fabrication of plastic packages for semiconductor devices 有权
标题翻译：用于在半导体器件的塑料封装的制造中去除模制残留物的方法
公开(公告)号：US06468356B1
公开(公告)日：2002-10-22
申请号：US09535322
申请日：2000-03-27
申请人： Paolo Crema , Roberto Tiziani , Markus Guggenmos
发明人： Paolo Crema , Roberto Tiziani , Markus Guggenmos
IPC分类号： B08B704
CPC分类号： B29C37/02 , B08B7/0042 , H01L21/4839
摘要： A method for removing residues of molding material from metal parts of plastic packages of semiconductor devices includes applying first and second pulsed laser radiations to at least one surface region of a metal part covered with residues of molding material. The first pulsed laser radiation has a first wavelength that is absorbed by residues of molding material having a thickness greater than a prescribed thickness. The intensity and the duration of the first pulsed laser radiation causes the residues to be directly attacked. The second pulsed laser radiation has a second wavelength so that residues of molding material having a thickness less than the prescribed value are at least partially transparent and the metal parts are at least partially absorbent. The intensity and the duration of the second pulsed laser radiation causes the formation of plasma at the point of impact with the metal part.
摘要翻译：一种用于从半导体器件的塑料封装的金属部件去除模制材料的残留物的方法包括将第一和第二脉冲激光辐射施加到覆盖有模制材料的残余物的金属部件的至少一个表面区域上。第一脉冲激光辐射具有被厚度大于规定厚度的成型材料的残留物吸收的第一波长。第一脉冲激光辐射的强度和持续时间使残留物直接受到攻击。第二脉冲激光辐射具有第二波长，使得具有小于规定值的厚度的成型材料的残留物至少部分透明，并且金属部件至少部分吸收。第二脉冲激光辐射的强度和持续时间导致在与金属部件的撞击点处形成等离子体。

2. 发明授权

US06291893B1 Power semiconductor device for “flip-chip” connections 有权
标题翻译：用于“倒装芯片”连接的功率半导体器件
公开(公告)号：US06291893B1
公开(公告)日：2001-09-18
申请号：US09237407
申请日：1999-01-26
申请人： Roberto Tiziani , Paolo Crema , Marco Mantovani
发明人： Roberto Tiziani , Paolo Crema , Marco Mantovani
IPC分类号： H01L2348
CPC分类号： H01L23/3121 , H01L23/36 , H01L23/4334 , H01L2224/16 , H01L2924/19041
摘要： An electronic device is formed on a chip of semiconductor material covered by a layer of insulating material. Metal interconnection elements form, on the insulating layer, connection pads to which a soldering material is applied. To permit good heat dissipation, the device has a metal plate partially incorporated in the insulating layer and having a surface which is coplanar with the pads and to which soldering material is applied. The electronic device is secured to a mounting substrate having a corresponding metal plate.
摘要翻译：电子器件形成在由绝缘材料层覆盖的半导体材料的芯片上。金属互连元件在绝缘层上形成施加焊接材料的连接焊盘。为了允许良好的散热，该器件具有部分地并入绝缘层中的金属板，并且具有与焊盘共面的表面，并且施加了焊料。电子装置被固定到具有对应的金属板的安装基板上。

3. 发明申请

US20060060947A1 Method and apparatus for removing molding residues from lead-frames 审中-公开
标题翻译：从铅框架中去除模制残留物的方法和装置
公开(公告)号：US20060060947A1
公开(公告)日：2006-03-23
申请号：US11221590
申请日：2005-09-08
申请人： Paolo Crema
发明人： Paolo Crema
IPC分类号： H01L23/495
CPC分类号： H01L21/4835 , H01L24/73 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2924/15747 , H01L2924/30107 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A method is provided for removing molding residues from surfaces of a lead-frame for electronic devices, with a portion of the lead-frame being exposed from at least one insulating body formed by the molding. According to the method, a flow of accelerated pellets of a frozen substance is generated, and at least one exposed surface of the lead-frame is hit with the generated flow. Also provided are a method of packaging electronic devices, and an apparatus for generating a flow of frozen pellets for removing molding residues from surfaces of a lead-frame.
摘要翻译：提供一种用于从用于电子设备的引线框架的表面去除模制残余物的方法，其中引线框架的一部分从由模制形成的至少一个绝缘体暴露。根据该方法，产生冷冻物质的加速丸粒的流动，并且利用产生的流动来撞击引线框架的至少一个暴露表面。还提供了一种包装电子装置的方法，以及用于产生用于从引线框架的表面去除模制残余物的冷冻颗粒流的装置。

4. 发明授权

US06221696B1 Process for improving the adhesion between metal and plastic in containment structures for electronic semiconductor devices 有权
标题翻译：用于改善电子半导体器件的封闭结构中的金属和塑料之间的粘合性的方法
公开(公告)号：US06221696B1
公开(公告)日：2001-04-24
申请号：US09397488
申请日：1999-09-16
申请人： Paolo Crema , Carlo Alberto Passagrilli
发明人： Paolo Crema , Carlo Alberto Passagrilli
IPC分类号： H01L2144
CPC分类号： H01L21/4821 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A process comprises the following operations: forming a structure of metal elements with functions of support and electrical connection, these metal elements having a high degree of surface finish; fixing a chip of semiconductor material, containing active parts and contact pads, to an area of a metal element of the structure acting as a support; electrically connecting the contact pads of the chip to predetermined metal elements of the structure acting as terminal conductors; and incorporating in plastic the chip of semiconductor material and part of the structure of metal elements. To improve the adhesion between the structure and the plastic, at least part of the surface of the metal elements is roughened by irradiation with a laser light beam.
摘要翻译：一种方法包括以下操作：形成具有支撑和电连接功能的金属元件的结构，这些金属元件具有高度的表面光洁度; 将包含活性部分和接触垫的半导体材料芯片固定到作为支撑体的结构的金属元件的区域; 将芯片的接触焊盘电连接到用作端子导体的结构的预定金属元件; 并在塑料中掺入半导体材料的芯片和部分金属元素的结构。为了改善结构和塑料之间的粘合性，通过用激光束照射使金属元件表面的至少一部分变得粗糙。

5. 发明授权

US5789279A Method and apparatus for electrically insulating heat sinks in electronic power devices 失效
标题翻译：电子功率器件电绝缘散热片的方法和装置
公开(公告)号：US5789279A
公开(公告)日：1998-08-04
申请号：US527858
申请日：1995-09-14
申请人： Paolo Crema
发明人： Paolo Crema
IPC分类号： H01L23/40 , H01L23/36 , H01L23/367 , H01L23/373 , H01L23/433 , H01L21/44
CPC分类号： H01L23/4334 , H01L23/367 , H01L23/3735 , H01L2924/0002
摘要： A method and apparatus for electrically insulating heat sinks in electronic power devices that includes the formation of an insulating layer on the face of the electronic device having the heat sink. The insulating layer may be formed from an epoxy resin, commonly known as "solder mask" in the manufacture of printed circuits.
摘要翻译：一种电子功率器件电绝缘散热器的方法和装置，包括在具有散热器的电子设备的表面上形成绝缘层。绝缘层可以由印刷电路制造中通常称为“焊接掩模”的环氧树脂形成。

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