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    • 4. 发明申请
    • CMOS DEVICE AND METHOD OF MANUFACTURING SAME
    • CMOS器件及其制造方法
    • US20090321838A1
    • 2009-12-31
    • US12215989
    • 2008-06-30
    • Bernhard SellAnand MurthyMark LiuDaniel B. Aubertine
    • Bernhard SellAnand MurthyMark LiuDaniel B. Aubertine
    • H01L29/423H01L21/8238
    • H01L21/823807H01L21/823814H01L21/823828H01L21/823835H01L29/66628H01L29/7834
    • A CMOS device includes NMOS (110) and PMOS (130) transistors, each of which include a gate electrode (111, 131) and a gate insulator (112, 132) that defines a gate insulator plane (150, 170). The transistors each further include source/drain regions (113/114, 133/134) having a first portion (115, 135) below the gate insulator plane and a second portion (116, 136) above the gate insulator plane, and an electrically insulating material (117). The NMOS transistor further includes a blocking layer (121) having a portion (122) between the gate electrode and a source contact (118) and a portion (123) between the gate electrode and a drain contact (119). The PMOS transistor further includes a blocking layer (141) having a portion (142) between the source region and the insulating material and a portion (143) between the drain region and the insulating material.
    • CMOS器件包括NMOS(110)和PMOS(130)晶体管,每个晶体管包括限定栅极绝缘体平面(150,170)的栅电极(111,131)和栅极绝缘体(112,132)。 晶体管每个还包括具有栅极绝缘体平面下方的第一部分(115,135)和栅极绝缘体平面上方的第二部分(116,136)的源/漏区(113/114,133 / 134) 绝缘材料(117)。 NMOS晶体管还包括阻挡层(121),其具有在栅电极和源极触点(118)之间的部分(122)和栅极电极和漏极触点(119)之间的部分(123)。 所述PMOS晶体管还包括阻挡层(141),所述阻挡层(141)具有在所述源极区域和所述绝缘材料之间的部分(142)以及所述漏极区域和所述绝缘材料之间的部分(143)。
    • 9. 发明授权
    • CMOS device and method of manufacturing same
    • CMOS器件及其制造方法
    • US07663192B2
    • 2010-02-16
    • US12215989
    • 2008-06-30
    • Bernhard SellAnand MurthyMark LiuDaniel Aubertine
    • Bernhard SellAnand MurthyMark LiuDaniel Aubertine
    • H01L27/092
    • H01L21/823807H01L21/823814H01L21/823828H01L21/823835H01L29/66628H01L29/7834
    • A CMOS device includes NMOS (110) and PMOS (130) transistors, each of which include a gate electrode (111, 131) and a gate insulator (112, 132) that defines a gate insulator plane (150, 170). The transistors each further include source/drain regions (113/114, 133/134) having a first portion (115, 135) below the gate insulator plane and a second portion (116, 136) above the gate insulator plane, and an electrically insulating material (117). The NMOS transistor further includes a blocking layer (121) having a portion (122) between the gate electrode and a source contact (118) and a portion (123) between the gate electrode and a drain contact (119). The PMOS transistor further includes a blocking layer (141) having a portion (142) between the source region and the insulating material and a portion (143) between the drain region and the insulating material.
    • CMOS器件包括NMOS(110)和PMOS(130)晶体管,每个晶体管包括限定栅极绝缘体平面(150,170)的栅电极(111,131)和栅极绝缘体(112,132)。 晶体管每个还包括具有栅极绝缘体平面下方的第一部分(115,135)和栅极绝缘体平面上方的第二部分(116,136)的源/漏区(113/114,133 / 134) 绝缘材料(117)。 NMOS晶体管还包括阻挡层(121),其具有在栅电极和源极触点(118)之间的部分(122)和栅极电极和漏极触点(119)之间的部分(123)。 所述PMOS晶体管还包括阻挡层(141),所述阻挡层(141)具有在所述源极区域和所述绝缘材料之间的部分(142)以及所述漏极区域和所述绝缘材料之间的部分(143)。