专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080029882A1 Thermal Interconnect System and Method of Production Thereof 审中-公开
标题翻译：热互连系统及其生产方法
公开(公告)号：US20080029882A1
公开(公告)日：2008-02-07
申请号：US11834852
申请日：2007-08-07
申请人： Mark Fery , Nancy Dean
发明人： Mark Fery , Nancy Dean
IPC分类号： H01L23/36
CPC分类号： G05B19/41865 , G05B2219/31411 , G05B2219/32267 , G05B2219/32271 , G05B2219/45028 , H01L23/3735 , H01L23/42 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y02P80/40 , Y02P90/20 , H01L2924/00
摘要： A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.
摘要翻译：本文描述的热转印材料包括：散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料以及至少一个焊料材料，其中焊料材料直接沉积到散热器部件的底面上。形成层状热界面材料和热转印材料的方法包括：a）提供散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料; b）提供至少一种焊料材料，其中焊料材料直接沉积到散热器部件的底表面上; 以及c）将所述至少一种焊料材料沉积到所述散热器部件的底表面上。

2. 发明申请

US20070013054A1 Thermally conductive materials, solder preform constructions, assemblies and semiconductor packages 审中-公开
标题翻译：导热材料，焊料预制件结构，组件和半导体封装
公开(公告)号：US20070013054A1
公开(公告)日：2007-01-18
申请号：US11180459
申请日：2005-07-12
申请人： Brian Ruchert , Martin Weiser , Mark Fery , Nancy Dean , John Lalena
发明人： Brian Ruchert , Martin Weiser , Mark Fery , Nancy Dean , John Lalena
IPC分类号： H01L23/34
CPC分类号： H01L23/3675 , H01L23/3736 , H01L2224/1134 , H01L2224/13144 , H01L2224/16 , H01L2224/73253 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12044 , H01L2924/15311 , H01L2924/16152 , H01L2924/3011 , H01L2924/00
摘要： A thermally conductive material that includes an alloy which includes indium, zinc, magnesium or a combination thereof is described herein. Also, a semiconductor package comprising a thermal interface material which includes solder and particles dispersed throughout the solder, the particles being of thermal conductivity greater than or equal to about 80 W/m-K is described herein. In one described embodiment, a semiconductor package includes a thermal interface material which includes at least one lanthanide element. In yet another embodiment disclosed herein, a solder preform construction includes a solder and a structure within the solder, the solder being of a first composition and the structure being of a second composition which has a lower melting point than the first composition. In another embodiment disclosed herein, an assembly comprising: a heat spreader; and a solder preform construction bonded to the heat spreader, the solder preform construction including a solder of a first composition, and a region within the solder of a second composition which has a lower melting point than the first composition. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.
摘要翻译：本文描述了包括包含铟，锌，镁或其组合的合金的导热材料。此外，本文描述了包括热界面材料的半导体封装，其包括分布在整个焊料中的焊料和颗粒，该导热系数大于或等于约80W / m-K的颗粒。在一个所描述的实施例中，半导体封装包括包含至少一种镧系元素的热界面材料。在本文公开的另一个实施例中，焊料预制件构造包括焊料和焊料内的结构，焊料是第一组成，并且该结构是具有比第一组合物更低的熔点的第二组成。在本文公开的另一实施例中，一种组件包括：散热器; 以及焊料预制件结构，其结合到所述散热器，所述焊料预制件构造包括第一组合物的焊料，以及第二组合物的焊料内的区域，其具有比所述第一组成物更低的熔点。形成层状热界面材料和热转印材料的方法包括：a）提供散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料; b）提供至少一种焊料材料，其中焊料材料直接沉积到散热器部件的底表面上; 以及c）将所述至少一种焊料材料沉积到所述散热器部件的底表面上。

3. 发明申请

US20060151873A1 Thermal interconnect systems methods of production and uses thereof 失效
标题翻译：热互连系统的生产方法及其用途
公开(公告)号：US20060151873A1
公开(公告)日：2006-07-13
申请号：US10538821
申请日：2004-06-04
申请人： Mark Fery , Nancy Dean
发明人： Mark Fery , Nancy Dean
IPC分类号： H01L23/34
CPC分类号： G05B19/41865 , G05B2219/31411 , G05B2219/32267 , G05B2219/32271 , G05B2219/45028 , H01L23/3735 , H01L23/42 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y02P80/40 , Y02P90/20 , H01L2924/00
摘要： A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.
摘要翻译：本文描述的热转印材料包括：散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料以及至少一个焊料材料，其中焊料材料直接沉积到散热器部件的底面上。形成层状热界面材料和热转印材料的方法包括：a）提供散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料; b）提供至少一种焊料材料，其中焊料材料直接沉积到散热器部件的底表面上; 以及c）将所述至少一种焊料材料沉积到所述散热器部件的底表面上。

4. 发明授权

US07897437B2 Thermal interconnect systems methods of production and uses thereof 有权
标题翻译：热互连系统的生产方法及其用途
公开(公告)号：US07897437B2
公开(公告)日：2011-03-01
申请号：US11961067
申请日：2007-12-20
申请人： Mark Fery , Jai Subramanian
发明人： Mark Fery , Jai Subramanian
IPC分类号： H01L21/00
CPC分类号： C25D5/18 , H01L23/3735 , H01L23/3736 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , Y10T156/10 , Y10T428/12535 , Y10T428/12986 , H01L2924/00
摘要： Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material to accept solder and prevent the formation of oxides; and d) a layer of solder material. Methods of forming layered interface materials are described herein that include: a) providing a pulse-plated thermally conductive interface material; b) providing a heat spreader component; and c) physically coupling the thermally conductive interface material and the heat spreader component. At least one additional layer, including a substrate layer, a surface, an adhesive, a compliant fibrous component or any other suitable layer or a thermal interface material, can be coupled to the layered interface material.
摘要翻译：本文所述的层状界面材料包括至少一个脉冲镀覆的导热材料，例如互连材料，以及耦合到所述至少一个脉冲镀覆的导热材料的至少一个散热器部件。本文还描述了具有迁移组分的镀层分层界面材料，并且包括至少一个脉冲镀导热材料; 和至少一个散热器部件，其中与参考分层界面材料的迁移组分相比，镀层的界面材料的迁移组分降低至少51％。本文描述的另一分层界面材料包括：a）热导体; b）保护层; c）一层接受焊料并防止氧化物形成的材料; 和d）一层焊料。本文描述了形成层状界面材料的方法，其包括：a）提供脉冲镀覆的导热界面材料; b）提供散热器部件; 以及c）物理地耦合导热界面材料和散热器部件。包括基底层，表面，粘合剂，顺应性纤维组分或任何其它合适的层或热界面材料的至少一个附加层可以耦合到分层界面材料。

5. 发明授权

US07678243B2 Internal heat spreader plating methods and devices 有权
标题翻译：内部散热器电镀方法和装置
公开(公告)号：US07678243B2
公开(公告)日：2010-03-16
申请号：US10765782
申请日：2003-06-11
申请人： Paul Silinger , Mark Fery
发明人： Paul Silinger , Mark Fery
IPC分类号： C25D17/00
CPC分类号： C25D5/022 , C25D5/08 , C25D7/00 , C25D7/0642 , C25D7/0685 , C25D17/008
摘要： An improved plating system comprises a plurality of non-electrically conductive shields forming an elongated upper channel and an elongated lower channel, the upper and lower channels each having a width less than or equal to one inch; a plurality of part holding clamps electrically coupled to a power source and positioned within the upper channel or the lower channel; a plating solution sparger comprising a series of inlets oriented to direct any plating solution flowing through the inlets into the lower channel and towards the upper channel; and a plurality of anodes positioned outside and along the length of the upper and lower channels. An improved method of plating a work piece comprises: submerging a work piece to be plated in a volume of plating solution; positioning a work piece to be plated at least partially within an upper plating channel and a lower plating channel, the upper and lower plating channels comprising non electrically conductive sides, the channels being positioned opposite each other and being separated from each other, the separation between the channels forming a pair of solution egress slots positioned approximately over the center of the work piece to be plated; causing electrical current to flow between the work piece and one or more anodes, the current flow passing through the solution egress slots; and moving the work piece to be plated along the length of the plating channels to form one or more internal heat spreaders on a surface of the work piece which is essentially parallel to the shields.
摘要翻译：改进的电镀系统包括形成细长的上通道和细长的下通道的多个非导电屏蔽，所述上通道和下通道各自具有小于或等于一英寸的宽度; 多个部分保持夹，电耦合到电源并定位在上通道或下通道内; 一种电镀溶液喷射器，包括一系列入口，其定向成将流过入口的任何电镀溶液引导到下通道并朝向上通道; 以及多个阳极，位于上部和下部通道的外部并沿着其长度。对工件进行电镀的改进方法包括：将要镀覆的工件浸没在电镀液体积中; 将要被电镀的工件至少部分地定位在上电镀通道和下电镀通道内，上电镀通道和下电镀通道包括非导电侧，通道彼此相对定位并彼此分离，所述通道形成一对溶液出口槽，其大致位于要被电镀的工件的中心上方; 导致电流在工件和一个或多个阳极之间流动，电流流过溶液出口; 并且沿着电镀通道的长度移动要被电镀的工件，以在工件的基本上平行于屏蔽件的表面上形成一个或多个内部散热器。

6. 发明申请

US20090294115A1 Thermal Interconnect System and Production Thereof 审中-公开
标题翻译：热互连系统及其生产
公开(公告)号：US20090294115A1
公开(公告)日：2009-12-03
申请号：US12495118
申请日：2009-06-30
申请人： Mark Fery , Nancy Dean
发明人： Mark Fery , Nancy Dean
IPC分类号： H05K7/20 , F28F7/00 , F28F21/00
CPC分类号： G05B19/41865 , G05B2219/31411 , G05B2219/32267 , G05B2219/32271 , G05B2219/45028 , H01L23/3735 , H01L23/42 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y02P80/40 , Y02P90/20 , H01L2924/00
摘要： A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.
摘要翻译：本文描述的热转印材料包括：散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料以及至少一个焊料材料，其中焊料材料直接沉积到散热器部件的底面上。形成层状热界面材料和热转印材料的方法包括：a）提供散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料; b）提供至少一种焊料材料，其中焊料材料直接沉积到散热器部件的底表面上; 以及c）将所述至少一种焊料材料沉积到所述散热器部件的底表面上。

7. 发明申请

US20080176095A1 THERMAL INTERCONNECT SYSTEMS METHODS OF PRODUCTION AND USES THEREOF 有权
标题翻译：热互连系统的生产方法及其用途
公开(公告)号：US20080176095A1
公开(公告)日：2008-07-24
申请号：US11961067
申请日：2007-12-20
申请人： Mark Fery , Jai Subramanian
发明人： Mark Fery , Jai Subramanian
IPC分类号： B32B15/04
CPC分类号： C25D5/18 , H01L23/3735 , H01L23/3736 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , Y10T156/10 , Y10T428/12535 , Y10T428/12986 , H01L2924/00
摘要： Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material to accept solder and prevent the formation of oxides; and d) a layer of solder material. Methods of forming layered interface materials are described herein that include: a) providing a pulse-plated thermally conductive interface material; b) providing a heat spreader component; and c) physically coupling the thermally conductive interface material and the heat spreader component. At least one additional layer, including a substrate layer, a surface, an adhesive, a compliant fibrous component or any other suitable layer or a thermal interface material, can be coupled to the layered interface material.
摘要翻译：本文所述的层状界面材料包括至少一个脉冲镀覆的导热材料，例如互连材料，以及耦合到所述至少一个脉冲镀覆的导热材料的至少一个散热器部件。本文还描述了具有迁移组分的镀层分层界面材料，并且包括至少一个脉冲镀导热材料; 和至少一个散热器部件，其中与参考分层界面材料的迁移组分相比，镀层的界面材料的迁移组分降低至少51％。本文描述的另一分层界面材料包括：a）热导体; b）保护层; c）一层接受焊料并防止氧化物形成的材料; 和d）一层焊料。本文描述了形成层状界面材料的方法，其包括：a）提供脉冲镀覆的导热界面材料; b）提供散热器部件; 以及c）物理地耦合导热界面材料和散热器部件。包括基底层，表面，粘合剂，顺应性纤维组分或任何其它合适的层或热界面材料的至少一个附加层可以耦合到分层界面材料。

8. 发明授权

US5639014A Integral solder and plated sealing cover and method of making same 失效
标题翻译：一体化焊料和电镀密封盖及其制造方法
公开(公告)号：US5639014A
公开(公告)日：1997-06-17
申请号：US498538
申请日：1995-07-05
申请人： David M. Damiano , Mark Fery , Terry J. Oldham
发明人： David M. Damiano , Mark Fery , Terry J. Oldham
IPC分类号： H01L23/04 , H01L21/50 , B23K31/02
CPC分类号： H01L23/06 , H01L23/04 , B23K2201/40 , H01L2924/0002 , H01L2924/01079
摘要： A method of making an integral solder and plated cover for an electronic package is described which involves applying a corrosion resistant material onto a metal strip and a solderable material on the corrosion resistant material. A solder material is then roll clad over the solderable material after which it is stamped to covers which are then coated with gold.
摘要翻译：描述了制造用于电子封装的整体焊料和镀覆盖的方法，其涉及将抗腐蚀材料施加到耐腐蚀材料上的金属带和可焊接材料上。然后将焊料材料卷绕在可焊接材料上，然后将其冲压成盖，然后用金涂覆。

9. 发明授权

US07378730B2 Thermal interconnect systems methods of production and uses thereof 有权
标题翻译：热互连系统的生产方法及其用途
公开(公告)号：US07378730B2
公开(公告)日：2008-05-27
申请号：US10545597
申请日：2004-02-13
申请人： Mark Fery , Jai Subramanian
发明人： Mark Fery , Jai Subramanian
IPC分类号： H01L23/10 , H05K7/20
CPC分类号： C25D5/18 , H01L23/3735 , H01L23/3736 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , Y10T156/10 , Y10T428/12535 , Y10T428/12986 , H01L2924/00
摘要： Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material accept solder and prevent the formation of oxides; and d) a layer of solder material. Methods of forming layered interface materials are described herein that include: a) providing a pulse-plated thermally conductive interface material; b) providing a heat spreader component; and c) physically coupling the thermally conductive interface material and the heat spreader component. At least one additional layer, including a substrate layer, a surface, adhesive, a compliant fibrous component or any other suitable layer or a thermal interface material, can be coupled to the layered interface material.
摘要翻译：本文所述的层状界面材料包括至少一个脉冲镀覆的导热材料，例如互连材料，以及耦合到所述至少一个脉冲镀覆的导热材料的至少一个散热器部件。本文还描述了具有迁移组分的镀层分层界面材料，并且包括至少一个脉冲镀导热材料; 和至少一个散热器部件，其中与参考分层界面材料的迁移组分相比，镀层的界面材料的迁移组分降低至少51％。本文描述的另一分层界面材料包括：a）热导体; b）保护层; c）一层材料接受焊料并防止氧化物的形成; 和d）一层焊料。本文描述了形成层状界面材料的方法，其包括：a）提供脉冲镀覆的导热界面材料; b）提供散热器部件; 以及c）物理地耦合导热界面材料和散热器部件。包括基底层，表面，粘合剂，柔顺纤维组分或任何其它合适的层或热界面材料的至少一个附加层可以耦合到分层界面材料。

10. 发明授权

US07256491B2 Thermal interconnect systems methods of production and uses thereof 失效
标题翻译：热互连系统的生产方法及其用途
公开(公告)号：US07256491B2
公开(公告)日：2007-08-14
申请号：US10538821
申请日：2004-06-04
申请人： Mark Fery , Nancy Dean
发明人： Mark Fery , Nancy Dean
IPC分类号： H01L23/10 , H01L21/00
CPC分类号： G05B19/41865 , G05B2219/31411 , G05B2219/32267 , G05B2219/32271 , G05B2219/45028 , H01L23/3735 , H01L23/42 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , Y02P80/40 , Y02P90/20 , H01L2924/00
摘要： A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.
摘要翻译：本文描述的热转印材料包括：散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料以及至少一个焊料材料，其中焊料材料直接沉积到散热器部件的底面上。形成层状热界面材料和热转印材料的方法包括：a）提供散热器部件，其中散热器部件包括顶表面，底表面和至少一个散热器材料; b）提供至少一种焊料材料，其中焊料材料直接沉积到散热器部件的底表面上; 以及c）将所述至少一种焊料材料沉积到所述散热器部件的底表面上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式