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    • 7. 发明申请
    • X-RAY IMAGING APPARATUS AND CONTROL METHOD THEREOF
    • X射线成像装置及其控制方法
    • US20090232272A1
    • 2009-09-17
    • US12395773
    • 2009-03-02
    • Osamu TsujiiKeiji TsuchiyaMasahiko Okunuki
    • Osamu TsujiiKeiji TsuchiyaMasahiko Okunuki
    • H05G1/60
    • A61B6/00A61B6/03A61B6/06A61B6/4021A61B6/4028A61B6/4233
    • An X-ray imaging apparatus includes a multi X-ray generating unit in which multiple X-ray foci are disposed in two-dimensional form at a predetermined pitch in a first direction, and a slit unit having multiple slit members each disposed opposite to its respective X-ray focus. Each slit member has multiple slits arranged in the first direction, and each of the slits forms a slice-formed X-ray beam whose lengthwise direction is a second direction that is different from the first direction. The two-dimensional detection unit detects the X-ray intensity of the formed X-ray beams at the detection surface. The X-ray imaging apparatus executes X-ray imaging at multiple positions while moving the multi X-ray generating unit and the slit unit in the first direction by the amount of the predetermined pitch, while keeping the relative positional relationship therebetween, and reconstructs an X-ray image based on the obtained X-ray intensity.
    • 一种X射线摄像装置,具备多个X射线发生单元,其中多个X射线焦点以第一方向以预定间距以二维形式设置,并且具有多个狭缝部件的狭缝单元各自与其相对设置 各自的X射线焦点。 每个狭缝构件具有沿着第一方向布置的多个狭缝,并且每个狭缝形成长度方向是与第一方向不同的第二方向的切片形状的X射线束。 二维检测单元检测形成的X射线束在检测面的X射线强度。 X射线成像装置在多个X射线成像装置的同时,在保持其间的相对位置关系的同时,将多X射线产生部和狭缝部沿第1方向移动预定间距的量,进行X射线成像, 基于获得的X射线强度的X射线图像。
    • 10. 发明授权
    • Electron emission element with schottky junction
    • 具肖特基结的电子发射元件
    • US5554859A
    • 1996-09-10
    • US557678
    • 1995-11-13
    • Takeo TsukamotoNobuo WatanabeToshihiko TakedaMasahiko Okunuki
    • Takeo TsukamotoNobuo WatanabeToshihiko TakedaMasahiko Okunuki
    • H01J1/308H01J9/02H01L29/06H01L29/12
    • H01J1/308H01J9/022
    • This is an electron emission with a semiconductor substrate having a p-type semiconductor layer whose impurity concentration falls within a concentration range for causing an avalanche breakdown in a least a portion of a surface of the semiconductor layer. A Schottky electrode is connected to the semiconductor layer. There are a means for applying a reverse bias voltage between the Schottky electrode and the p-type semiconductor layer to cause the Schotty electrode to emit electrons, and a lead electrode, formed at a proper position, for externally guiding the emitted electrons. At least a portion of the Schottky electrode is formed of a thin film of a material selected from metals of Group 1A, Group 2A, Group 3A, and lanthanoids, metal silicides of Group 1A, Group 2A, Group Group 3A, and lanthanoids, and metal borides of Group 1A, Group 2A, Group 3A, and lanthanoids, and metal carbides of Group 4A. A film thickness of the Schotty electrode is set to be not more than 100 .ANG..
    • 这是具有半导体衬底的电子发射,其半导体衬底具有p型半导体层,其杂质浓度落在半导体层的表面的至少一部分中引起雪崩击穿的浓度范围内。 肖特基电极连接到半导体层。 存在在肖特基电极和p型半导体层之间施加反向偏置电压以使Schotty电极发射电子的装置和形成在适当位置的引线电极,用于外部引导发射的电子。 肖特基电极的至少一部分由选自组1A,组2A,组3A和镧系元素的金属的薄膜,组1A,组2A,组3A和镧系元素的金属硅化物形成,以及 第1A组,第2A组,第3A组和镧系金属硼化物,以及4A组金属碳化物。 将Schotty电极的膜厚设定为不超过100。