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1. 发明授权

US07959400B2 Aligner, wafer transferring device, and semiconductor production device 有权
标题翻译：对准器，晶片转移装置和半导体制造装置
公开(公告)号：US07959400B2
公开(公告)日：2011-06-14
申请号：US11873770
申请日：2007-10-17
申请人： Mitsuaki Hagio , Shin Osaki , Keisuke Yoshino
发明人： Mitsuaki Hagio , Shin Osaki , Keisuke Yoshino
IPC分类号： H01L21/68
CPC分类号： H01L21/682 , H01L21/68 , H01L21/68707 , H01L21/68728 , Y10S414/136
摘要： In a preferred embodiment, an aligner includes a grip mechanism provided with a plurality of damp arms for holding an external periphery of a wafer; a rotary mechanism for rotating the grip mechanism to rotate the wafer in a prescribed rotational direction, and a lifter mechanism provided with a plurality of lift arms for lifting up the wafer above the grip mechanism. The aligner is configured to align the wafer by the grip operation of the grip mechanism and the rotary operation of the rotary mechanism, and one or more of the plurality of the lift arms which interfere with one or more of the plurality of clamp arms at the time of lifting up the plurality of lift arms are engaged with restriction members provided on the grip mechanism to prevent an upward movement thereof.
摘要翻译：在优选实施例中，对准器包括夹持机构，该夹持机构设置有用于保持晶片的外周的多个湿臂; 旋转机构，用于使所述夹持机构旋转以使所述晶片沿规定的旋转方向旋转;以及升降机构，其设置有用于将所述晶片提升到所述夹持机构上方的多个提升臂。对准器被配置为通过抓握机构的夹持操作和旋转机构的旋转操作以及多个提升臂中的一个或多个在多个夹臂中的一个或多个与提升多个提升臂的时间与设置在抓握机构上的限制构件接合以防止其向上移动。

2. 发明申请

US20090053029A1 ALIGNER 有权
标题翻译：对准
公开(公告)号：US20090053029A1
公开(公告)日：2009-02-26
申请号：US11917076
申请日：2006-05-25
申请人： Keisuke Yoshino , Mitsuaki Hagio , Shin Osaki , Yoshihiro Kusama
发明人： Keisuke Yoshino , Mitsuaki Hagio , Shin Osaki , Yoshihiro Kusama
IPC分类号： H01L21/68
CPC分类号： H01L21/682 , H01L21/67259 , Y10S414/136 , Y10S414/141 , Y10T279/1291 , Y10T279/1953
摘要： It is an object to provide an aligner for centering a wafer and adjusting an angle of a notch or the like of the wafer while gripping edges of the wafer capable of attaining a shortened takt time and miniaturization of the apparatus by employing a mechanism capable of infinite rotation without being restricted by a rotational range, by eliminating cables and/or tubes at the rotating portion. The link mechanism for causing opening and closing movements of the gripping mechanism for gripping a wafer 1 is supported via a bearing 14 with respect to the link mechanism driving portion for driving the link mechanism so that only the gripping portion and the link mechanism can be rotated.
摘要翻译：本发明的目的是提供一种用于使晶片居中并调整晶片的凹口等的角度的对准器，同时通过采用能够无限大的机构来抓住晶片的能够获得缩短的时间和小型化的晶片的边缘通过消除旋转部分处的电缆和/或管而不受旋转范围的限制。用于使用于夹持晶片1的把持机构的打开和关闭运动的连杆机构经由轴承14相对于用于驱动连杆机构的连杆机构驱动部分被支撑，使得只有夹持部分和连杆机构能够旋转。

3. 发明申请

US20080095600A1 ALIGNER, WAFER TRANSFERRING DEVICE, AND SEMICONDUCTOR PRODUCTION DEVICE 有权
标题翻译：对位器，转移传输装置和半导体生产装置
公开(公告)号：US20080095600A1
公开(公告)日：2008-04-24
申请号：US11873770
申请日：2007-10-17
申请人： Mitsuaki HAGIO , Shin OSAKI , Keisuke YOSHINO
发明人： Mitsuaki HAGIO , Shin OSAKI , Keisuke YOSHINO
IPC分类号： H01L21/673 , H01L21/68
CPC分类号： H01L21/682 , H01L21/68 , H01L21/68707 , H01L21/68728 , Y10S414/136
摘要： In a preferred embodiment, an aligner includes a grip mechanism provided with a plurality of damp arms for holding an external periphery of a wafer; a rotary mechanism for rotating the grip mechanism to rotate the wafer in a prescribed rotational direction, and a lifter mechanism provided with a plurality of lift arms for lifting up the wafer above the grip mechanism. The aligner is configured to align the wafer by the grip operation of the grip mechanism and the rotary operation of the rotary mechanism, and one or more of the plurality of the lift arms which interfere with one or more of the plurality of clamp arms at the time of lifting up the plurality of lift arms are engaged with restriction members provided on the grip mechanism to prevent an upward movement thereof.
摘要翻译：在优选实施例中，对准器包括夹持机构，该夹持机构设置有用于保持晶片的外周的多个湿臂; 旋转机构，用于使所述夹持机构旋转以使所述晶片沿规定的旋转方向旋转;以及升降机构，其设置有用于将所述晶片提升到所述夹持机构上方的多个提升臂。对准器被配置为通过抓握机构的夹持操作和旋转机构的旋转操作以及多个提升臂中的一个或多个在多个夹臂中的一个或多个与提升多个提升臂的时间与设置在抓握机构上的限制构件接合以防止其向上移动。

4. 发明申请

US20090053019A1 LOAD PORT AND LOAD PORT CONTROL METHOD 审中-公开
标题翻译：负载端口和负载端口控制方法
公开(公告)号：US20090053019A1
公开(公告)日：2009-02-26
申请号：US11908036
申请日：2006-02-22
申请人： Shin Osaki , Mitsuaki Hagio , Takayuki Imanaka
发明人： Shin Osaki , Mitsuaki Hagio , Takayuki Imanaka
IPC分类号： H01L21/677 , B65G49/07
CPC分类号： H01L21/67775
摘要： A load port which has no limitation in a placing direction of a substrate storing container, is flexibly applicable in accordance with a mode of a device to which the load port is connected, and is compact, is provided. Furthermore, the load port having high operation efficiency is provided. The load port is provided with a stage (12) for placing the substrate storing container, and a transferring mechanism for transferring the stage. The load port for opening and closing a cover of the placed substance storing container is provided with a rotating mechanism for rotating the stage (12), and a lifting and lowering mechanism for lifting and lowering the stage.
摘要翻译：在基板收纳容器的放置方向上没有限制的装载口根据装载端子连接的装置的模式灵活地适用，并且是紧凑的。此外，提供了具有高操作效率的负载端口。负载端口设置有用于放置基板储存容器的载物台（12）和用于传送载物台的传送机构。用于打开和关闭放置的物质储存容器的盖子的装载口设置有用于使台架（12）旋转的旋转机构和用于升降台架的升降机构。

5. 发明授权

US07789614B2 Aligner 有权
标题翻译：对齐者
公开(公告)号：US07789614B2
公开(公告)日：2010-09-07
申请号：US11917076
申请日：2006-05-25
申请人： Keisuke Yoshino , Mitsuaki Hagio , Shin Osaki , Yoshihiro Kusama
发明人： Keisuke Yoshino , Mitsuaki Hagio , Shin Osaki , Yoshihiro Kusama
IPC分类号： H01L21/68 , B66C1/42 , C23C16/00
CPC分类号： H01L21/682 , H01L21/67259 , Y10S414/136 , Y10S414/141 , Y10T279/1291 , Y10T279/1953
摘要： It is an object to provide an aligner for centering a wafer and adjusting an angle of a notch or the like of the wafer while gripping edges of the wafer capable of attaining a shortened takt time and miniaturization of the apparatus by employing a mechanism capable of infinite rotation without being restricted by a rotational range, by eliminating cables and/or tubes at the rotating portion. The link mechanism for causing opening and closing movements of the gripping mechanism for gripping a wafer 1 is supported via a bearing 14 with respect to the link mechanism driving portion for driving the link mechanism so that only the gripping portion and the link mechanism can be rotated.
摘要翻译：本发明的目的是提供一种用于使晶片居中并调整晶片的凹口等的角度的对准器，同时通过采用能够无限大的机构来抓住晶片的能够获得缩短的时间和小型化的晶片的边缘通过消除旋转部分处的电缆和/或管而不受旋转范围的限制。用于使用于夹持晶片1的把持机构的打开和关闭运动的连杆机构经由轴承14相对于用于驱动连杆机构的连杆机构驱动部分被支撑，使得只有夹持部分和连杆机构能够旋转。

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