会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • METHOD OF CLEANING SUBSTRATE PROCESSING APPARATUS
    • 清洗基板加工装置的方法
    • US20120273011A1
    • 2012-11-01
    • US13450654
    • 2012-04-19
    • Naoyuki OSADAKentaro SUGIMOTO
    • Naoyuki OSADAKentaro SUGIMOTO
    • B08B7/04B08B5/02B08B3/02
    • B08B3/02H01L21/02002H01L21/02082H01L21/67051
    • A spin base is caused to rotate at a number of revolutions of from 250 rmp to 350 rpm (first number of revolutions), and at the same time, a cleaning solution is supplied to a holding surface of a spin base while the upper end of a processing cup is placed below the holding surface. Thus, an outer upper surface of the processing cup is cleaned with the cleaning solution scattered from the holding surface. Then, the spin base is caused to rotate at a number of revolutions of from 350 rpm to 450 rpm (second number of revolutions) higher than the first number of revolutions, and at the same time, a cleaning solution is supplied onto the holding surface. Thus, a partition plate outside the processing cup is cleaned with the cleaning solution scattered from the rotating holding surface.
    • 使旋转基座以250rmp至350rpm的转数(第一转数)旋转,同时将清洗液供给到旋转基材的保持表面,同时, 处理杯放置在保持表面下方。 因此,处理杯的外部上表面被从保持表面散射的清洁溶液清洁。 然后,旋转基座以比第一转数高350rpm至450rpm(第二转数)的转数旋转,同时将清洗液供给到保持面 。 因此,从旋转的保持面散开的清洗液清洗处理杯外部的隔板。
    • 3. 发明授权
    • Nozzle and a substrate processing apparatus including the same
    • 喷嘴和包括该喷嘴的基板处理装置
    • US09027577B2
    • 2015-05-12
    • US11871595
    • 2007-10-12
    • Naoyuki OsadaMasashi SawamuraKoji Hasegawa
    • Naoyuki OsadaMasashi SawamuraKoji Hasegawa
    • B08B3/12H01L21/67
    • H01L21/67051H01L21/6708
    • A nozzle of a nozzle device includes an arm pipe that extends in a horizontal direction and a downstream pipe formed so as to curve downward from one end of the arm pipe. In the nozzle, a metallic pipe is provided inside a second resin pipe. Moreover, a first resin pipe is provided inside the metallic pipe. A boss is attached to the tip of the metallic pipe between the first resin pipe and the second resin pipe. At the tip of the nozzle, an outer peripheral surface of the first resin pipe, an end surface of the second resin pipe and an end surface of the boss are welded by welding resin. In this way, the metallic pipe is reliably coated with the first resin pipe, the second resin pipe, the boss and the welding resin.
    • 喷嘴装置的喷嘴包括沿水平方向延伸的臂管和形成为从臂管的一端向下弯曲的下游管。 在喷嘴中,金属管设置在第二树脂管的内部。 此外,第一树脂管设置在金属管内。 在第一树脂管和第二树脂管之间的金属管的末端附接有凸台。 在喷嘴的尖端,通过焊接树脂焊接第一树脂管的外周面,第二树脂管的端面和凸台的端面。 以这种方式,金属管可靠地涂覆有第一树脂管,第二树脂管,凸台和焊接树脂。
    • 6. 发明授权
    • Method of cleaning substrate processing apparatus
    • 清洗基板处理装置的方法
    • US09190300B2
    • 2015-11-17
    • US13450654
    • 2012-04-19
    • Naoyuki OsadaKentaro Sugimoto
    • Naoyuki OsadaKentaro Sugimoto
    • B08B7/00H01L21/67
    • B08B3/02H01L21/02002H01L21/02082H01L21/67051
    • A spin base is caused to rotate at a number of revolutions of from 250 rmp to 350 rpm (first number of revolutions), and at the same time, a cleaning solution is supplied to a holding surface of a spin base while the upper end of a processing cup is placed below the holding surface. Thus, an outer upper surface of the processing cup is cleaned with the cleaning solution scattered from the holding surface. Then, the spin base is caused to rotate at a number of revolutions of from 350 rpm to 450 rpm (second number of revolutions) higher than the first number of revolutions, and at the same time, a cleaning solution is supplied onto the holding surface. Thus, a partition plate outside the processing cup is cleaned with the cleaning solution scattered from the rotating holding surface.
    • 使旋转基座以250rmp至350rpm的转数(第一转数)旋转,同时将清洗液供给到旋转基材的保持表面,同时, 处理杯放置在保持表面下方。 因此,处理杯的外部上表面被从保持表面散射的清洁溶液清洁。 然后,旋转基座以比第一转数高350rpm至450rpm(第二转数)的转数旋转,同时将清洗液供给到保持面 。 因此,从旋转的保持面散开的清洗液清洗处理杯外部的隔板。