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    • 1. 发明授权
    • Automated calibration methodology for VUV metrology system
    • VUV测量系统的自动校准方法
    • US08153987B2
    • 2012-04-10
    • US12454837
    • 2009-05-22
    • Jeffrey B. HurstMatthew WeldonPhillip WalshCristian RivasDale A. Harrison
    • Jeffrey B. HurstMatthew WeldonPhillip WalshCristian RivasDale A. Harrison
    • G12B13/00
    • G01N21/278G01N2021/335
    • A calibration pad having multiple calibration sites is provided. A particular calibration site may be utilized until that particular site has been determined to have become unacceptable for further use, for example from contamination, in which case the calibration processes may then move to use a different calibration site(s) on the calibration pad(s). A variety of techniques may be utilized to provide the determination that a site is no longer acceptable for use. Movement may thus occur over time from site to site for use in a calibration process. A variety of criteria may be established to determine when to move to another site. Though the designation of a site as “bad” may be based upon measured reflectance data, other criteria may also be used. For example, the number of times a site has been exposed to light may be the criteria for designating a site as bad. Alternatively the cumulative exposure of a site may be the criteria. Further, the plurality of calibration sites that are provided on the single calibration pad may be pre-evaluated so as to initially screen out unacceptable calibration sites prior to use. The techniques provided may be utilized in calibration processes which utilize a single calibration sample or processes which require a plurality of calibration samples.
    • 提供具有多个校准位置的校准垫。 可以使用特定的校准位点,直到该特定位点被确定为不可接受以进一步使用,例如来自污染,在这种情况下,校准过程然后可以移动到在校准垫上使用不同的校准位点 s)。 可以使用各种技术来提供站点不再可接受使用的确定。 因此,随着时间的推移,运动可能会在现场到现场进行,以用于校准过程。 可以建立各种标准来确定何时移动到另一个站点。 虽然将站点指定为“不良”可以基于测量的反射率数据,但是也可以使用其他标准。 例如,站点暴露于光线的次数可能是指定站点不佳的标准。 或者,站点的累积曝光可以是标准。 此外,可以预先评估设置在单个校准垫上的多个校准位置,以便在使用之前初始地屏蔽不可接受的校准位置。 提供的技术可以用于利用单个校准样品或需要多个校准样品的过程的校准过程。
    • 4. 发明授权
    • Inline metrology device
    • 内联计量装置
    • US06447370B1
    • 2002-09-10
    • US09836789
    • 2001-04-17
    • Matthew Weldon
    • Matthew Weldon
    • B24B5100
    • H01L21/67161H01L21/67219H01L21/67253
    • The present invention provides a method of presenting a wafer to a metrology device for measuring surface characteristics of the wafer. In accordance with one aspect of the present invention, the metrology device is physically integrated with the wafer processing machine between two wafer processing stations. The metrology device measures the uniformity and or thickness of the wafer. In the preferred embodiment, the measuring device is a single wavelength multi-angle reflectometry device. The device comprises a light source provided from multiple emission points. In the preferred embodiment, the light source comprises a laser and the emission point comprise fiber optic cabling. In accordance with yet another aspect of the present invention, a wafer location means is provided to track the position of the wafer passing over the wafer measurement device. Preferably, the tracking device comprises a light curtain comprising a light beam which detects when the wafer is entering the measuring device and suitably enables the tracking of the location of the wafer.
    • 本发明提供一种向测量装置呈现晶片以测量晶片的表面特性的方法。 根据本发明的一个方面,计量装置在两个晶片处理站之间与晶片处理机物理地集成。 测量装置测量晶片的均匀性或厚度。 在优选实施例中,测量装置是单波长多角度反射测量装置。 该装置包括从多个发射点提供的光源。 在优选实施例中,光源包括激光器,并且发射点包括光纤布线。根据本发明的另一方面,提供晶片定位装置以跟踪通过晶片测量装置的晶片的位置 。 优选地,跟踪装置包括光幕,其包括光束,该光束检测晶片何时进入测量装置,并且适当地使得能够跟踪晶片的位置。
    • 6. 发明授权
    • Contamination monitoring and control techniques for use with an optical metrology instrument
    • 用于光学计量仪器的污染监测和控制技术
    • US07342235B1
    • 2008-03-11
    • US11600413
    • 2006-11-16
    • Dale A. HarrisonMatthew Weldon
    • Dale A. HarrisonMatthew Weldon
    • G01J1/42
    • G01J3/36G01J3/08G01J3/10G01N21/15G01N21/33G01N21/55G01N21/94G01N2021/157
    • A technique is provided monitoring and removing contaminants from the surface of a sample that is being measured with an optical metrology tool. The monitoring and removing contaminants from the surface of a sample may occur prior to recording an optical response from said sample in order to ensure that accurate results are obtained. Contaminant layers may be quantified so that other measurements may be accurately obtained without requiring the removal of the contaminant layer. The contaminant layers may be removed through the exposure to optical radiation. Alternatively, properties of non-contaminant layers may be characterized by analyzing changes that occur in such layers by exposure to optical radiation. The optical metrology instrument may be an instrument which operates at wavelengths that include vacuum ultra-violet (VUV) wavelengths.
    • 提供了一种技术来监测和去除使用光学测量工具测量的样品表面的污染物。 在记录来自所述样品的光学响应之前,可能发生来自样品表面的污染物的监测和去除,以确保获得准确的结果。 可以量化污染物层,使得可以准确地获得其它测量值,而不需要去除污染物层。 可以通过暴露于光辐射来去除污染物层。 或者,非污染物层的性质可以通过分析通过暴露于光辐射而在这些层中发生的变化来表征。 光学测量仪器可以是在包括真空紫外(VUV)波长的波长下操作的仪器。
    • 9. 发明申请
    • Automated calibration methodology for VUV metrology system
    • VUV测量系统的自动校准方法
    • US20100294922A1
    • 2010-11-25
    • US12454837
    • 2009-05-22
    • JEFFREY B. HURSTMATTHEW WELDONPHILLIP WALSHCRISTIAN RIVASDALE A. HARRISON
    • JEFFREY B. HURSTMATTHEW WELDONPHILLIP WALSHCRISTIAN RIVASDALE A. HARRISON
    • G12B13/00
    • G01N21/278G01N2021/335
    • A calibration pad having multiple calibration sites is provided. A particular calibration site may be utilized until that particular site has been determined to have become unacceptable for further use, for example from contamination, in which case the calibration processes may then move to use a different calibration site(s) on the calibration pad(s). A variety of techniques may be utilized to provide the determination that a site is no longer acceptable for use. Movement may thus occur over time from site to site for use in a calibration process. A variety of criteria may be established to determine when to move to another site. Though the designation of a site as “bad” may be based upon measured reflectance data, other criteria may also be used. For example, the number of times a site has been exposed to light may be the criteria for designating a site as bad. Alternatively the cumulative exposure of a site may be the criteria. Further, the plurality of calibration sites that are provided on the single calibration pad may be pre-evaluated so as to initially screen out unacceptable calibration sites prior to use. The techniques provided may be utilized in calibration processes which utilize a single calibration sample or processes which require a plurality of calibration samples.
    • 提供具有多个校准位置的校准垫。 可以使用特定的校准位点,直到该特定位点被确定为不可接受以进一步使用,例如来自污染,在这种情况下,校准过程然后可以移动到在校准垫上使用不同的校准位点 s)。 可以使用各种技术来提供站点不再可接受使用的确定。 因此,随着时间的推移,运动可能会在现场到现场进行,以用于校准过程。 可以建立各种标准来确定何时移动到另一个站点。 虽然将站点指定为“不良”可以基于测量的反射率数据,但是也可以使用其他标准。 例如,站点暴露于光线的次数可能是指定站点不佳的标准。 或者,站点的累积曝光可以是标准。 此外,可以预先评估设置在单个校准垫上的多个校准位置,以便在使用之前最初屏蔽不可接受的校准位置。 提供的技术可以用于利用单个校准样品或需要多个校准样品的过程的校准过程。
    • 10. 发明授权
    • Contamination monitoring and control techniques for use with an optical metrology instrument
    • 用于光学计量仪器的污染监测和控制技术
    • US07663747B2
    • 2010-02-16
    • US11600477
    • 2006-11-16
    • Dale A. HarrisonMatthew Weldon
    • Dale A. HarrisonMatthew Weldon
    • G01N21/88
    • G01N21/94G01N21/33G01N2021/335
    • A technique is provided for monitoring and controlling surface contaminants on optical elements contained within the optical path (or sub-path) of an optical metrology instrument. The technique may be utilized in one embodiment in such a manner as to not require that additional components and/or instrumentation be coupled to, or integrated into, existing metrology equipment. Surface contaminants on optical elements within an optical metrology instrument are monitored so that cleaning procedures can be performed as deemed necessary. The cleaning procedures may include the use of exposing the optical elements to optical radiation. The optical metrology instrument may be an instrument which operates at wavelengths that include vacuum ultra-violet (VUV) wavelengths.
    • 提供了一种用于监测和控制包含在光学计量仪器的光路(或子路径)内的光学元件上的表面污染物的技术。 该技术可以在一个实施例中以不要求额外的部件和/或仪器耦合到或集成到现有计量设备中的方式来使用。 监视光学计量仪器内的光学元件上的表面污染物,以便可以根据需要执行清洁程序。 清洁程序可以包括将光学元件暴露于光学辐射的使用。 光学测量仪器可以是在包括真空紫外(VUV)波长的波长下操作的仪器。