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    • 2. 发明申请
    • DOOR TRIM FOR VEHICLE
    • 车门
    • US20120119538A1
    • 2012-05-17
    • US13286568
    • 2011-11-01
    • Ryousuke SAKAMAKIMasaaki SHIMIZU
    • Ryousuke SAKAMAKIMasaaki SHIMIZU
    • B60R13/02
    • B60R13/043
    • A door trim for a vehicle is provided. The vehicle comprises a fixed body including an opening and a movable body that opens and closes the opening. At least one of the fixed body and the movable body includes an attachment portion. The door trim comprises an elongate shape and a cover. The cover is attached along the attachment portion in a manner to cover the attachment portion. The door trim comprises a reinforcing member for reinforcing the cover. The reinforcing member is provided between the cover and the attachment portion to directly oppose the attachment portion. At least one of the cover and the reinforcing member is directly assembled to the attachment portion.
    • 提供了一种车辆的车门装饰。 该车辆包括一个固定体,该固定体包括一开口和一开启和关闭开口的可移动体。 固定体和移动体中的至少一个包括附接部。 门装饰件包括细长形状和盖子。 所述盖沿着所述附接部分以覆盖所述附接部分的方式附接。 门装饰件包括用于加强盖的加强构件。 加强构件设置在盖和附接部之间以与安装部直接相对。 盖和加强构件中的至少一个直接组装到附接部分。
    • 10. 发明申请
    • Method, tool, and apparatus for manufacturing a semiconductor device
    • 用于制造半导体器件的方法,工具和装置
    • US20080052901A1
    • 2008-03-06
    • US11889403
    • 2007-08-13
    • Koichi NishikawaMasaaki ShimizuKenichi NonakaSeiichi YokoyamaHideki Hashimoto
    • Koichi NishikawaMasaaki ShimizuKenichi NonakaSeiichi YokoyamaHideki Hashimoto
    • H05K3/00H05B3/06
    • H01L21/67115H01L21/67103H01L21/68721H01L29/1608H01L29/6606Y10T29/49117Y10T29/49124
    • A method of manufacturing a semiconductor device, includes increasing adherence between a susceptor as a heating element, and a semiconductor substrate disposed on the susceptor, by using an adherence increasing mechanism, or increasing heat transmitted to a semiconductor substrate, which is disposed on a susceptor as a heating element, by using a transmitted-heat increasing mechanism; and heating the semiconductor substrate to have a predetermined temperature by heating the susceptor. The adherence increasing mechanism may include the susceptor and one of a heavy-weight stone disposed on the semiconductor substrate, a cap disposed on the semiconductor substrate and engaged with the susceptor, and an adhesive layer provided between the susceptor and the semiconductor substrate. The transmitted-heat increasing mechanism may include the susceptor and small pieces which are disposed on the semiconductor substrate and have radiated-light absorption ability. The susceptor may hold a plurality of the semiconductor substrates in a stacked form.
    • 一种制造半导体器件的方法包括通过使用附着增加机构增加作为加热元件的基座和设置在基座上的半导体基板之间的粘附性,或者增加传输到半导体基板的热量,该半导体基板设置在基座 作为加热元件,通过使用透热增加机构; 并且通过加热所述基座来加热所述半导体衬底以具有预定温度。 附着增加机构可以包括基座和设置在半导体衬底上的重量级的石块之一,设置在半导体衬底上并与基座接合的帽以及设置在基座和半导体衬底之间的粘合剂层。 透热增加机构可以包括设置在半导体衬底上并具有辐射光吸收能力的基座和小片。 基座可以以堆叠的形式保持多个半导体衬底。