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1. 发明授权

US09121885B2 Sensor package and method of manufacturing thereof 有权
标题翻译：传感器封装及其制造方法
公开(公告)号：US09121885B2
公开(公告)日：2015-09-01
申请号：US12857242
申请日：2010-08-16
申请人： Klaus Elian , Horst Theuss , Guenther Ruhl
发明人： Klaus Elian , Horst Theuss , Guenther Ruhl
IPC分类号： G01N27/72 , G01R33/07
CPC分类号： G01R33/072 , G01N27/72 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , Y10T29/49002 , H01L2924/00012
摘要： A sensor package and a method for manufacturing a sensor package are disclosed. An embodiment includes a sensor and a conductive line, wherein the sensor is arranged proximate to the conductive line. The sensor and the conductive line are isolated and at least partially encapsulated. A soft magnet is arranged in, on or around the encapsulation, wherein the soft magnet includes a composition of an insulating material and a material having soft magnetic properties.
摘要翻译：公开了传感器封装和制造传感器封装的方法。实施例包括传感器和导线，其中传感器布置成靠近导电线。传感器和导线被隔离并至少部分封装。软磁体布置在封装中，之上或周围，其中软磁体包括绝缘材料的组合物和具有软磁性质的材料。

2. 发明申请

US20120080690A1 Method for Manufacturing a Composite Wafer Having a Graphite Core, and Composite Wafer Having a Graphite Core 有权
标题翻译：制造具有石墨芯的复合晶片的方法和具有石墨芯的复合晶片
公开(公告)号：US20120080690A1
公开(公告)日：2012-04-05
申请号：US12894344
申请日：2010-09-30
申请人： Rudolf Berger , Hermann Gruber , Wolfgang Lehnert , Guenther Ruhl , Raimund Foerg , Anton Mauder , Hans-Joachim Schulze
发明人： Rudolf Berger , Hermann Gruber , Wolfgang Lehnert , Guenther Ruhl , Raimund Foerg , Anton Mauder , Hans-Joachim Schulze
IPC分类号： H01L29/24 , H01L21/30 , H01L29/02 , H01L21/20
CPC分类号： H01L21/76251 , H01L21/02002 , H01L21/0237 , H01L21/0243 , H01L21/02527 , H01L21/02601 , H01L21/02628 , H01L21/7624 , H01L29/02 , H01L29/04 , H01L29/16 , H01L29/1608 , H01L29/161
摘要： According to an embodiment, a composite wafer includes a carrier substrate having a graphite core and a monocrystalline semiconductor layer attached to the carrier substrate.
摘要翻译：根据实施例，复合晶片包括具有石墨芯和附着到载体衬底的单晶半导体层的载体衬底。

3. 发明申请

US20050016468A1 Compensation frame for receiving a substrate 审中-公开
标题翻译：用于接收基板的补偿框架
公开(公告)号：US20050016468A1
公开(公告)日：2005-01-27
申请号：US10742763
申请日：2003-12-23
申请人： Guenther Ruhl , Gerhard Prechtl , Winfried Sabisch , Alfred Kersch , Pavel Nesladek , Fritz Gans , Rex Anderson
发明人： Guenther Ruhl , Gerhard Prechtl , Winfried Sabisch , Alfred Kersch , Pavel Nesladek , Fritz Gans , Rex Anderson
IPC分类号： G03F1/00 , H01J37/32 , H01L21/00 , H01L21/687 , C23C16/00
CPC分类号： H01L21/68735 , H01L21/67069 , H01L21/68778
摘要： An inner contour of the compensation frame (2) is configured in polygonal fashion in order to receive the substrate (1). With the substrate (1) having been received, the compensation frame (2) encloses the substrate (1) at the outer edge thereof. A partial region (3a) of an upper main area (3) of the compensation frame (2) runs at a given height (h) above the plane of an upper main area (1a) of the substrate (1) when the latter has been received into the compensation frame (2). Moreover, a further partial region (3b) of the upper main area (3) of the compensation frame runs essentially at the same height as the plane of the upper main area (3) of the substrate (1) when the latter has been received into the compensation frame (2).
摘要翻译：补偿框架（2）的内部轮廓被配置为多边形，以便接收基板（1）。在已经接收到基板（1）的情况下，补偿框架（2）在其外边缘处包围基板（1）。补偿框架（2）的上部主区域（3）的局部区域（3a）在衬底（1）的上部主区域（1a）的平面上方的给定高度（h）处延伸，被收到补偿框架（2）。此外，补偿框架的上主区域（3）的另一部分区域（3b）基本上在与基板（1）的上主区域（3）的平面相同的高度运行，当接收器进入补偿框架（2）。

4. 发明授权

US08736172B2 Vehicle lighting arrangement 有权
标题翻译：车辆照明安排
公开(公告)号：US08736172B2
公开(公告)日：2014-05-27
申请号：US13440346
申请日：2012-04-05
申请人： Markus Hammer , Guenther Ruhl
发明人： Markus Hammer , Guenther Ruhl
IPC分类号： B60Q1/02
CPC分类号： B60Q11/00
摘要： A vehicle lighting arrangement comprising a luminous device, a luminous device driver circuit, a sensor and a nonvolatile memory, wherein the luminous device driver circuit is designed to drive the luminous device during luminous device driving such that the luminous device emits light, wherein the sensor is designed to detect a sensor state of the luminous device, and wherein the vehicle lighting arrangement is designed to read in a sensor state of the luminous device detected by the sensor and to write the read-in sensor state to the nonvolatile memory.
摘要翻译：一种车辆照明装置，包括发光装置，发光装置驱动电路，传感器和非易失性存储器，其中发光装置驱动电路被设计成在发光装置驱动期间驱动发光装置，使得发光装置发光，其中传感器被设计为检测发光装置的传感器状态，并且其中车辆照明装置被设计为在由传感器检测到的发光装置的传感器状态下读取并将读入传感器状态写入非易失性存储器。

5. 发明授权

US08404562B2 Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core 有权
标题翻译：具有石墨芯的复合晶片的制造方法以及具有石墨芯的复合晶片
公开(公告)号：US08404562B2
公开(公告)日：2013-03-26
申请号：US12894344
申请日：2010-09-30
申请人： Rudolf Berger , Hermann Gruber , Wolfgang Lehnert , Guenther Ruhl , Raimund Foerg , Anton Mauder , Hans-Joachim Schulze
发明人： Rudolf Berger , Hermann Gruber , Wolfgang Lehnert , Guenther Ruhl , Raimund Foerg , Anton Mauder , Hans-Joachim Schulze
IPC分类号： H01L21/322 , H01L21/00 , H01L21/31
CPC分类号： H01L21/76251 , H01L21/02002 , H01L21/0237 , H01L21/0243 , H01L21/02527 , H01L21/02601 , H01L21/02628 , H01L21/7624 , H01L29/02 , H01L29/04 , H01L29/16 , H01L29/1608 , H01L29/161
摘要： According to an embodiment, a composite wafer includes a carrier substrate having a graphite core and a monocrystalline semiconductor layer attached to the carrier substrate.
摘要翻译：根据实施例，复合晶片包括具有石墨芯和附着到载体衬底的单晶半导体层的载体衬底。

6. 发明申请

US20120083098A1 Method for Manufacturing a Composite Wafer Having a Graphite Core, and Composite Wafer Having a Graphite Core 有权
标题翻译：制造具有石墨芯的复合晶片的方法和具有石墨芯的复合晶片
公开(公告)号：US20120083098A1
公开(公告)日：2012-04-05
申请号：US13206029
申请日：2011-08-09
申请人： Rudolf Berger , Hermann Gruber , Wolfgang Lehnert , Guenther Ruhl , Raimund Foerg , Anton Mauder , Hans-Joachim Schulze , Karsten Kellermann , Michael Sommer , Christian Rottmair , Roland Rupp
发明人： Rudolf Berger , Hermann Gruber , Wolfgang Lehnert , Guenther Ruhl , Raimund Foerg , Anton Mauder , Hans-Joachim Schulze , Karsten Kellermann , Michael Sommer , Christian Rottmair , Roland Rupp
IPC分类号： H01L21/30
CPC分类号： H01L21/76254 , C30B25/186 , H01L21/02115 , H01L21/02282 , H01L21/02598 , H01L21/2007 , H01L21/265 , H01L21/3212 , H01L21/324 , H01L21/76251 , H01L29/1608 , H01L29/20 , H01L29/2003
摘要： According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate.
摘要翻译：根据实施例，复合晶片包括具有石墨层和附着到载体衬底的单晶半导体层的载体衬底。

7. 发明申请

US20120038352A1 Sensor Package and Method of Manufacturing Thereof 有权
标题翻译：传感器封装及其制造方法
公开(公告)号：US20120038352A1
公开(公告)日：2012-02-16
申请号：US12857242
申请日：2010-08-16
申请人： Klaus Elian , Horst Theuss , Guenther Ruhl
发明人： Klaus Elian , Horst Theuss , Guenther Ruhl
IPC分类号： G01R33/02 , G01R33/06 , H05K13/00 , G01R1/04
CPC分类号： G01R33/072 , G01N27/72 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , Y10T29/49002 , H01L2924/00012
摘要： A sensor package and a method for manufacturing a sensor package are disclosed. An embodiment comprises a sensor and a conductive line, wherein the sensor is arranged proximate to the conductive line. The sensor and the conductive line are isolated and at least partially encapsulated. A soft magnet is arranged in, on and/or around the encapsulation, wherein the soft magnet comprises a composition of an insulating material and a material having soft magnetic properties.
摘要翻译：公开了传感器封装和制造传感器封装的方法。实施例包括传感器和导线，其中传感器布置成靠近导电线。传感器和导线被隔离并至少部分封装。软磁体布置在封装的内部和/或周围，其中软磁体包括绝缘材料的组合物和具有软磁性质的材料。

8. 发明申请

US20110073990A1 Capacitor and Method for Making Same 审中-公开
标题翻译：电容器和制作方法
公开(公告)号：US20110073990A1
公开(公告)日：2011-03-31
申请号：US12567952
申请日：2009-09-28
申请人： Rudolf BERGER , Guenther RUHL , Kai-Olaf SUBKE
发明人： Rudolf BERGER , Guenther RUHL , Kai-Olaf SUBKE
IPC分类号： H01L29/92 , H01L21/02
CPC分类号： H01G13/00 , H01G4/005 , H01L27/0805 , H01L28/91 , H01L29/66181 , H01L29/94
摘要： One or more embodiments relate to a method for making a capacitor such as a trench capacitor. The method includes: providing a substrate; forming an opening within the substrate; forming a sidewall spacer over a sidewall surface of the opening; forming a first conductive layer within the opening after forming the sidewall spacer; removing the sidewall spacer; forming a dielectric layer over the first conductive layer within the opening; and forming a second conductive layer over the dielectric layer within the opening.
摘要翻译：一个或多个实施例涉及制造诸如沟槽电容器的电容器的方法。该方法包括：提供衬底; 在衬底内形成开口; 在所述开口的侧壁表面上形成侧壁间隔物; 在形成侧壁间隔物之后，在开口内形成第一导电层; 去除侧壁间隔物; 在所述开口内的所述第一导电层的上方形成介电层; 以及在所述开口内的所述电介质层上形成第二导电层。

9. 发明授权

US07829450B2 Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element 有权
标题翻译：接触垫的处理方法，接触垫的制造方法以及集成电路元件
公开(公告)号：US07829450B2
公开(公告)日：2010-11-09
申请号：US11936541
申请日：2007-11-07
申请人： Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
发明人： Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
IPC分类号： H01L21/44
CPC分类号： H01L23/3192 , H01L24/03 , H01L24/05 , H01L2224/05006 , H01L2224/05082 , H01L2224/05184 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/14 , Y10S438/954 , Y10S438/958 , H01L2924/00014 , H01L2224/05552
摘要： In a method of processing a contact pad, a passivation layer stack including at least one passivation layer is formed on at least an upper surface of a contact pad region. A first portion of the passivation layer stack is removed from above the contact pad region, wherein a second portion of the passivation layer remains on the contact pad region and covers the contact pad region. An adhesion layer is formed on the passivation layer stack. The adhesion layer is patterned, wherein the adhesion layer is removed from above the contact pad region. Furthermore, the second portion of the passivation layer stack is removed.
摘要翻译：在处理接触焊盘的方法中，在接触焊盘区域的至少上表面上形成包括至少一个钝化层的钝化层堆叠。钝化层堆叠的第一部分从接触焊盘区域上方去除，其中钝化层的第二部分保留在接触焊盘区域上并覆盖接触焊盘区域。在钝化层堆叠上形成粘附层。图案化附着层，其中从接触焊盘区域上方去除粘附层。此外，去除钝化层堆叠的第二部分。

10. 发明申请

US20090115074A1 Method of Processing a Contact Pad, Method of Manufacturing a Contact Pad, and Integrated Circuit Element 有权
标题翻译：接触垫的加工方法，接触垫的制造方法以及集成电路元件
公开(公告)号：US20090115074A1
公开(公告)日：2009-05-07
申请号：US11936541
申请日：2007-11-07
申请人： Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
发明人： Markus Hammer , Guenther Ruhl , Andreas Strasser , Michael Melzl , Reinhard Goellner , Doerthe Groteloh
IPC分类号： H01L21/441 , H01L23/52
CPC分类号： H01L23/3192 , H01L24/03 , H01L24/05 , H01L2224/05006 , H01L2224/05082 , H01L2224/05184 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/05042 , H01L2924/14 , Y10S438/954 , Y10S438/958 , H01L2924/00014 , H01L2224/05552
摘要： In a method of processing a contact pad, a passivation layer stack including at least one passivation layer is formed on at least an upper surface of a contact pad region. A first portion of the passivation layer stack is removed from above the contact pad region, wherein a second portion of the passivation layer remains on the contact pad region and covers the contact pad region. An adhesion layer is formed on the passivation layer stack. The adhesion layer is patterned, wherein the adhesion layer is removed from above the contact pad region. Furthermore, the second portion of the passivation layer stack is removed.
摘要翻译：在处理接触焊盘的方法中，在接触焊盘区域的至少上表面上形成包括至少一个钝化层的钝化层堆叠。钝化层堆叠的第一部分从接触焊盘区域上方去除，其中钝化层的第二部分保留在接触焊盘区域上并覆盖接触焊盘区域。在钝化层堆叠上形成粘附层。图案化附着层，其中从接触焊盘区域上方去除粘附层。此外，去除钝化层堆叠的第二部分。

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