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    • 3. 发明授权
    • Light receiving/emitting element module and manufacturing method thereof
    • 光接收/发射元件模块及其制造方法
    • US06394666B1
    • 2002-05-28
    • US09478518
    • 2000-01-06
    • Masayuki MinaminoMasayuki Iwase
    • Masayuki MinaminoMasayuki Iwase
    • G02B636
    • G02B6/4231G02B6/4203G02B6/4239G02B6/4249
    • A light receiving/emitting element module is provided by the invention, in which a light receiving/emitting element of a face light receiving/emitting type can be easily aligned and fixed with precision, and whose cost is low. At element loading surface (10) side of element loading substrate (1) onto which face light emitting laser array (8) is loaded, substrate side fitting parts (5) are provided, and ferrule side fitting parts (4) are provided in ferrule (2). Element loading surface (10) of element loading substrate (1) and connection end face (9) of ferrule (2) are disposed opposite each other, common micro balls (6) are fitted in the substrate side fitting parts (5) and ferrule side fitting parts (4) opposite each other to fix ferrule (2) and element loading substrate (1). Thereby, the optical axis of face light emitting laser array (8) and the optical axes of optical fibers (11) inserted and fixed in optical fiber insertion holes (3) in ferrule (2) are precisely aligned, and face light emitting laser array (8) and optical fibers (11) are optically connected to each other.
    • 通过本发明提供了一种光接收/发射元件模块,其中面光接收/发射型的光接收/发射元件可以容易地精确对准和固定,并且其成本低。 在装载有面发光激光器阵列(8)的元件装载基板(1)的元件装载面(10)侧,设置基板侧嵌合部(5),将套圈侧嵌合部(4)设置在套圈 (2)。 元件装载基板(1)的元件装载面(10)和套管(2)的连接端面(9)彼此相对设置,普通微球(6)装配在基板侧装配件(5)和套圈 侧配件部件(4)彼此相对以固定套圈(2)和元件装载基板(1)。 由此,面阵发光激光器阵列(8)的光轴和插入并固定在套圈(2)中的光纤插入孔(3)中的光纤(11)的光轴被精确对准,面对发光激光器阵列 (8)和光纤(11)彼此光学连接。
    • 4. 发明授权
    • Optical module
    • 光模块
    • US06715937B2
    • 2004-04-06
    • US10214591
    • 2002-08-09
    • Masayuki MinaminoTomoya KatoTakeo Shimizu
    • Masayuki MinaminoTomoya KatoTakeo Shimizu
    • G02B642
    • H05K3/3426G02B6/4201G02B6/4269Y02P70/613
    • A semiconductor laser module 1 having a package 2 containing a semiconductor laser device and lead pins 28 provided on both the side surfaces of the package 2. Since a base end portion of the lead pin 28 is fixed to the side surface at a position higher than the bottom surface of the package 2, the lead pin 28 can be laterally bent at a position higher than the bottom surface. Therefore, the semiconductor laser module 1 can be mounted on the surface of the wiring board 32 while the bottom surface of the package 2 is in close contact with the wiring board 32. Thus, since a heat radiation path from the bottom surface of the package 2 to the wiring board 32 is secured, it is possible to reduce the instability in the operating characteristic of the semiconductor laser device due to the thermal effect.
    • 一种半导体激光器模块1,其具有包含半导体激光器件的封装2和设置在封装2的两个侧表面上的引线引脚28.由于引脚28的基端部固定在侧表面, 包装2的底面可以在高于底面的位​​置处横向弯曲引导销28。 因此,半导体激光器模块1可以安装在布线板32的表面上,同时封装2的底表面与布线板32紧密接触。因此,由于从封装的底表面的散热路径 2到布线板32的固定,可以降低由于热效应导致的半导体激光器件的工作特性的不稳定性。