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1. 发明申请

US20080220220A1 Semiconductor die having increased usable area 失效
标题翻译：半导体管芯具有增加的可用面积
公开(公告)号：US20080220220A1
公开(公告)日：2008-09-11
申请号：US11715241
申请日：2007-03-06
申请人： Ken Jian Ming Wang , Ming Wang Sze
发明人： Ken Jian Ming Wang , Ming Wang Sze
IPC分类号： B32B23/02
CPC分类号： H01L29/0657 , H01L23/13 , H01L2924/0002 , Y10T428/24777 , H01L2924/00
摘要： According to one embodiment, a semiconductor die having increased usable area has at least six sides. The semiconductor die has a reduced stress at each corner of the die, resulting in smaller keep out zones near the corners of the semiconductor die, which allow the placement of bond pads near each corner of the die. The semiconductor die further allows the placement of active circuitry near each corner of the semiconductor die. One embodiment results in a 5.0% increase in usable area on the semiconductor die.
摘要翻译：根据一个实施例，具有增加的可用面积的半导体管芯具有至少六个边。半导体管芯在管芯的每个拐角处具有减小的应力，从而在半导体管芯的拐角附近形成较小的保护区域，这允许将接合焊盘放置在管芯的每个拐角附近。半导体管芯进一步允许在半导体管芯的每个拐角附近放置有源电路。一个实施例导致半导体管芯上的可用面积增加了5.0％。

2. 发明申请

US20080220206A1 Semiconductor die for increasing yield and usable wafer area 审中-公开
标题翻译：半导体芯片，用于提高产量和可用的晶圆面积
公开(公告)号：US20080220206A1
公开(公告)日：2008-09-11
申请号：US11715175
申请日：2007-03-06
申请人： Ken Jian Ming Wang , Ming Wang Sze
发明人： Ken Jian Ming Wang , Ming Wang Sze
IPC分类号： B32B3/12
CPC分类号： H01L21/78 , Y10T428/24165
摘要： According to one embodiment, a semiconductor die for increasing usable area of a wafer and for increasing yield has a substantially hexagonal shape. The wafer can have, for example, a circular shape. The semiconductor die can be diced by, for example, using a water-jet-guided laser. In one embodiment, the semiconductor die results in an approximately 2.0% to 4.0% reduction in the unusable area of the wafer. Moreover, the substantially hexagonal shape of the semiconductor die reduces stress at corners of the semiconductor die, thus increasing the yield of the wafer.
摘要翻译：根据一个实施例，用于增加晶片的可用面积并用于提高产量的半导体管芯具有大致六边形形状。晶片可以具有例如圆形形状。半导体管芯可以通过例如使用喷水引导激光来切割。在一个实施例中，半导体晶片导致晶片的不可用面积减少约2.0％至4.0％。此外，半导体管芯的大致六边形形状减小了半导体管芯的拐角处的应力，从而提高了晶片的产量。

3. 发明申请

US20060002307A1 Apparatus and method for testing a network connection device 审中-公开
标题翻译：用于测试网络连接设备的装置和方法
公开(公告)号：US20060002307A1
公开(公告)日：2006-01-05
申请号：US11147737
申请日：2005-06-08
申请人： Yi-Ming Wang , Chun-Ming Wang
发明人： Yi-Ming Wang , Chun-Ming Wang
IPC分类号： H04L1/00
CPC分类号： H04L1/24
摘要： A test apparatus for testing a to-be-tested network connection device is disclosed. The to-be-tested network connection device has a number of to-be-tested ports. The test apparatus includes a packet generator and a switch fixture. The packet generator is for generating a test packet having a VLAN ID (VID). The switch fixture, having VLAN function, includes a number of fixture ports. The to-be-tested ports are respectively one-to-one electrically coupled to the fixture ports. The switch fixture receives the test packet and transmits the test packet from one of the fixture ports to the corresponding to-be-tested port according to its VID in order to verify the to-be-tested network connection device.
摘要翻译：公开了一种用于测试待测试网络连接设备的测试设备。待测试的网络连接设备具有多个待测试端口。测试装置包括分组发生器和开关夹具。分组生成器用于生成具有VLAN ID（VID）的测试分组。具有VLAN功能的开关灯具包括多个灯具端口。待测试的端口分别一对一地电耦合到固定端口。开关夹具接收测试包，并根据其VID将其中一个灯具端口的测试包发送到相应的待测试端口，以验证待测试的网络连接设备。

4. 发明授权

US08193613B2 Semiconductor die having increased usable area 失效
标题翻译：半导体管芯具有增加的可用面积
公开(公告)号：US08193613B2
公开(公告)日：2012-06-05
申请号：US11715241
申请日：2007-03-06
申请人： Ken Jian Ming Wang , Ming Wang Sze
发明人： Ken Jian Ming Wang , Ming Wang Sze
IPC分类号： H01L23/544
CPC分类号： H01L29/0657 , H01L23/13 , H01L2924/0002 , Y10T428/24777 , H01L2924/00
摘要： According to one embodiment, a semiconductor die having increased usable area has at least six sides. The semiconductor die has a reduced stress at each corner of the die, resulting in smaller keep out zones near the corners of the semiconductor die, which allow the placement of bond pads near each corner of the die. The semiconductor die further allows the placement of active circuitry near each corner of the semiconductor die. One embodiment results in a 5.0% increase in usable area on the semiconductor die.
摘要翻译：根据一个实施例，具有增加的可用面积的半导体管芯具有至少六个边。半导体管芯在管芯的每个拐角处具有减小的应力，从而在半导体管芯的拐角附近形成较小的保护区域，这允许将接合焊盘放置在管芯的每个拐角附近。半导体管芯进一步允许在半导体管芯的每个拐角附近放置有源电路。一个实施例导致半导体管芯上的可用面积增加了5.0％。

5. 发明授权

US10206122B2 Direction finding positioning in wireless local area networks 有权
公开(公告)号：US10206122B2
公开(公告)日：2019-02-12
申请号：US15121044
申请日：2015-02-24
申请人： MEDIATEK INC. , James June-Ming Wang , Jianhan Liu , Thomas Edward Pare, Jr. , Tianyu Wu , Gabor Bajko , Yung-Ping Hsu
发明人： James June-Ming Wang , Jianhan Liu , Thomas Edward Pare, Jr. , Tianyu Wu , Gabor Bajko , Yung-Ping Hsu
IPC分类号： H04W16/22 , G01S3/74 , G01S3/14 , G01S5/12 , G01S1/08 , H04L5/00 , H04L29/06 , H04B7/06 , H04B17/318 , G01S5/06 , H04W4/02 , G01S5/02 , H04W24/10 , H04W64/00 , H04W4/04 , H04W84/12
摘要： A method of direction finding (DF) positioning in a wireless location area network (WLAN) is proposed. A multiple antenna IEEE 802.11 transmitting device can transmit signal preamble containing multiple Long Training Field (LTF) symbols in a radio frame from multiple antennas simultaneously, which allows a receiving device to resolve multiple DF sounding signals transmitted from the multiple antennas. As a result, angle of departure (AoD) of the transmitting device can be estimated by using the multiple resolved DF sounding signals from each antenna for DF positioning purpose.

6. 发明申请

US20180303000A1 ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20180303000A1
公开(公告)日：2018-10-18
申请号：US15922887
申请日：2018-03-15
申请人： Sheng-Hung Wang , Hui-Lian Chang , Ming-Wang Lin , Pan-Jen Chen , Wei-Lung Huang , Ting-Hui Liao
发明人： Sheng-Hung Wang , Hui-Lian Chang , Ming-Wang Lin , Pan-Jen Chen , Wei-Lung Huang , Ting-Hui Liao
IPC分类号： H05K5/02
CPC分类号： H05K5/0226 , G06F1/1616 , G06F1/1681 , H05K5/0247
摘要： An electronic device includes a first body, a second body, an electrical connection element, and a hinge structure. The electrical connection element is configured to electrically connect the first body with the second body. The hinge structure is configured to pivot the first body with the second body. The hinge structure includes two mounting bases, two first linking assemblies, and a second linking assembly. Each of the mounting bases is connected to the first body and the second body. The two first linking assemblies are respectively pivoted to the two mounting bases. The second linking assembly is disposed between the two mounting bases, and two opposite terminals of the second linking assembly are movably connected to the two mounting bases respectively. The second linking assembly has a receding space configured to accommodate a portion of the electrical connection element.

7. 发明授权

US09921187B2 Real-time pavement profile sensing system using air-coupled surface wave 有权
公开(公告)号：US09921187B2
公开(公告)日：2018-03-20
申请号：US13980013
申请日：2012-01-20
申请人： Yinghong Cao , Ming Wang
发明人： Yinghong Cao , Ming Wang
IPC分类号： G01B3/00 , G01B5/00 , G01N29/11 , G01V1/30 , E01C23/01
CPC分类号： G01N29/11 , E01C23/01 , G01N2291/044 , G01V1/303
摘要： A non-contact testing system and method using acoustic sensors and a mobile sensing system using this system and method is disclosed. The leaky surface wave is recorded with directional microphones. A fast inversion analysis algorithm is introduced to estimate the shear velocity profile and elastic modulus for the subsurface layers of pavement structures, using the dispersion curves obtained from the acoustic signals. An electrical hammer is used to produce impact impulses automatically. A mobile sensing system is integrated on a mobile cart to perform the mobile subsurface sensing for pavement structures.

8. 发明授权

US09815183B2 Quick detachable wrench structure 有权
公开(公告)号：US09815183B2
公开(公告)日：2017-11-14
申请号：US14592622
申请日：2015-01-08
申请人： Yeo Ming Wang
发明人： Yeo Ming Wang
IPC分类号： B25B23/00 , B25B13/46
CPC分类号： B25B23/0057 , B25B13/463 , B25B23/0035
摘要： A quick detachable wrench structure comprises: a wrench head portion, which has a hollow operation accommodation room and a top end portion disposed at an upper portion thereof; and a pressing member, which has a top pressing portion and a bottom plug portion, the bottom plug portion is embedded in the operation accommodation room, the top pressing portion is disposed at an upper portion of the top end portion, a bottom edge of the bottom plug portion is against to a bottom end of the top end portion in order to avoid the bottom plug portion taking off from the operation accommodation room.

9. 发明申请

US20170240511A1 SUBSTITUTED PYRIDINE INHIBITORS OF HIF PROLYL HYDROXYLASE 审中-公开
公开(公告)号：US20170240511A1
公开(公告)日：2017-08-24
申请号：US15517553
申请日：2015-10-08
申请人： Fez UJJAINWALLA , John Qiang TAN , Qun DANG , Christopher J. SINZ , Ming WANG , Jiaqiang CAI , Xiaoxing DU , Yili CHEN , MERCK SHARP & DOHME CORP.
发明人： FEZ UJJAINWALLA , JOHN QIANG TAN , QUN DANG , CHRISTOPHER J. SINZ , MING WANG , JIAQIANG CAI , XIAOXING DU , YILI CHEN
IPC分类号： C07D213/82 , C07D401/04
CPC分类号： C07D213/82 , A61P7/08 , C07D401/04
摘要： The present invention concerns compounds of formula I that inhibit HIF prolyl hydroxylase, their use for enhancing endogenous production of erythropoietin, and for treating conditions associated with reduced endogenous production of erythropoietin such as anemia and like conditions, as well as pharmaceutical compositions comprising such a compound and a pharmaceutical carrier.

10. 发明授权

US09559454B2 USB memory device 有权
标题翻译： USB存储设备
公开(公告)号：US09559454B2
公开(公告)日：2017-01-31
申请号：US13895826
申请日：2013-05-16
申请人： Yu-Ming Wang
发明人： Yu-Ming Wang
IPC分类号： G06F1/18 , H01R13/506 , H05K5/02 , G06K19/077 , H01R13/66
CPC分类号： H01R13/506 , G06K19/07732 , H01R13/6658 , H05K5/0278 , Y10T29/49124
摘要： The present invention is a USB memory device comprising a chip-on-board (COB) package having a flash memory and a flash memory controller embedded within, a COB carrier for storing the COB package comprising a tray having a G-shaped block with a pair of side lock bumps, and a metal housing for inserting the COB carrier having a top surface, a bottom surface, a top rectangular cut out, a bottom rectangular cut out, a pair of ends, a pair of side cut outs, a pair of top rectangular openings and a pair of bottom rectangular openings. The COB package, the COB carrier and the metal housing are used to assemble the device by inserting the COB carrier from either of the pair of ends and sliding the COB carrier within the metal housing until the pair of side lock bumps interlocks with the pair of side cut outs.
摘要翻译：本发明是一种USB存储器件，其包括具有闪速存储器和嵌入在其中的闪存控制器的片上（COB）封装，COB载体用于存储COB封装，其包括具有G形块的托盘一对侧锁定凸块和用于插入具有顶表面，底表面，顶部矩形切口，底部矩形切口，一对端部，一对侧切口，一对侧面的COB托架的金属外壳的顶部矩形开口和一对底部矩形开口。 COB封装，COB载体和金属外壳用于通过从一对端部中的任一端插入COB载体来装配该装置，并将COB载体滑动到金属外壳内，直到该对侧锁定凸起与该对侧切。

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