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1. 发明申请

US20110031625A1 Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element 有权
标题翻译：接触垫的加工方法，接触垫的制造方法以及集成电路元件
公开(公告)号：US20110031625A1
公开(公告)日：2011-02-10
申请号：US12907683
申请日：2010-10-19
申请人： Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
发明人： Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
IPC分类号： H01L23/532 , H01L23/485
CPC分类号： H01L23/3192 , H01L24/03 , H01L24/05 , H01L2224/05006 , H01L2224/05082 , H01L2224/05184 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/14 , Y10S438/954 , Y10S438/958 , H01L2924/00014 , H01L2224/05552
摘要： An integrated circuit includes a substrate. A surface region of the substrate includes a contact pad region. A passivation layer stack includes at least one passivation layer. The passivation layer stack is formed over the surface region and adjacent to the contact pad region. An upper portion of the passivation layer stack is removed in, in a portion of the passivation layer stack proximate the contact pad region.
摘要翻译：集成电路包括基板。衬底的表面区域包括接触焊盘区域。钝化层堆叠包括至少一个钝化层。钝化层堆叠形成在表面区域上并且邻近接触焊盘区域。钝化层堆叠的上部在邻近接触焊盘区域的钝化层堆叠的一部分中被去除。

2. 发明申请

US20060276010A1 Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium 有权
公开(公告)号：US20060276010A1
公开(公告)日：2006-12-07
申请号：US11438906
申请日：2006-05-23
申请人： Stephan Bradl , Michael Melzl , Josef Schwaiger , Thilo Stache
发明人： Stephan Bradl , Michael Melzl , Josef Schwaiger , Thilo Stache
IPC分类号： A23G3/20 , H01L21/00
CPC分类号： H01L21/67075 , H01L21/6704 , H01L21/6835
摘要： The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.

3. 发明授权

US08669666B2 Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element 有权
标题翻译：接触垫的处理方法，接触垫的制造方法以及集成电路元件
公开(公告)号：US08669666B2
公开(公告)日：2014-03-11
申请号：US12907683
申请日：2010-10-19
申请人： Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
发明人： Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
IPC分类号： H01L23/48 , H01L23/58
CPC分类号： H01L23/3192 , H01L24/03 , H01L24/05 , H01L2224/05006 , H01L2224/05082 , H01L2224/05184 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/14 , Y10S438/954 , Y10S438/958 , H01L2924/00014 , H01L2224/05552
摘要： An integrated circuit includes a substrate. A surface region of the substrate includes a contact pad region. A passivation layer stack includes at least one passivation layer. The passivation layer stack is formed over the surface region and adjacent to the contact pad region. An upper portion of the passivation layer stack is removed in, in a portion of the passivation layer stack proximate the contact pad region.
摘要翻译：集成电路包括基板。衬底的表面区域包括接触焊盘区域。钝化层堆叠包括至少一个钝化层。钝化层堆叠形成在表面区域上并且邻近接触焊盘区域。钝化层堆叠的上部在邻近接触焊盘区域的钝化层堆叠的一部分中被去除。

4. 发明授权

US08357588B2 Method for machining a workpiece on a workpiece support 有权
标题翻译：在工件支架上加工工件的方法
公开(公告)号：US08357588B2
公开(公告)日：2013-01-22
申请号：US13032618
申请日：2011-02-22
申请人： Stephen Bradl , Walther Grommes , Werner Kröninger , Michael Melzl , Josef Schwaiger , Thilo Stache
发明人： Stephen Bradl , Walther Grommes , Werner Kröninger , Michael Melzl , Josef Schwaiger , Thilo Stache
IPC分类号： H01L21/30
CPC分类号： H01L21/6836 , H01L2221/68327 , Y10S414/135 , Y10S414/136 , Y10S414/139 , Y10S414/141 , Y10S438/977 , Y10T29/49998
摘要： A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.
摘要翻译：工件加工方法包括借助于接合装置将工件附接到工件支撑件。工件和工件支撑件通过环形连接装置相互连接。生产的复合材料被加工。加工的工件与工件支架分离。

5. 发明授权

US07829450B2 Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element 有权
标题翻译：接触垫的处理方法，接触垫的制造方法以及集成电路元件
公开(公告)号：US07829450B2
公开(公告)日：2010-11-09
申请号：US11936541
申请日：2007-11-07
申请人： Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
发明人： Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
IPC分类号： H01L21/44
CPC分类号： H01L23/3192 , H01L24/03 , H01L24/05 , H01L2224/05006 , H01L2224/05082 , H01L2224/05184 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/14 , Y10S438/954 , Y10S438/958 , H01L2924/00014 , H01L2224/05552
摘要： In a method of processing a contact pad, a passivation layer stack including at least one passivation layer is formed on at least an upper surface of a contact pad region. A first portion of the passivation layer stack is removed from above the contact pad region, wherein a second portion of the passivation layer remains on the contact pad region and covers the contact pad region. An adhesion layer is formed on the passivation layer stack. The adhesion layer is patterned, wherein the adhesion layer is removed from above the contact pad region. Furthermore, the second portion of the passivation layer stack is removed.
摘要翻译：在处理接触焊盘的方法中，在接触焊盘区域的至少上表面上形成包括至少一个钝化层的钝化层堆叠。钝化层堆叠的第一部分从接触焊盘区域上方去除，其中钝化层的第二部分保留在接触焊盘区域上并覆盖接触焊盘区域。在钝化层堆叠上形成粘附层。图案化附着层，其中从接触焊盘区域上方去除粘附层。此外，去除钝化层堆叠的第二部分。

6. 发明授权

US07566378B2 Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium 有权
标题翻译：用于用液体介质处理所述半导体部件的载体系统上的电子半导体部件的布置
公开(公告)号：US07566378B2
公开(公告)日：2009-07-28
申请号：US11438906
申请日：2006-05-23
申请人： Stephan Bradl , Michael Melzl , Josef Schwaiger , Thilo Stache
发明人： Stephan Bradl , Michael Melzl , Josef Schwaiger , Thilo Stache
IPC分类号： H01L21/00 , C23C14/00 , C23C16/00
CPC分类号： H01L21/67075 , H01L21/6704 , H01L21/6835
摘要： The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.
摘要翻译：本发明涉及一种用于用液体介质处理半导体部件的载体系统上的电子半导体部件的布置。半导体部件可拆卸地安装在载体系统上，其主动侧具有至少在边缘区域中并且部分地在半导体部件和载体系统之间的间隙。本发明的目的是提供在机械稳定的载体系统上的电子半导体部件的可拆卸布置，用于在生产过程中安全地处理半导体部件，其中半导体部件和载体系统之间的间隙的毛细管度在从而防止液体介质渗透到间隙中的破坏作用。为此，载体系统的表面成形为使得间隙沿其整个边缘区域变宽。

7. 发明申请

US20090115074A1 Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element 有权
标题翻译：接触垫的加工方法，接触垫的制造方法以及集成电路元件
公开(公告)号：US20090115074A1
公开(公告)日：2009-05-07
申请号：US11936541
申请日：2007-11-07
申请人： Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
发明人： Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
IPC分类号： H01L21/441 , H01L23/52
CPC分类号： H01L23/3192 , H01L24/03 , H01L24/05 , H01L2224/05006 , H01L2224/05082 , H01L2224/05184 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/14 , Y10S438/954 , Y10S438/958 , H01L2924/00014 , H01L2224/05552
摘要： In a method of processing a contact pad, a passivation layer stack including at least one passivation layer is formed on at least an upper surface of a contact pad region. A first portion of the passivation layer stack is removed from above the contact pad region, wherein a second portion of the passivation layer remains on the contact pad region and covers the contact pad region. An adhesion layer is formed on the passivation layer stack. The adhesion layer is patterned, wherein the adhesion layer is removed from above the contact pad region. Furthermore, the second portion of the passivation layer stack is removed.
摘要翻译：在处理接触焊盘的方法中，在接触焊盘区域的至少上表面上形成包括至少一个钝化层的钝化层堆叠。钝化层堆叠的第一部分从接触焊盘区域上方去除，其中钝化层的第二部分保留在接触焊盘区域上并覆盖接触焊盘区域。在钝化层堆叠上形成粘附层。图案化附着层，其中从接触焊盘区域上方去除粘附层。此外，去除钝化层堆叠的第二部分。

8. 发明申请

US20080122091A1 Semiconductor device and method for producing a semiconductor device 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20080122091A1
公开(公告)日：2008-05-29
申请号：US11602024
申请日：2006-11-20
申请人： Thomas Gutt , Drik Siepe , Thomas Laska , Michael Melzl , Matthias Stecher , Roman Roth
发明人： Thomas Gutt , Drik Siepe , Thomas Laska , Michael Melzl , Matthias Stecher , Roman Roth
IPC分类号： H01L29/45 , H01L21/71 , H01L29/41
CPC分类号： H01L24/85 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/04042 , H01L2224/05073 , H01L2224/05093 , H01L2224/05166 , H01L2224/05187 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/05664 , H01L2224/29101 , H01L2224/29111 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4807 , H01L2224/48458 , H01L2224/4847 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48724 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48757 , H01L2224/48764 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48857 , H01L2224/48864 , H01L2224/838 , H01L2224/85205 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/04941 , H01L2924/10253 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/20752 , H01L2924/2076 , H01L2924/351 , H01L2924/00014 , H01L2924/04953 , H01L2924/00 , H01L2924/3512 , H01L2224/48824 , H01L2224/48657 , H01L2924/00015
摘要： A semiconductor device exhibits a first metal layer, made of a first metal, with at least one contiguous subsection. At least one second metal layer, made of a second metal, is placed on the contiguous subsection of the first metal layer. The second metal is harder than the first metal. The second metal layer is structured to form at least two layer regions, which are disposed on the contiguous subsection of the first metal layer. The second metal exhibits a boron-containing or phosphorus-containing metal or a boron-containing or phosphorus-containing metal alloy.
摘要翻译：半导体器件具有由第一金属制成的具有至少一个连续部分的第一金属层。由第二金属制成的至少一个第二金属层被放置在第一金属层的相邻子部分上。第二种金属比第一种金属更硬。第二金属层被构造成形成至少两个层区，它们设置在第一金属层的相邻子部分上。第二金属表现出含硼或含磷金属或含硼或含磷金属合金。

9. 发明申请

US20070117351A1 Method for machining a workpiece on a workpiece support 有权
标题翻译：在工件支架上加工工件的方法
公开(公告)号：US20070117351A1
公开(公告)日：2007-05-24
申请号：US11580707
申请日：2006-10-13
申请人： Stephan Bradl , Walther Grommes , Werner Kroninger , Michael Melzl , Josef Schwaiger , Thilo Stache
发明人： Stephan Bradl , Walther Grommes , Werner Kroninger , Michael Melzl , Josef Schwaiger , Thilo Stache
IPC分类号： H01L21/00
CPC分类号： H01L21/6836 , H01L2221/68327 , Y10S414/135 , Y10S414/136 , Y10S414/139 , Y10S414/141 , Y10S438/977 , Y10T29/49998
摘要： A workpiece machining method includes attaching a workpiece to a workpiece support with the aid of joining means. The workpiece and the workpiece support are joined to one another by an annular joining means. The composite produced is machined. The machined workpiece is separated from the workpiece support.
摘要翻译：工件加工方法包括借助于接合装置将工件附接到工件支撑件。工件和工件支撑件通过环形连接装置相互连接。生产的复合材料被加工。加工的工件与工件支架分离。

10. 发明授权

US08759230B2 Treatment of a substrate with a liquid medium 有权
标题翻译：用液体介质处理基材
公开(公告)号：US08759230B2
公开(公告)日：2014-06-24
申请号：US12331237
申请日：2008-12-09
申请人： Stephan Bradl , Michael Melzl , Josef Schwaiger , Thilo Stache
发明人： Stephan Bradl , Michael Melzl , Josef Schwaiger , Thilo Stache
IPC分类号： H01L21/302
CPC分类号： H01L21/67075 , H01L21/6704 , H01L21/6835
摘要： The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.
摘要翻译：本发明涉及一种用于用液体介质处理半导体部件的载体系统上的电子半导体部件的布置。半导体部件可拆卸地安装在载体系统上，其主动侧具有至少在边缘区域中并且部分地在半导体部件和载体系统之间的间隙。本发明的目的是提供在机械稳定的载体系统上的电子半导体部件的可拆卸布置，用于在生产过程中安全地处理半导体部件，其中半导体部件和载体系统之间的间隙的毛细管度在从而防止液体介质渗透到间隙中的破坏作用。为此，载体系统的表面成形为使得间隙沿其整个边缘区域变宽。

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