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    • 6. 发明申请
    • ABRASIVE RECOVERY METHOD AND ABRASIVE RECOVERY DEVICE
    • 磨料回收方法和磨料回收装置
    • US20130333299A1
    • 2013-12-19
    • US13972364
    • 2013-08-21
    • NOMURA MICRO SCIENCE CO., LTD.
    • Keiichiro IshiiShoji Hioki
    • B24B57/00
    • B24B57/00B01D61/18B01D63/02B01D2317/022B24B57/02C02F1/444C02F2103/346
    • There is provided an abrasive recovery device and an abrasive recovery method capable of recovering a slurry which is condensed until a concentration of its abrasive becomes high while suppressing an increase in pressure loss and a great decrease in a recovery ratio ascribable to membrane clogging. The abrasive recovery device is a device 1 which recovers an abrasive from a used polishing slurry which has been used in a CMP process, the device including a separation membrane 41 having a cylindrical hole passage to which the used polishing slurry is led, wherein an effective filtration part of the hole passage of the separation membrane 41 has a 0.8 m length or less, and the abrasive recovery device 1 condenses the used polishing slurry until a concentration of the abrasive becomes 10 mass % or more.
    • 提供了一种磨料回收装置和磨料回收方法,其能够回收冷凝的浆料,直到其研磨剂的浓度变高,同时抑制压力损失的增加和由于膜堵塞引起的回收率的大幅降低。 磨料回收装置是从已经用于CMP工艺的已使用的抛光浆料中回收研磨剂的装置1,该装置包括具有圆柱形孔通道的分离膜41,所述抛光浆料被引导到其上,其中有效的 分离膜41的孔通道的过滤部分的长度为0.8μm以下,研磨回收装置1将研磨用浆料冷凝,直到研磨剂的浓度达到10质量%以上。