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    • 2. 发明授权
    • Manufacturing method of semiconductor device
    • 半导体器件的制造方法
    • US07064046B2
    • 2006-06-20
    • US10771497
    • 2004-02-05
    • Motoaki WakuiIsao OchiaiRon EyalGil Shetrit
    • Motoaki WakuiIsao OchiaiRon EyalGil Shetrit
    • H01L21/30H01L21/46
    • H01L21/78
    • The invention provides an algorithm for aligning a rotating blade in a dicing process of partially dicing a wafer attached to a substrate. A width of a cut groove and distance between pads in the cut groove are detected by a recognition camera. Based on a result of this detection, alignment data Δy which is distance between a centerline of the width of the cut groove and a real centerline are calculated. Based on a difference between the distance of the pads in the cut groove and a target value of the distance, data Δz on alignment in a depth direction of the cut groove is calculated. The rotating blade is aligned by using the alignment data Δy and Δz.
    • 本发明提供了一种用于在切割附着于基底的晶片的切割工艺中对准旋转刀片的算法。 切割槽的宽度和切割槽中的焊盘之间的距离由识别照相机检测。 基于该检测的结果,计算作为切割槽的宽度的中心线与实际中心线之间的距离的对准数据Deltay。 基于切槽中的焊盘的距离与距离的目标值之间的差异,计算切割槽的深度方向上的对准的数据Deltaz。 旋转刀片通过使用对准数据Deltay和Deltaz对齐。