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1. 再颁专利

USRE44372E1 System and apparatus for efficient heat removal from heat-generating electronic modules 有权
标题翻译：用于从发热电子模块有效散热的系统和装置
公开(公告)号：USRE44372E1
公开(公告)日：2013-07-16
申请号：US13358062
申请日：2012-01-25
申请人： Patrizio Vinciarelli , Michael B. Lafleur
发明人： Patrizio Vinciarelli , Michael B. Lafleur
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/209
摘要： This document describes apparatus and methods for a self-contained assembly having an encapsulated electronic module coupled to a heat removal device by a thermally conductive substance. In an illustrative example, the module includes at least one heat dissipating device thermally coupled by internal members to selected portions of a housing. The module housing includes a flat top surface with a perimeter adjoined to side surfaces. In one example, the heat removal device includes a cavity interior surface with an upper surface to match the module top surface, and side walls that match at least 50% by area of the selected portions of the module side surfaces. The cavity interior surface may receive at least 50% of the housing surface area. The matched portion of the cavity side surfaces may be at least 33% by area of the portion of the cavity upper surface that matches the module top surface.
摘要翻译：本文件描述了用于独立组件的装置和方法，其具有通过导热物质耦合到散热装置的封装的电子模块。在说明性示例中，该模块包括至少一个由内部构件热耦合到壳体的选定部分的散热装置。模块壳体包括具有与侧表面相邻的周边的平坦顶表面。在一个示例中，除热装置包括具有上表面以匹配模块顶表面的空腔内表面和与模块侧表面的所选部分的至少50％的面积匹配的侧壁。空腔内表面可以容纳至少50％的壳体表面积。空腔侧表面的匹配部分可以与空腔上表面的与模块顶表面匹配的部分的至少33％的面积。

2. 发明授权

US06940013B2 Surface mounting a power converter 有权
标题翻译：表面安装电源转换器
公开(公告)号：US06940013B2
公开(公告)日：2005-09-06
申请号：US10714323
申请日：2003-11-14
申请人： Patrizio Vinciarelli , Jay Prager , Michael B. LaFleur
发明人： Patrizio Vinciarelli , Jay Prager , Michael B. LaFleur
IPC分类号： H02M3/00 , H01R43/02 , H05K1/14 , H05K3/34 , H05K3/36 , H05K7/10 , H02G3/08 , H05K5/00
CPC分类号： H05K3/368 , H01R12/57 , H01R43/0256 , H05K1/141 , H05K3/3426 , H05K3/3436 , H05K2201/1031 , Y02P70/611
摘要： A power converter includes electrical contacts arranged on a first surface and a connection device. The converter has a top surface above the first surface and a bottom surface below the first surface. A border of the bottom surface is inset from a border of the second surface. The connection device includes a pair of conductive legs, each leg comprising a first end and a second end. The pair of legs lie opposite each other in a pair of evenly spaced planes that intersect the first surface. The first ends are adapted to connect to one or more of the contacts on the first surface and the second ends are adapted to connect to one or more conductive pads on a surface of a substrate. The connection device is adapted to enable the first ends of the two legs to connect to the contacts from below the first surface.
摘要翻译：电力转换器包括布置在第一表面上的电触头和连接装置。转换器具有位于第一表面上方的顶表面和第一表面下方的底表面。底面的边界是从第二表面的边界插入的。连接装置包括一对导电腿，每个腿包括第一端和第二端。一对腿在与第一表面相交的一对均匀间隔的平面中彼此相对。第一端适于连接到第一表面上的一个或多个触点，并且第二端适于连接到衬底表面上的一个或多个导电焊盘。连接装置适于使得两个腿的第一端能够从第一表面下方连接到触点。

3. 发明授权

US06593836B1 Bobbins, transformers, magnetic components, and methods 有权
标题翻译：线轴，变压器，磁性元件和方法
公开(公告)号：US06593836B1
公开(公告)日：2003-07-15
申请号：US09342403
申请日：1999-06-28
申请人： Michael B. LaFleur , Patrizio Vinciarelli
发明人： Michael B. LaFleur , Patrizio Vinciarelli
IPC分类号： H01F2708
CPC分类号： H01F27/22 , H01F3/14 , H01F27/29 , H01F27/306 , H01F29/10 , H01F38/08
摘要： A bobbin is adapted to support a winding on a permeable core and has a wall that provides a confined thermally conductive channel that causes conduction of heat along a predetermined path from the core to a location outside the winding. A value of magnetizing inductance in a transformer is set by adjusting the gap until the value of magnetizing inductance has been set and attaching a segment of the bobbin to a pair of core pieces to maintain the gap. A permeable strip provides a permeable path outside of the hollow interior space and does not couple the winding, and an electrically insulating coupler is interposed between the slug and the winding to electrically insulate the winding.
摘要翻译：线轴适于将绕组支撑在可渗透的芯上并且具有壁，其提供限制的导热通道，其导致沿着从芯到预定绕组的位置的预定路径的热传导。变压器中的励磁电感值通过调整间隙直到磁化电感的值被设定并且将线圈的一部分连接到一对芯片上来保持间隙来设定。可渗透条带提供在中空内部空间外部的可渗透路径，并且不耦合绕组，并且电绝缘耦合器插入在芯块和绕组之间以使绕组电绝缘。

4. 发明授权

US08427269B1 Encapsulation method and apparatus for electronic modules 有权
公开(公告)号：US08427269B1
公开(公告)日：2013-04-23
申请号：US12493773
申请日：2009-06-29
申请人： Patrizio Vinciarelli , Michael B. LaFleur
发明人： Patrizio Vinciarelli , Michael B. LaFleur
IPC分类号： H01F5/00 , H01F17/06 , H01F27/24 , H01F27/28
CPC分类号： B29C70/72 , B29C43/00 , B29C43/04 , H01F3/14 , H01F27/022 , H01F27/2804 , H01F41/005 , H01F2027/2819 , H01L21/56 , H01L21/565
摘要： An encapsulated electronic device includes a magnetically permeable core structure which is exposed within and coplanar with a flat top surface of the device. A bottom surface of the core may be exposed within the bottom surface of the device. The bottom core surface may be recessed beneath, coplanar with, or protruding from the bottom surface of the device. Alternatively the bottom surface may be encapsulated within the device. A method for manufacturing the exposed core package includes positioning a first component relative to a second component before encapsulating the device. An improved planar magnetic core structure includes internal bevels having a radius greater than or equal to 15% and preferably 25%, 35%, or as much as 50% of the core thickness to reduce concentration of the magnetic field around the internal corners.

5. 外观设计

USD509472S1 Power converter 失效
标题翻译：电源转换器
公开(公告)号：USD509472S1
公开(公告)日：2005-09-13
申请号：US29175342
申请日：2003-02-03
申请人： Patrizio Vinciarelli , Michael B. Lafleur , Charles I. McCauley , Paul V. Starenas
设计人： Patrizio Vinciarelli , Michael B. Lafleur , Charles I. McCauley , Paul V. Starenas

6. 发明授权

US06600402B1 Bobbins, transformers, magnetic components, and methods 有权
标题翻译：线轴，变压器，磁性元件和方法
公开(公告)号：US06600402B1
公开(公告)日：2003-07-29
申请号：US09184461
申请日：1998-10-20
申请人： Michael B. LaFleur , Patrizio Vinciarelli
发明人： Michael B. LaFleur , Patrizio Vinciarelli
IPC分类号： H01F2708
CPC分类号： H01F38/08 , H01F3/14 , H01F27/22 , H01F27/29 , H01F27/306 , H01F29/10
摘要： A bobbin is adapted to support a winding on a permeable core and has a wall that provides a confined thermally conductive channel that causes conduction of heat along a predetermined path from the core to a location outside the winding. A value of magnetizing inductance in a transformer is set by adjusting the gap until the value of magnetizing inductance has been set and attaching a segment of the bobbin to a pair of core pieces to maintain the gap. A permeable slug provides a permeable path outside of the hollow interior space and does not couple the winding, and an electrically insulating coupler is interposed between the slug and the winding to electrically insulate the winding.
摘要翻译：线轴适于将绕组支撑在可渗透的芯上并且具有壁，其提供限制的导热通道，其导致沿着从芯到预定绕组的位置的预定路径的热传导。变压器中的励磁电感值通过调整间隙直到磁化电感的值被设定并且将线圈的一部分连接到一对芯片上来保持间隙来设定。可渗透的塞子在中空内部空间外部提供可渗透的路径，并且不耦合绕组，并且电绝缘耦合器插入在芯块和绕组之间以使绕组电绝缘。

7. 发明授权

US06434005B1 Power converter packaging 有权
标题翻译：电源转换器包装
公开(公告)号：US06434005B1
公开(公告)日：2002-08-13
申请号：US09698503
申请日：2000-10-27
申请人： Patrizio Vinciarelli , Fred M. Finnemore , Michael B. Lafleur , Charles I. McCauley
发明人： Patrizio Vinciarelli , Fred M. Finnemore , Michael B. Lafleur , Charles I. McCauley
IPC分类号： H05K720
CPC分类号： H02M3/00 , Y10T29/4935
摘要： A power converter includes a housing, heat generating circuitry in the housing, and a heat conducting metal sheath on the outside of the housing. The housing has an elongated-box shape including two relatively smaller ends and four relatively larger sides and a heat-conducting metal sheath on the outside of the housing. The heat conducting sheath covers substantially all of the four relatively larger sides.
摘要翻译：电力转换器包括壳体，壳体中的发热电路以及壳体外部的导热金属护套。壳体具有包括两个相对较小的端部和四个相对较大的侧面的细长形状的壳体，以及在壳体的外侧上的导热金属护套。导热护套基本覆盖四个相对较大的一侧的全部。

8. 发明授权

US09402319B2 Panel-molded electronic assemblies 有权
标题翻译：面板模制电子组件
公开(公告)号：US09402319B2
公开(公告)日：2016-07-26
申请号：US14116642
申请日：2012-05-11
申请人： Patrizio Vinciarelli , Michael B. LaFleur , Sean Timothy Fleming , Rudolph F. Mutter , Andrew T. D'Amico
发明人： Patrizio Vinciarelli , Michael B. LaFleur , Sean Timothy Fleming , Rudolph F. Mutter , Andrew T. D'Amico
IPC分类号： H05K7/00 , H05K3/28 , H05K1/18 , H05K1/11 , B29C45/00 , B29C45/14 , H01R43/24 , H05K5/06 , H05K7/20 , H01R43/20
CPC分类号： H05K3/284 , B29C45/0055 , B29C45/14639 , B29C2045/0058 , B29C2793/0009 , B29C2793/0027 , B29C2793/009 , H01R27/02 , H01R43/205 , H01R43/24 , H05K1/0209 , H05K1/111 , H05K1/186 , H05K3/0044 , H05K3/0052 , H05K3/007 , H05K5/064 , H05K5/065 , H05K7/209 , H05K2201/0183 , H05K2201/066 , H05K2201/10303 , H05K2201/10545 , H05K2203/1316 , H05K2203/1327 , H05K2203/167
摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations.
摘要翻译：封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。可以包括多个部件的面板可以在封装之后切割成一个或多个单独的部件。模具可用于形成成品的一部分。在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。模具可以包括各种内部特征。封装后可以在模具中进行宽切削，减少热应力。空白模具面板可以被加工以在按需制造系统中提供上述特征中的一些或全部。可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。

9. 发明申请

US20120287582A1 Panel-Molded Electronic Assemblies 有权
标题翻译：面板模制电子组件
公开(公告)号：US20120287582A1
公开(公告)日：2012-11-15
申请号：US13105696
申请日：2011-05-11
申请人： Patrizio Vinciarelli , Michael B. Lafleur , Andrew T. D'Amico , Rudolph Mutter , Sean Timothy Fleming
发明人： Patrizio Vinciarelli , Michael B. Lafleur , Andrew T. D'Amico , Rudolph Mutter , Sean Timothy Fleming
IPC分类号： H05K7/00 , H05K5/00 , B29C33/20 , H01R43/00
CPC分类号： H05K3/284 , B23P15/007 , B29C45/0055 , B29C45/14639 , B29C45/1679 , B29C2045/0058 , B29C2045/169 , B29C2793/0009 , B29C2793/0027 , B29C2793/009 , H01F27/24 , H01F27/2804 , H01F2027/2809 , H01R43/24 , H05K1/0209 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K5/0004 , H05K5/0065 , H05K5/0217 , H05K5/0247 , H05K5/04 , H05K5/064 , H05K7/1427 , H05K7/209 , H05K2201/066 , H05K2201/10545 , H05K2203/1316 , H05K2203/1327 , H05K2203/167 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49155
摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.
摘要翻译：封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。提供散热鳍片或表面安装可焊接表面。在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积密封剂，间隙通道为互连提供安全机构间距和挫折。封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。互连可以被电镀以提供可插入到配合连接器中的连接器化模块。

10. 发明授权

US07952879B1 System and apparatus for efficient heat removal from heat-generating electronic modules 有权
标题翻译：用于从发热电子模块有效散热的系统和装置
公开(公告)号：US07952879B1
公开(公告)日：2011-05-31
申请号：US12423417
申请日：2009-04-14
申请人： Patrizio Vinciarelli , Michael B. Lafleur
发明人： Patrizio Vinciarelli , Michael B. Lafleur
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H05K7/209
摘要： This document describes apparatus and methods for a self-contained assembly having an encapsulated electronic module coupled to a heat removal device by a thermally conductive substance. In an illustrative example, the module includes at least one heat dissipating device thermally coupled by internal members to selected portions of a housing. The module housing includes a flat top surface with a perimeter adjoined to side surfaces. In one example, the heat removal device includes a cavity interior surface with an upper surface to match the module top surface, and side walls that match at least 50% by area of the selected portions of the module side surfaces. The cavity interior surface may receive at least 50% of the housing surface area. The matched portion of the cavity side surfaces may be at least 33% by area of the portion of the cavity upper surface that matches the module top surface.
摘要翻译：本文件描述了用于独立组件的装置和方法，其具有通过导热物质耦合到散热装置的封装的电子模块。在说明性示例中，该模块包括至少一个由内部构件热耦合到壳体的选定部分的散热装置。模块壳体包括具有与侧表面相邻的周边的平坦顶表面。在一个示例中，除热装置包括具有上表面以匹配模块顶表面的空腔内表面和与模块侧表面的所选部分的至少50％的面积匹配的侧壁。空腔内表面可以容纳至少50％的壳体表面积。空腔侧表面的匹配部分可以与空腔上表面的与模块顶表面匹配的部分的至少33％的面积。

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