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    • 2. 发明申请
    • MOBILE PRESSURE OPTIMIZATION UNIT FOR DRILLING OPERATIONS
    • 用于钻井作业的移动式压力优化单元
    • US20120292108A1
    • 2012-11-22
    • US13406730
    • 2012-02-28
    • James R. LOVORNMalcolm E. WHITTAKERDerrick W. LEWIS
    • James R. LOVORNMalcolm E. WHITTAKERDerrick W. LEWIS
    • E21B21/08
    • A well drilling method can include transporting a pressure optimization unit to a rig site, the pressure optimization unit including a choke manifold, a control system which automatically controls operation of the choke manifold, and a flowmeter which measures flow of drilling fluid through the choke manifold, and then interconnecting the pressure optimization unit to rig drilling equipment. A pressure optimization unit for use with a well drilling system can include a choke manifold, a control system which automatically controls operation of the choke manifold, and a flowmeter which measures flow of drilling fluid through the choke manifold. The choke manifold, control system and flowmeter may be incorporated into a same conveyance which transports the pressure optimization unit to a rig site.
    • 钻井方法可以包括将压力优化单元运送到钻机现场,压力优化单元包括扼流器歧管,自动控制扼流器歧管的操作的控制系统以及测量钻井流体通过扼流圈的流量的流量计 ,然后将压力优化单元与钻机钻井设备相互连接。 与钻井系统一起使用的压力优化单元可以包括扼流器歧管,自动控制扼流器歧管的操作的控制系统和测量钻井流体通过扼流圈的流量的流量计。 扼流器歧管,控制系统和流量计可以并入到将压力优化单元输送到钻机现场的相同输送器中。
    • 3. 发明申请
    • Selectively Leached Cutter
    • 选择性沥青切割机
    • US20140166371A1
    • 2014-06-19
    • US14110589
    • 2012-04-20
    • Malcolm E. Whittaker
    • Malcolm E. Whittaker
    • E21B10/573B24D3/10
    • E21B10/573B22F7/08B22F2005/001B24D3/10C22C1/00C22C19/07C22C26/00C22C29/08E21B10/567E21B10/5676
    • A method of manufacturing a polycrystalline diamond (PCD) cutting element used as drill bit cutting elements (10) is disclosed. The method comprises leaching a PCD body formed from diamond particles (202) using a binder-catalyzing material so as to remove substantially all of the binder-catalyzing material from portions of a cutting surface of the PCD body. A portion (24) of the cutting surface is identified as a cutting area which, in use of the cutting element to cut material, is heated by the cutting action of the cutting element. Leaching of the PCD body includes performing a relatively deep leach in the portion of the cutting surface identified as the cutting area and performing a relatively shallow leach in at least the portion (26) of the cutting surface surrounding the identified cutting area.
    • 公开了一种制造用作钻头切割元件(10)的多晶金刚石(PCD)切割元件的方法。 该方法包括使用粘合剂催化材料浸出由金刚石颗粒(202)形成的PCD体,以便从PCD体的切割表面的部分基本上除去所有的粘合剂催化材料。 切割表面的一部分(24)被识别为切割区域,该切割区域在切割材料的切割元件的使用中被切割元件的切割动作加热。 PCD体的浸出包括在被确定为切割区域的切割表面的部分中执行相对较深的浸出,并且在至少围绕识别的切割区域的切割表面的部分(26)中执行相对较浅的浸出。
    • 5. 发明授权
    • Selectively leached cutter
    • 精选沥青切割机
    • US09488011B2
    • 2016-11-08
    • US14110589
    • 2012-04-20
    • Malcolm E. Whittaker
    • Malcolm E. Whittaker
    • E21B10/573B22F7/08C22C1/00C22C19/07C22C26/00C22C29/08E21B10/567B24D3/10B22F5/00
    • E21B10/573B22F7/08B22F2005/001B24D3/10C22C1/00C22C19/07C22C26/00C22C29/08E21B10/567E21B10/5676
    • The present disclosure provides a method of manufacturing a polycrystalline diamond (PCD) cutting element used as drill bit cutting elements (10). The method includes leaching a PCD body formed from diamond particles (202) using a binder-catalyzing material so as to remove substantially all of the binder-catalyzing material from portions of a cutting surface of the PCD body. A portion (24) of the cutting surface is identified as a cutting area which, in use of the cutting element to cut material, is heated by the cutting action of the cutting element. Leaching of the PCD body includes performing a relatively deep leach in the portion of the cutting surface identified as the cutting area and performing a relatively shallow leach in at least the portion (26) of the cutting surface surrounding the identified cutting area.
    • 本公开提供了一种制造用作钻头切割元件(10)的多晶金刚石(PCD)切割元件的方法。 该方法包括使用粘合剂催化材料浸出由金刚石颗粒(202)形成的PCD体,以便从PCD体的切割表面的部分基本上除去粘合剂催化材料。 切割表面的一部分(24)被识别为切割区域,该切割区域在切割材料的切割元件的使用中被切割元件的切割动作加热。 PCD体的浸出包括在被确定为切割区域的切割表面的部分中执行相对较深的浸出,并且在至少围绕识别的切割区域的切割表面的部分(26)中执行相对较浅的浸出。