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1. 发明申请

US20130099392A1 Support mounted electrically interconnected die assembly 有权
标题翻译：支撑安装电互连模具组件
公开(公告)号：US20130099392A1
公开(公告)日：2013-04-25
申请号：US13456126
申请日：2012-04-25
申请人： Simon J. S. McElrea , Marc E. Robinson , Lawrence Douglas Andrews, JR.
发明人： Simon J. S. McElrea , Marc E. Robinson , Lawrence Douglas Andrews, JR.
IPC分类号： H01L23/48 , H01L21/58
CPC分类号： H01L25/0657 , H01L21/56 , H01L23/48 , H01L24/24 , H01L24/80 , H01L24/82 , H01L29/0657 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/00
摘要： Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
摘要翻译：堆叠的模具组件电连接到任何支撑件上的连接部位，而不与任何插入的基板或引线框架电连接，并且没有焊料。

2. 发明授权

US08178978B2 Support mounted electrically interconnected die assembly 有权
标题翻译：支撑安装电互连模具组件
公开(公告)号：US08178978B2
公开(公告)日：2012-05-15
申请号：US12403175
申请日：2009-03-12
申请人： Simon J. S. McElrea , Marc E. Robinson , Lawrence Douglas Andrews, Jr.
发明人： Simon J. S. McElrea , Marc E. Robinson , Lawrence Douglas Andrews, Jr.
IPC分类号： H01L23/495 , H01L23/50 , H01L23/34 , H01L25/16 , H01L21/50
CPC分类号： H01L25/0657 , H01L21/56 , H01L23/48 , H01L24/24 , H01L24/80 , H01L24/82 , H01L29/0657 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/00
摘要： Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
摘要翻译：堆叠的模具组件电连接到任何支撑件上的连接部位，而不与任何插入的基板或引线框架电连接，并且没有焊料。

3. 发明授权

US08723332B2 Electrically interconnected stacked die assemblies 有权
公开(公告)号：US08723332B2
公开(公告)日：2014-05-13
申请号：US12124077
申请日：2008-05-20
申请人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
发明人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

4. 发明申请

US20110037159A1 Electrically Interconnected Stacked Die Assemblies 有权
标题翻译：电连接堆叠模具组件
公开(公告)号：US20110037159A1
公开(公告)日：2011-02-17
申请号：US12913604
申请日：2010-10-27
申请人： Simon J. S. McElrea , Lawrence Douglas Andrews, JR. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
发明人： Simon J. S. McElrea , Lawrence Douglas Andrews, JR. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
IPC分类号： H01L23/52
CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.
摘要翻译：在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。在一些实施例中，导电迹线由导电聚合物形成。提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。

5. 发明申请

US20100117224A1 Sensor 审中-公开
标题翻译：传感器
公开(公告)号：US20100117224A1
公开(公告)日：2010-05-13
申请号：US12638870
申请日：2009-12-15
申请人： Simon J. S. McElrea , Marc E. Robinson
发明人： Simon J. S. McElrea , Marc E. Robinson
IPC分类号： H01L23/538 , H01L23/48 , H01L21/30 , H01L21/50
CPC分类号： H01L27/14618 , H01L24/24 , H01L24/73 , H01L24/82 , H01L27/14636 , H01L2224/24146 , H01L2224/24226 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2924/1461 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00
摘要： A sensor die in a sensor device includes a conformal dielectric coating over at least a die sidewall adjacent an interconnect edge and, in some devices, a conformal dielectric coating over at least part of the active area of the front side of the die. The sensor die can be connected to circuitry in a support by an electrically conductive material that is applicable in a flowable form, such as a curable electrically conductive polymer, which is applied onto or adjacent the dielectric coating on the die sidewall, and which is cured to complete connection between interconnect pads on the die and exposed sites on the support circuitry. In some devices, a coating over the active area of the sensor die provides mechanical and chemical protection for underlying structures in and on the die. In an image sensor device, for example, the coating over the image sensor array on the die is substantially optically transparent. Also, a package contains such a sensor die mounted on and electrically connected to a support; and assemblies include such a sensor die and additional die mounted on and electrically connected to opposite sides of a support. Also, methods are disclosed for making the sensor die, devices, packages, and assemblies.
摘要翻译：传感器装置中的传感器管芯包括至少一个邻近互连边缘的管芯侧壁和在一些器件中在管芯前侧的至少一部分有源区域上的共形绝缘涂层的共形绝缘涂层。传感器芯片可以通过可应用于可流动形式的导电材料（例如可固化导电聚合物）连接到支撑体中，该可固化导电聚合物被施加到模具侧壁上的电介质涂层上或附近，并被固化以完成管芯上的互连焊盘和支撑电路上的暴露部位之间的连接。在一些设备中，传感器管芯的有源区域上的涂层为模具中和模具上的底层结构提供机械和化学保护。在图像传感器装置中，例如，模具上的图像传感器阵列上的涂层基本上是光学透明的。另外，一个封装包含安装在支架上并与其电连接的传感器芯片; 并且组件包括这样的传感器管芯和安装在支撑件的相对侧并电连接到支撑件的相对侧的附加管芯。此外，公开了用于制造传感器管芯，器件，封装和组件的方法。

6. 发明申请

US20100052087A1 Image Sensor 审中-公开
标题翻译：图像传感器
公开(公告)号：US20100052087A1
公开(公告)日：2010-03-04
申请号：US12550012
申请日：2009-08-28
申请人： Simon J. S. McElrea , Marc E. Robinson
发明人： Simon J. S. McElrea , Marc E. Robinson
IPC分类号： H01L31/0203 , H01L31/0216 , H01L21/56
CPC分类号： H01L27/14618 , H01L24/24 , H01L27/14683 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： An image sensor die includes a conformal dielectric coating over at least a die sidewall adjacent an interconnect edge and, in some embodiments, a conformal dielectric coating over the image array area of the front side of the die. The die can be connected to circuitry in a support by an electrically conductive material that is applicable in a flowable form, such as a curable electrically conductive polymer, which is applied onto or adjacent the dielectric coating on the die sidewall, and which is cured to complete connection between interconnect pads on the die and exposed sites on the support circuitry. The coating over the image array area, at least, is substantially transparent to visible light, and provides mechanical and chemical protection for underlying structures in and on the image sensor. Also, a package contains such an image sensor die mounted on and electrically connected to a support; and assemblies include such an image sensor die and additional die mounted on and electrically connected to opposite sides of a support. Also, methods are disclosed for making the image sensor die, packages, and assemblies.
摘要翻译：图像传感器管芯包括在邻近互连边缘的至少一个管芯侧壁上的保形电介质涂层，并且在一些实施例中，在管芯前侧的图像阵列区域上包括共形绝缘涂层。模具可以通过可应用于可流动形式的导电材料（例如可固化导电聚合物）连接到支撑体中，该可固化导电聚合物施加到模具侧壁上的电介质涂层上或附近，并被固化至芯片上的互连焊盘和支撑电路上的暴露部位之间的完整连接。至少在图像阵列区域上的涂层对可见光基本上是透明的，并为图像传感器中和图像传感器上的底层结构提供机械和化学保护。此外，包装包含安装在支撑件上并电连接到支撑件的图像传感器模具; 并且组件包括这样的图像传感器裸片和安装在支撑件的相对侧并且电连接到支撑件的相对侧的附加模具。此外，公开了用于制造图像传感器管芯，封装和组件的方法。

7. 发明申请

US20080303131A1 ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES 有权
标题翻译：电气互连堆叠式电池组件
公开(公告)号：US20080303131A1
公开(公告)日：2008-12-11
申请号：US12124077
申请日：2008-05-20
申请人： Simon J.S. McElrea , Lawrence Douglas Andrews, JR. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
发明人： Simon J.S. McElrea , Lawrence Douglas Andrews, JR. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
IPC分类号： H01L23/02
CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.
摘要翻译：在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。在一些实施例中，导电迹线由导电聚合物形成。提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。

8. 发明授权

US09305862B2 Support mounted electrically interconnected die assembly 有权
公开(公告)号：US09305862B2
公开(公告)日：2016-04-05
申请号：US13456126
申请日：2012-04-25
申请人： Simon J. S. McElrea , Marc E. Robinson , Lawrence Douglas Andrews, Jr.
发明人： Simon J. S. McElrea , Marc E. Robinson , Lawrence Douglas Andrews, Jr.
IPC分类号： H01L23/495 , H01L23/50 , H01L23/34 , H01L25/16 , H01L21/50 , H01L23/48 , H01L23/00 , H01L25/065 , H01L29/06 , H01L21/58
CPC分类号： H01L25/0657 , H01L21/56 , H01L23/48 , H01L24/24 , H01L24/80 , H01L24/82 , H01L29/0657 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/00
摘要： Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.

9. 发明授权

US08629543B2 Electrically interconnected stacked die assemblies 有权
标题翻译：电互连叠层模组件
公开(公告)号：US08629543B2
公开(公告)日：2014-01-14
申请号：US12913604
申请日：2010-10-27
申请人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
发明人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep
IPC分类号： H01L23/02
CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.
摘要翻译：在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。在一些实施例中，导电迹线由导电聚合物形成。提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。

10. 发明申请

US20090230528A1 Support Mounted Electrically Interconnected Die Assembly 有权
标题翻译：支撑电连接的模具总成
公开(公告)号：US20090230528A1
公开(公告)日：2009-09-17
申请号：US12403175
申请日：2009-03-12
申请人： Simon J. S. McElrea , Marc E. Robinson , Lawrence Douglas Andrews, JR.
发明人： Simon J. S. McElrea , Marc E. Robinson , Lawrence Douglas Andrews, JR.
IPC分类号： H01L23/495 , H01L23/50 , H01L23/34 , H01L25/16 , H01L21/50
CPC分类号： H01L25/0657 , H01L21/56 , H01L23/48 , H01L24/24 , H01L24/80 , H01L24/82 , H01L29/0657 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01067 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/00
摘要： Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.
摘要翻译：堆叠的模具组件电连接到任何支撑件上的连接部位，而不与任何插入的基板或引线框架电连接，并且没有焊料。

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