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    • 1. 发明授权
    • Method and apparatus for positional detection using pattern matching process
    • 使用模式匹配处理的位置检测方法和装置
    • US06320977B1
    • 2001-11-20
    • US08962842
    • 1997-11-03
    • Nobufumi Tokura
    • Nobufumi Tokura
    • G06K968
    • G06K9/6202
    • A first signal represents an image of an object to be inspected. Portions of the first signal are selected as second signals respectively. The second signals represent partial images of the inspected-object image respectively. The partial images are of a given size. The second signals are compared with a third signal representing a predetermined reference image of a size equal to the size of the partial images, and thereby pattern matching is executed between the partial images and the reference image. Calculation is made as to scores of the pattern matching between the partial images and the reference image. A maximum score is selected from among the calculated scores. A fourth signal is generated which represents a position of the partial image corresponding to the maximum score. The partial-image position is defined as being relative to the inspected-object image. An invalid area of the reference image is determined according to a fifth signal representing a predetermined unreliable image area. A part of the third signal, which corresponds to the invalid area of the reference image, is excluded from the pattern matching.
    • 第一信号表示待检查对象的图像。 第一信号的部分被分别选择为第二信号。 第二信号分别表示检查对象图像的部分图像。 部分图像具有给定的尺寸。 将第二信号与表示尺寸等于部分图像的尺寸的预定参考图像的第三信号进行比较,从而在部分图像和参考图像之间执行图案匹配。 对部分图像和参考图像之间的图案匹配的分数进行计算。 从计算得分中选出最大分数。 产生代表对应于最大分数的部分图像的位置的第四信号。 部分图像位置被定义为相对于被检查对象图像。 根据表示预定的不可靠图像区域的第五信号来确定参考图像的无效区域。 从图案匹配中排除对应于参考图像的无效区域的第三信号的一部分。
    • 3. 发明授权
    • Method and apparatus for inspecting solder portions using fuzzy inference
    • 使用模糊推理检查焊料部分的方法和装置
    • US5293324A
    • 1994-03-08
    • US867643
    • 1992-04-13
    • Nobufumi Tokura
    • Nobufumi Tokura
    • G01B11/24G01N21/88G01N21/956G06T1/00G06T7/00H04N7/18H05K3/34G06F15/62
    • G06T7/0004G01N21/95684G06T2207/20076G06T2207/30152
    • An image of the solder portion is taken. Values of goodness/poorness judgment factors are calculated from the image of the solder portion. Grades of the goodness/poorness judgment factors are calculated from the values of the goodness/poorness judgment factors and from predetermined membership functions of the goodness/poorness judgment factors according to predetermined rules each having a condition part related to the goodness/poorness judgment factors and a conclusion part related to a goodness degree. Partial figures are calculated from predetermined membership functions of the goodness degree and from the calculated grades of the goodness/poorness judgment factors. The partial figures are combined into a final figure. A position of a centroid of the final figure is calculated. A decision is made as to whether or not the solder portion is good on the basis of the calculated position of the centroid with respect to a predetermined judgment scale.
    • 拍摄焊料部分的图像。 根据焊料部分的图像计算出良好/不良判定因子的值。 善/劣判定因子的等级根据善/劣判定因子的值和根据具有与善/劣判断因子有关的条件部分的规定规则的善/劣判定因子的规定隶属度函数计算, 一个与善良程度有关的结论部分。 部分数字是根据善意程度的预定隶属函数和善/劣判断因子的计算等级计算的。 部分数字组合成最终数字。 计算最终数字的质心位置。 根据所计算出的重心位置相对于预定的判断标度,判断焊料部分是否良好。
    • 6. 发明授权
    • Apparatus for and method of detecting shape of solder portion
    • 焊料部分形状检测方法及方法
    • US5267217A
    • 1993-11-30
    • US671413
    • 1991-03-20
    • Nobufumi TokuraShoichi Nishi
    • Nobufumi TokuraShoichi Nishi
    • G01B11/24G01R31/309H05K13/08G01N21/00
    • G01B11/24G01R31/309G01N2021/95646G01N21/95684
    • The surface of a solder portion is specular. Besides, it includes a flat plane, a steep inclined plane and a gentle inclined plane. Accordingly, when light is projected toward the solder portion in a specified direction and light reflected from the solder portion is observed with a camera, an image having the contrast between brightness and darkness is obtained. The present invention utilizes such light reflection characteristics of the solder portion in order to judge whether the shape of the solder portion is good or bad. According to the present invention, light is projected toward a solder portion for bonding the electrode of an electrical component to a substrate, in directions of at least two angles, and the solder portion is observed by a camera disposed above this solder portion. Subsequently, image data items picked up at the respective angles by the camera are stored in corresponding image memories, and the image data items are processed in combination by an image processor. Subsequently, image data having the feature of the shape of the solder portion as generated by the processing is stored in an image memory, and the quality of the shape of the solder portion is judged on the basis of the generated image data by a CPU.
    • 焊料部分的表面是镜面的。 此外,它包括平面,陡峭的倾斜平面和平缓的倾斜平面。 因此,当在指定方向上将光投射到焊料部分时,用相机观察从焊料部分反射的光线时,可获得亮度和黑度之间的对比度的图像。 本发明利用焊料部分的这种光反射特性来判断焊料部分的形状是好是坏。 根据本发明,将光线朝向用于将电气部件的电极至基板的至少两个角度的方向接合的焊料部分,并且通过位于该焊料部分上方的照相机观察焊料部分。 随后,通过照相机以各个角度拍摄的图像数据项被存储在对应的图像存储器中,并且图像数据项由图像处理器组合处理。 随后,将具有由该处理产生的焊料部分形状的特征的图像数据存储在图像存储器中,并且基于由CPU生成的图像数据来判断焊料部分的形状的质量。
    • 9. 发明授权
    • Method and apparatus for inspecting solder portions
    • 用于检查焊料部分的方法和装置
    • US5598345A
    • 1997-01-28
    • US225944
    • 1994-04-11
    • Nobufumi Tokura
    • Nobufumi Tokura
    • G01N21/88G01N21/956G01R31/04G01R31/309H05K13/08G06F17/50
    • G01R31/048G01N21/88G01N21/95684G01R31/309H05K13/08G01N2021/8867G01N2021/95615G01N2021/95661
    • An image taking device serves to take an image of an object to be inspected, and outputs an image signal representative thereof. A first deciding device serves to decide a condition of the object in response to the image signal. A measuring device serves to measure a shape of the object, and outputs a height signal representative of a height of the object. A second deciding device serves to decide a condition of the object in response to the height signal. A control device serves to, in cases where the first deciding device can not detect the condition of the object, enable the measuring device to measure the shape of the object and enable the second deciding device to decide the condition of the object, and enable the first deciding device to execute a leaning process on the object in response to a result of the decision by the second deciding device.
    • 图像摄取装置用于拍摄要检查的对象的图像,并输出代表其的图像信号。 第一判定装置用于响应于图像信号来确定对象的状况。 测量装置用于测量物体的形状,并输出表示物体的高度的高度信号。 第二判定装置用于响应于高度信号来确定对象的状况。 控制装置用于在第一判定装置不能检测到物体的状况的情况下,使得测量装置能够测量对象的形状,并且使得第二判定装置能够决定对象的状态,并使能 第一判定装置响应于第二判定装置的判定结果,对对象执行倾斜处理。