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    • 4. 发明授权
    • Method of making a semiconductor switching device
    • 制造半导体开关器件的方法
    • US4380114A
    • 1983-04-19
    • US236258
    • 1981-02-20
    • Monty F. Webb
    • Monty F. Webb
    • H01L29/417H01L29/747H01L21/603H01L21/28H01L21/302H01L21/56
    • H01L29/747H01L24/36H01L24/37H01L24/40H01L24/41H01L29/41716H01L2224/32145H01L2224/37011H01L2224/40095H01L2224/40245H01L2224/4103H01L2924/10253H01L2924/12036H01L2924/13033H01L2924/181
    • A triac device includes a first silicon chip having regions of alternate conductivity type disposed in a PN-junction forming relationship which defines a center-fired triac. A second silicon chip having regions defining a diac is bonded to the gate region of the triac chip. A copper layer of about 1 to 5 mils in thickness is bonded to the portions of the top major face of the triac chip that surround the gate region. Cathode, anode and gate connections are provided to the two-chip subassembly which is then encapsulated. The copper layer permits a smaller cathode connection to be made to the top of the triac chip without reducing the current capacity of the device.The triac device is mass-produced by first forming a plurality of triac chips in a two-dimensional array in a large area silicon wafer. The copper layers and diac chips are formed on the wafer prior to its separation into separate diac-triac chip subassemblies.
    • 三端双向可控硅开关元件装置包括具有交替导电类型区域的第一硅芯片,其以定义中心点火三端双向可控硅开关的PN结形成关系布置。 具有限定双向晶闸管的区域的第二硅芯片被接合到三端双向串联芯片的栅极区域。 约1至5密耳厚度的铜层结合到围绕栅极区域的三端双向串联芯片的顶部主面的部分。 阴极,阳极和栅极连接提供给双芯片子组件,然后封装。 铜层允许在三端双向串联芯片的顶部形成更小的阴极连接,而不会降低器件的电流容量。 通过首先在大面积硅晶片中以二维阵列形成多个三端双向可控硅开关芯片芯片,大量生产三端双向可控硅开关元件装置。 在分离成单独的双向晶闸管芯片组件之前,在晶片上形成铜层和diac芯片。
    • 5. 发明授权
    • Primary telephone line protector with failsafe
    • 主要电话线路保护器具有故障安全
    • US06980647B1
    • 2005-12-27
    • US09481460
    • 2000-01-11
    • Darren J. DaughertyDennis M. McCoyby Carol G. McCoyMonty F. WebbPaul A. LangerKurt A. Wattelet
    • Darren J. DaughertyDennis M. McCoyby Carol G. McCoyMonty F. WebbPaul A. LangerKurt A. Wattelet
    • H04M1/00H04M9/00H04M9/08H04M19/00
    • H04M19/00
    • Disclosed is a module (10) having pins (16-24) connected to respective conductor tower strips (46, 48, 50, 52). Pairs (46, 50 and 48, 52) of the conductor tower strips are spring biased toward each other to capture therebetween respective PTC current limiting elements (64, 70). A spring member 60 is connected to a ground pin (24) at one end, and to an overvoltage sensitive assembly at the other end, via a soldered heat transfer member (92). The overvoltage sensitive assembly includes overvoltage semiconductor devices (76, 77, 79) soldered thereto. When an overvoltage condition is sensed, the heat generated by the devices melts the solder between the heat transfer member (92) and the spring member (60), whereby lateral arms (90) of the spring member (60) move and engage the conductor tower strips (50, 52). The tip and ring pins (16, 18) of the module (10) are not only shorted together, but are shorted to ground.
    • 公开了一种具有连接到相应的导体塔条(46,48,50,52)上的引脚(16-24)的模块(10)。 导体塔条的对(46,50和48,52)朝向彼此弹簧偏置以在其间捕获相应的PTC限流元件(64,70)。 弹簧构件60通过焊接传热构件(92)在一端连接到接地销(24),并在另一端连接到过电压敏感组件。 过电压敏感组件包括焊接到其上的过电压半导体器件(76,77,79)。 当检测到过电压状态时,由器件产生的热量在传热部件(92)和弹簧部件(60)之间熔化焊料,由此弹簧部件(60)的横向臂(90)移动并接合导体 塔条(50,52)。 模块(10)的尖端和环形销(16,18)不仅短路在一起,而且与地面短路。