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1. 发明授权

US5698385A Silver halide photosensitive material 失效
标题翻译：卤化银感光材料
公开(公告)号：US5698385A
公开(公告)日：1997-12-16
申请号：US446868
申请日：1995-06-05
申请人： Noriyuki Ousaka , Yasuhiro Okada , Satoshi Kanetake , Kunio Ishigaki
发明人： Noriyuki Ousaka , Yasuhiro Okada , Satoshi Kanetake , Kunio Ishigaki
IPC分类号： G03C1/95 , G03C1/32
CPC分类号： G03C1/95 , Y10S430/151
摘要： The silver halide photosensitive material of the invention comprises a support, at least one photosensitive silver halide emulsion layer provided on the support and a protective layer provided on the photosensitive silver halide emulsion layer. The protective layer contains agglomerate particles each of which is formed from plural primary particles having a particle diameter smaller than the thickness of the protective layer. For example, agglomerate particles having a mean particle diameter of 0.2 to 30 .mu.m composed of primary particles having a mean particle diameter of 0.01 to 10 .mu.m are contained in the protective layer having a thickness of 0.1 to 10 .mu.m. By the use of such agglomerate particles as matting agent particles, pin-holes caused by sinking of the matting agent can be inhibited and the Bekk second can be made not longer than 2,000 seconds. Moreover, this matting agent has good affinity for gelatin and is almost free from powder-dropping.
摘要翻译： PCT No.PCT / JP95 / 00247 Sec。 371日期：1995年6月5日 102（e）1995年6月5日PCT 1995年2月21日提交PCT公布。 WO95 / 22786 PCT公开号日期1995年8月24日本发明的卤化银感光材料包含载体，至少一个设置在载体上的感光卤化银乳剂层和设置在感光卤化银乳剂层上的保护层。保护层含有凝集体颗粒，每个颗粒由具有小于保护层厚度的粒径的多个初级颗粒形成。例如，在厚度为0.1〜10μm的保护层中含有平均粒径为0.01〜10μm的由一次粒子构成的平均粒径为0.2〜30μm的附聚粒子。通过使用作为消光剂颗粒的凝聚颗粒，可以抑制由消光剂吸收引起的针孔，并且可以使Bekk秒不超过2000秒。此外，该消光剂对明胶具有良好的亲和力，并且几乎没有粉末滴落。

2. 发明授权

US5162087A Anisotropic conductive adhesive compositions 失效
标题翻译：各向异性导电粘合剂组合物
公开(公告)号：US5162087A
公开(公告)日：1992-11-10
申请号：US753198
申请日：1991-08-30
申请人： Hidemoto Fukuzawa , Tatsuhiro Imai , Yasuhiro Okada , Noriyuki Ousaka
发明人： Hidemoto Fukuzawa , Tatsuhiro Imai , Yasuhiro Okada , Noriyuki Ousaka
IPC分类号： C09J135/00 , C08K9/08 , C09J1/02 , C09J9/02 , C09J133/04 , C09J133/08 , C09J201/00 , H01B1/22 , H05K3/32 , H05K3/36
CPC分类号： H05K3/323 , C08K9/08 , C09J133/08 , H01B1/22 , H01L2924/07811 , H05K2201/0221 , H05K2201/0224 , H05K2201/0233 , H05K3/361
摘要： An anisotropic conductive adhesive composition comprising an insulating adhesive component and particles dispersed in said insulating adhesive component, said anisotropic conductive adhesive composition being characterized in thatsaid insulating adhesive component comprises a copolymer of acrylic ester having an alkyl group of 1-4 carbon atoms and a maleimide derivative,5 to 60 parts by weight, based on 100 parts by weight of the copolymer, of a thermosetting resin, and0.05 to 5.0 parts by weight, based on 100 parts by weight of the copolymer, of a coupling agent, andsaid particles are metallic-layer containing particles comprising a core made of resin, a metallic layer covering said core and a resin layer formed from finely divided resin fixed by the dry blending method on the surface of said metallic layer.

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