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    • 1. 发明授权
    • Large scale integrated package structure
    • 大规模集成封装结构
    • US5327326A
    • 1994-07-05
    • US98771
    • 1993-07-29
    • Mitsuo KomotoHiroshi Endoh
    • Mitsuo KomotoHiroshi Endoh
    • G06F3/00H01L23/58H05K1/02H05K1/14H05K1/18H05K7/02H01R23/68H01R29/00
    • H01R24/50H01R12/523H01R23/688H05K7/02H01R2103/00H05K1/0263H05K1/141
    • An LSI package structure with high efficiency of the power supply and fast transmission of the signal is provided in which: adjacent to a pin 8 side surface of an LSI package 1, a power supply member 2 having an electrically conductive portions 6 and 7 for power supply bus and ground bus respectively, and a flexible interconnection board 3 having a power supply pattern layer 3b and a ground pattern layer 3a connected to the portions 6 and 7 respectively via a pin 9, are disposed; the pins 8 and 9 each extend through a through hole 3c formed on the interconnection board 3, the power supply pattern layer 3b and the pins 8 and 9 for power supply being interconnected within the through hole, the ground pattern layer 3a and the pins 8 and 9 for grounding being interconnected within the through hole; and the signal input/output pin 8 and a connector 5 of a signal input/output coaxial cable 5a are interconnected at the side of the interconnection board 3 oppsite the LSI package 1.
    • 提供了具有高效率的电源和信号的快速传输的LSI封装结构,其中:与LSI封装1的引脚8侧表面相邻,具有用于电力的导电部分6和7的电源构件2 电源总线和接地总线,以及分别经由引脚9分别连接到部分6和7的电源图案层3b和接地图案层3a的柔性互连板3; 销8和9各自延伸穿过形成在互连板3上的通孔3c,供电图案层3b和用于供电的销8和9在通孔内相互连接,接地图案层3a和销8 和9用于在通孔内互连的接地; 并且信号输入/输出同轴电缆5a的信号输入/输出引脚8和连接器5在互连板3侧与LSI封装1接合。
    • 4. 发明授权
    • Electrical connector
    • 电连接器
    • US5044973A
    • 1991-09-03
    • US467872
    • 1990-01-19
    • Atsuhito NodaOsamu HashiguchiMitsuo KomotoShoji Umesato
    • Atsuhito NodaOsamu HashiguchiMitsuo KomotoShoji Umesato
    • H01R24/00H01R13/193
    • H01R13/193
    • For facilitating an electrical connection of a conductive connection pin (7) to a conductive contact (11) held to a base insulator (13), an electrical connector includes a preload pin (23) which is for carrying out beforehand displacement of a contact portion (21) of the conductive contact at a first position. The preload pin is held to a slider (19) which is placed between the base insulator and a cover insulator (17) and which is movable in a predetermined direction. The cover insulator and the slider have guide and elongated holes (15, 25), respectively, for passing the connection pin therethrough. The elongated hole is greater than the connection pin in a size of the predetermined direction. Therefore, it is possible without movement of the connection pin to move the preload pin in the predetermined direction to a second position at which the preload pin does not carry out the displacement of the contact portion.
    • 为了促进导电连接销(7)与保持在基座绝缘体(13)上的导电触头(11)的电连接,电连接器包括一个预载销(23),用于预先移动接触部分 (21)在第一位置处的导电接触。 预载销保持在滑块(19)上,该滑块(19)被放置在基座绝缘体和盖子绝缘体(17)之间,并且可沿预定方向移动。 盖绝缘体和滑块分别具有用于使连接销穿过其中的引导和细长孔(15,25)。 长孔比规定方向的连接销大。 因此,可以在不使连接销移动的情况下将预压销沿预定方向移动到预加载销不执行接触部分的位移的第二位置。
    • 5. 发明授权
    • Liquid cooling system for integrated circuit chips
    • 集成电路芯片的液体冷却系统
    • US4854377A
    • 1989-08-08
    • US931847
    • 1986-11-18
    • Mitsuo KomotoYouichi MatsuoToshifumi Sano
    • Mitsuo KomotoYouichi MatsuoToshifumi Sano
    • H01L23/433H01L23/473
    • H01L23/433H01L23/473H01L2924/0002H01L2924/3011
    • A cooling system for integrated circuit chips comprises a substrate, a plurality of integrated circuit chips mounted on a first surface of the substrate and a second surface opposite to the first surface thereof, a heat conductive means having a first surface and a second, flat surface opposite to the first surface, a layer of thermally conductive bonding material between the second surface of the substrate and the first surface of the heat conductive means, and a heat exchanger having a flat surface and provided with inlet and outlet means to permit liquid coolant to flow through the heat exchanger in contact with the flat surface. The heat exchanger is removably mounted to the heat conductive means with the flat surface thereof being in close proximity to the second surface of the heat conductive means. The thermally conductive bonding material allows a low thermal resistance contact to be made between the substrate and the heat conductive means and allows the latter to present a flat plane to the heat exchanger so that a low thermal resistance contact can also be established therebetween.
    • 集成电路芯片的冷却系统包括:基板,安装在基板的第一表面上的多个集成电路芯片和与其第一表面相对的第二表面;导热装置,具有第一表面和第二平坦表面 与第一表面相对的是在基片的第二表面和导热装置的第一表面之间的导热接合材料层,以及具有平坦表面并具有入口和出口装置的热交换器,以允许液体冷却剂 流过与平坦表面接触的热交换器。 热交换器可移除地安装到导热装置上,其平坦表面紧邻导热装置的第二表面。 导热接合材料允许在基板和导热装置之间形成低热阻接触,并允许热接触面向热交换器提供平面,使得它们之间也可建立低热阻接触。
    • 9. 发明授权
    • Electrical connector comprising combination of individual mating and pin
elements as a contact member
    • 电连接器包括作为接触构件的单个配合和销元件的组合
    • US4832611A
    • 1989-05-23
    • US108784
    • 1987-10-15
    • Atsuhito NodaYoshiaki IchimuraMitsuo KomotoShoji Umesato
    • Atsuhito NodaYoshiaki IchimuraMitsuo KomotoShoji Umesato
    • H01R13/02H01R12/71H01R13/11H01R13/20
    • H01R12/58H01R13/20
    • For electrically connecting a conductive terminal member (13) to an electric circuit board (12), an electrical connector includes a contact member (30) which comprises a terminal pin element (31) and a mating contact element (32) as individual parts. The terminal pin element is inserted into a through hole (14) and secured to the electric circuit board by soldering. The mating contact element is mated with the terminal pin element within an insulator housing (16) so that it is possible to correct position error of a contact portion (42) of the mating contact element. The conductive terminal member is inserted into the insulator housing and is then moved by a driving member (17) which is slidable along the insulator housing. Therefore, the conductive terminal member is brought into contact with a contract portion of the mating contact element. As a result, electrical connection is reliably made between the terminal member and an electrical circuit on the electric circuit board.
    • 为了将导电端子构件(13)电连接到电路板(12),电连接器包括作为单独部件的包括端子销元件(31)和配合接触元件(32)的接触构件(30)。 端子销元件插入通孔(14)中,通过焊接固定在电路板上。 配合接触元件与绝缘体壳体(16)内的端子销元件配合,使得可以校正配合接触元件的接触部分(42)的位置误差。 导电端子构件插入到绝缘体壳体中,然后通过可沿着绝缘体壳体滑动的驱动构件(17)移动。 因此,导电端子构件与配合接触元件的接合部接触。 结果,可靠地在端子构件和电路板上的电路之间进行电连接。