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1. 发明授权

US06551472B2 Electroforming apparatus 失效
标题翻译：电铸设备
公开(公告)号：US06551472B2
公开(公告)日：2003-04-22
申请号：US09879153
申请日：2001-06-13
申请人： Eiji Saito , Masatoshi Suzuki , Minoru Tazoe , Makoto Ito , Yuji Segawa
发明人： Eiji Saito , Masatoshi Suzuki , Minoru Tazoe , Makoto Ito , Yuji Segawa
IPC分类号： C25D1700
CPC分类号： C25D1/10 , C25D1/00 , Y10S204/07
摘要： An electroforming apparatus comprising a container unit for storing the plating solution, a cathode part placed in the container unit and for holding an object to-be-plated and an anode part placed in the container unit face-to-face with the cathode part, wherein a current-conductive opening of the anode part is formed to have an area larger than that of a current-conductive opening of the cathode part.
摘要翻译：一种电铸设备，包括用于存储电镀液的容器单元，放置在容器单元中并用于保持被镀物体的阴极部分和与阴极部分面对面地放置在容器单元中的阳极部分，其中所述阳极部分的导电开口形成为具有大于所述阴极部分的导电开口的面积的面积。

2. 发明申请

US20120062790A1 OPTICAL MEMBER AND OPTICAL MODULE 审中-公开
标题翻译：光学部件和光学模块
公开(公告)号：US20120062790A1
公开(公告)日：2012-03-15
申请号：US13223369
申请日：2011-09-01
申请人： Minoru Tazoe
发明人： Minoru Tazoe
IPC分类号： H04N5/225 , B32B1/04
CPC分类号： G02B27/0006 , G02B7/021 , G02B2207/107 , H04N5/2253 , H04N5/2254 , H04N5/2257 , Y10T428/23
摘要： An optical member is disclosed which can prevent invasion of foreign articles into a space on a light path and can prevent deterioration of the yield in a manufacturing process. The optical member includes a first substrate, a second substrate opposed to the first substrate, a joining element for joining the first and second substrates together in a spaced relationship from each other so as to provide a space between the first substrate and the second substrate, and a porous member provided in the joining element. At least one of the first and second substrates is formed from an optical transmission member. The space between the substrates is closed by the joining element and the porous member.
摘要翻译：公开了一种光学构件，其可以防止外来物品侵入光路上的空间，并且可以防止制造过程中的收率的劣化。光学构件包括第一基板，与第一基板相对的第二基板，用于以彼此间隔开的关系将第一和第二基板接合在一起的接合元件，以便在第一基板和第二基板之间提供空间，以及设置在接合元件中的多孔构件。第一和第二基板中的至少一个由光传输部件形成。基板之间的空间被接合元件和多孔构件封闭。

3. 发明申请

US20090280315A1 RESIN COMPOSITION, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS 审中-公开
标题翻译：树脂组合物，电子设备及制造电子设备的方法
公开(公告)号：US20090280315A1
公开(公告)日：2009-11-12
申请号：US12463608
申请日：2009-05-11
申请人： Minoru Tazoe , Akihiro Yano
发明人： Minoru Tazoe , Akihiro Yano
IPC分类号： B32B5/16 , B05D5/10 , C08K3/40 , C08K3/34
CPC分类号： C09J11/00 , C08K7/16 , Y10T428/25
摘要： A resin composition including an ultraviolet curing resin and ultraviolet-transmitting spherical filler particles having a diameter of 100 μm to 600 μm is provided.
摘要翻译：提供了包含紫外线固化树脂和直径为100〜600μm的紫外线透过性球状填料粒子的树脂组合物。

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