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1. 发明授权

US06284108B1 Method and apparatus for momentum plating 失效
标题翻译：动量电镀的方法和装置
公开(公告)号：US06284108B1
公开(公告)日：2001-09-04
申请号：US09130502
申请日：1998-08-31
申请人： Louis DiFrancesco
发明人： Louis DiFrancesco
IPC分类号： C25D1700
CPC分类号： C25D5/026 , C25D5/08
摘要： A method and apparatus are provided for momentum plating. A nozzle directs a jet of a plating fluid to a workpiece surface, preferably oriented either below or lateral to the jet. The nozzle is formed surrounding an anode and the plating fluid passes either through or around the anode. The flow vector range of the jet impinges on the surface in a continuous fashion and without interruption at a region to be plated. Optionally, a first seal prevents the plating fluid from flowing across either a non-plated or a previously-plated area of the workpiece. The nozzle can be moved across the surface or, alternatively, the workpiece can be conveyed past a fixed nozzle. A patterned plated coating can be produced by varying the number and orientation of seals, the number of nozzles, the type of plating fluid, the angle of jet flow, and the rate and direction of the jet flow across the surface.
摘要翻译：提供了用于动量电镀的方法和装置。喷嘴将电镀液体的射流引导到工件表面，优选地定向在射流的下方或侧面。喷嘴形成在阳极周围，电镀液通过阳极或其周围。射流的流动范围以连续的方式在表面上冲击，并且在被电镀区域不间断。可选地，第一密封件防止电镀液体流过工件的未镀层或预先镀覆的区域。喷嘴可以穿过表面移动，或者可以将工件传送通过固定的喷嘴。可以通过改变密封件的数量和取向，喷嘴的数量，电镀液的类型，喷射流的角度以及穿过表面的射流的速率和方向来制造图案化的镀覆涂层。

2. 发明授权

US5506514A Electrical interconnect using particle enhanced joining of metal surfaces 失效
公开(公告)号：US5506514A
公开(公告)日：1996-04-09
申请号：US422546
申请日：1995-04-12
申请人： Louis Difrancesco
发明人： Louis Difrancesco
IPC分类号： B23K20/16 , B23K35/02 , H01H1/06 , H01M8/04 , H01R43/00 , H05K1/11 , H05K1/14 , H05K3/32 , H05K3/40 , H01R23/68
CPC分类号： B23K35/02 , B23K20/16 , H05K3/325 , H01H1/06 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01004 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/10253 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K3/328 , H05K3/4007 , Y10S428/929 , Y10T29/49117 , Y10T29/49126 , Y10T428/12486 , Y10T428/24999
摘要： A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces. The invention includes preferred and alternative embodiments incorporating particle enhanced material that provide a semiconductor test array which may be patterned as desired to receive an integrated circuit die and/or packaged components to facilitate integrated circuit and packaged electronic component testing; a probing device for testing integrated circuit die in situ on a semiconductor wafer; connectors for coupling discontinuous circuit element substrates; an interposer for interconnecting conventional components, circuit boards, and assemblies; and connectors for single and multiple layer circuit boards.

3. 发明授权

US5334809A Particle enhanced joining of metal surfaces 失效
标题翻译：颗粒增强金属表面的接合
公开(公告)号：US5334809A
公开(公告)日：1994-08-02
申请号：US016190
申请日：1993-02-11
申请人： Louis DiFrancesco
发明人： Louis DiFrancesco
IPC分类号： B23K20/16 , B23K35/02 , H01H1/06 , H01M8/04 , H01R43/00 , H05K1/11 , H05K1/14 , H05K3/32 , H05K3/40 , H01H1/02
CPC分类号： B23K35/02 , B23K20/16 , H05K3/325 , H01H1/06 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01004 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/10253 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K3/328 , H05K3/4007 , Y10S428/929 , Y10T29/49117 , Y10T29/49126 , Y10T428/12486 , Y10T428/24999
摘要： A temporary electrical junction includes a first electrical contact having a first metal surface; a second electrical contact having a second metal surface; and a plurality of particulate cores having a hardness greater than that of the first and second metal surfaces, the particulate cores being disposed between the first and second contacts. Force is applied to the first and second contacts such that the particulate cores cause elasto-plastic deformation of at least one of the first and second surfaces, such that the first and second contacts are temporarily joined together at least partly along their respective metal surfaces to complete the electrical junction. An alternate embodiment of the invention provides a temporary structure having a first substrate having a first metal surface; a second substrate having a second metal surface; and a plurality of particulate cores having a hardness greater than that of the first and second metal surfaces disposed between the first and second substrates such that, when force is applied to the first substrate and the second substrate, the particulate cores cause elastoplastic deformation of at least one of the first and second surfaces, such that the first and second substrates are temporarily joined together at least partly along their respective metal surfaces and wherein the first substrate is separable from the second substrate without destruction of the first substrate and the second substrate.
摘要翻译：临时电接点包括具有第一金属表面的第一电触头; 具有第二金属表面的第二电接触; 以及具有大于第一和第二金属表面的硬度的多个颗粒芯，所述颗粒芯设置在第一和第二触点之间。将力施加到第一和第二接触件，使得颗粒芯引起第一和第二表面中的至少一个的弹性塑性变形，使得第一和第二触点至少部分地沿其相应的金属表面暂时接合在一起，以完成电连接处。本发明的另一个实施例提供一种具有第一基底的临时结构，该第一基底具有第一金属表面; 具有第二金属表面的第二基板; 以及多个颗粒芯，其硬度大于设置在第一和第二基板之间的第一和第二金属表面的硬度，使得当施加到第一基板和第二基板上时，颗粒芯引起弹性塑性变形第一和第二表面中的至少一个，使得第一和第二基板至少部分地沿其相应的金属表面临时接合在一起，并且其中第一基板可与第二基板分离，而不破坏第一基板和第二基板。

4. 发明授权

US5083697A Particle-enhanced joining of metal surfaces 失效
标题翻译：颗粒增强金属表面加工
公开(公告)号：US5083697A
公开(公告)日：1992-01-28
申请号：US479696
申请日：1990-02-14
申请人： Louis Difrancesco
发明人： Louis Difrancesco
IPC分类号： B23K20/16 , B23K35/02 , H01H1/06 , H01M8/04 , H01R43/00 , H05K1/11 , H05K1/14 , H05K3/32 , H05K3/40
CPC分类号： B23K35/02 , B23K20/16 , H05K3/325 , H01H1/06 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01004 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/10253 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K3/328 , H05K3/4007 , Y10S428/929 , Y10T29/49117 , Y10T29/49126 , Y10T428/12486 , Y10T428/24999
摘要： A method for joining a first metal surface to a second metal surface employs metallized particles or protuberances disposed between said surfaces. The metallized particles include a core particulate composed of a material having a hardness greater than that of the metals to be bonded. By compressing the metal surfaces together in a generally normal or perpendicular direction, one or both of the metal surfaces is compressed into a metal region formed around the particulate core. In this way, very high local regions of stress are created which cause the metal to elastoplastically deform, enhancing the ability to form diffusion bonds. Alternatively, temporary electrical or other junctions may be formed by bringing the surfaces together under less rigorous conditions and/or using metals which are incapable of forming diffusion bonds.
摘要翻译：用于将第一金属表面接合到第二金属表面的方法使用设置在所述表面之间的金属化颗粒或突起。金属化颗粒包括由具有大于待结合的金属的硬度的材料构成的芯颗粒。通过将金属表面在大致正常或垂直的方向一起压缩在一起，金属表面中的一个或两个被压缩成形成在颗粒核心周围的金属区域。以这种方式，产生了非常高的局部应力区域，这导致金属弹性变形，增强了形成扩散键的能力。或者，可以通过在不太严格的条件下使表面在一起形成和/或使用不能形成扩散接合的金属来形成临时的电或其他结。

5. 发明授权

US6096982A Method and apparatus for conductively joining components 失效
标题翻译：用于导电连接部件的方法和装置
公开(公告)号：US6096982A
公开(公告)日：2000-08-01
申请号：US25186
申请日：1998-02-18
申请人： Louis Difrancesco
发明人： Louis Difrancesco
IPC分类号： H01R4/04 , H05K3/32 , H05K3/40 , H05K1/00
CPC分类号： H05K3/321 , H01R4/04 , H05K2201/055 , H05K2201/1028 , H05K3/4015 , Y10T428/24545
摘要： A flexible conductive tape is coated on at least one surface with an electrically conductive adhesive. The adhesive includes conductive particles dispersed therein. The adhesive-coated surface of a first segment of the flexible tape is joined to a substrate. The flexible tape is folded back at a crease, to expose a portion of the adhesive surface. At least one module is affixed to the exposed adhesive surface of the adjacent tape segment to form a sub-assembly. The sub-assembly is adapted for interengagement with a complementary modular assembly including electrical components and connectors. An electrical current is provided to the flexible tape.
摘要翻译：柔性导电带用导电粘合剂涂覆在至少一个表面上。粘合剂包括分散在其中的导电颗粒。柔性带的第一段的粘合剂涂覆表面连接到基底。柔性带在折痕处折回，以暴露粘合剂表面的一部分。至少一个模块固定到相邻带段的暴露的粘合剂表面以形成子组件。子组件适于与包括电气部件和连接器的互补模块化组件相互接合。向柔性带提供电流。

6. 发明授权

US5634265A Electrical interconnect using particle enhanced joining of metal surfaces 失效
公开(公告)号：US5634265A
公开(公告)日：1997-06-03
申请号：US422448
申请日：1995-04-12
申请人： Louis Difrancesco
发明人： Louis Difrancesco
IPC分类号： B23K20/16 , B23K35/02 , H01H1/06 , H01M8/04 , H01R43/00 , H05K1/11 , H05K1/14 , H05K3/32 , H05K3/40
CPC分类号： B23K35/02 , B23K20/16 , H05K3/325 , H01H1/06 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01004 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/10253 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K3/328 , H05K3/4007 , Y10S428/929 , Y10T29/49117 , Y10T29/49126 , Y10T428/12486 , Y10T428/24999
摘要： A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces. The invention includes preferred and alternative embodiments incorporating particle enhanced material that provide a semiconductor test array which may be patterned as desired to receive an integrated circuit die and/or packaged components to facilitate integrated circuit and packaged electronic component testing; a probing device for testing integrated circuit die in situ on a semiconductor wafer; connectors for coupling discontinuous circuit element substrates; an interposer for interconnecting conventional components, circuit boards, and assemblies; and connectors for single and multiple layer circuit boards.

7. 发明授权

US5430614A Electrical interconnect using particle enhanced joining of metal surfaces 失效
标题翻译：使用颗粒增强金属表面接合的电气互连
公开(公告)号：US5430614A
公开(公告)日：1995-07-04
申请号：US148907
申请日：1993-11-08
申请人： Louis Difrancesco
发明人： Louis Difrancesco
IPC分类号： B23K20/16 , B23K35/02 , H01H1/06 , H01M8/04 , H01R43/00 , H05K1/14 , H05K3/32 , H05K3/40 , H01R23/68
CPC分类号： B23K20/16 , B23K35/02 , H05K3/325 , H01H1/06 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01004 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/10253 , H01L2924/1532 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K3/328 , H05K3/4007
摘要： A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when the contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces. The invention includes preferred and alternative embodiments incorporating particle enhanced material that provide a semiconductor test array which may be patterned as desired to receive an integrated circuit die and/or packaged components to facilitate integrated circuit and packaged electronic component testing; a probing device for testing integrated circuit die in situ on a semiconductor wafer; connectors for coupling discontinuous circuit element substrates; an interposer for interconnecting conventional components, circuit boards, and assemblies; and connectors for single and multiple layer circuit boards.
摘要翻译：一种用于电连接各种电子元件（包括电路部件，组件和子组件）的方法和装置。具有形成在电子元件上的表面的粒子增强材料金属接触层包括设置在金属接触层上和/或内部的较大硬度的颗粒，该颗粒形成当接触表面与接触表面接触时集中应力的突起在压力下的相对表面，从而穿透相对表面并在两个表面之间形成金属基体。本发明包括结合粒子增强材料的优选和替代实施例，其提供半导体测试阵列，其可以根据需要被图案化以接收集成电路管芯和/或封装部件以便于集成电路和封装的电子部件测试; 用于在半导体晶片上原位测试集成电路裸片的探测装置; 用于耦合不连续电路元件基板的连接器; 用于互连常规组件，电路板和组件的插入器; 和单层和多层电路板的连接器。

8. 发明授权

US5835359A Electrical interconnect using particle enhanced joining of metal surfaces 失效
公开(公告)号：US5835359A
公开(公告)日：1998-11-10
申请号：US749376
申请日：1996-11-06
申请人： Louis DiFrancesco
发明人： Louis DiFrancesco
IPC分类号： B23K20/16 , B23K35/02 , H01H1/06 , H01M8/04 , H01R43/00 , H05K1/11 , H05K1/14 , H05K3/32 , H05K3/40
CPC分类号： B23K35/02 , B23K20/16 , H05K3/325 , H01H1/06 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01004 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/10253 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K3/328 , H05K3/4007 , Y10S428/929 , Y10T29/49117 , Y10T29/49126 , Y10T428/12486 , Y10T428/24999
摘要： A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces. The invention includes preferred and alternative embodiments incorporating particle enhanced material that provide a semiconductor test array which may be patterned as desired to receive an integrated circuit die and/or packaged components to facilitate integrated circuit and packaged electronic component testing; a probing device for testing integrated circuit die in situ on a semiconductor wafer; connectors for coupling discontinuous circuit element substrates; an interposer for interconnecting conventional components, circuit boards, and assemblies; and connectors for single and multiple layer circuit boards.

9. 发明授权

US5565280A Electrical interconnect using particle enhanced joining of metal surfaces 失效
标题翻译：使用颗粒增强金属表面接合的电气互连
公开(公告)号：US5565280A
公开(公告)日：1996-10-15
申请号：US422447
申请日：1995-04-12
申请人： Louis Difrancesco
发明人： Louis Difrancesco
IPC分类号： B23K20/16 , B23K35/02 , H01H1/06 , H01M8/04 , H01R43/00 , H05K1/11 , H05K1/14 , H05K3/32 , H05K3/40
CPC分类号： B23K35/02 , B23K20/16 , H05K3/325 , H01H1/06 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01004 , H01L2924/01014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/10253 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K3/328 , H05K3/4007 , Y10S428/929 , Y10T29/49117 , Y10T29/49126 , Y10T428/12486 , Y10T428/24999
摘要： A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to whereby penetrate the opposing surface and form a metal matrix between the two surfaces. The invention includes preferred and alternative embodiments incorporating particle enhanced material, which are useful in batteries fuel cells and capacitors.
摘要翻译：一种用于电连接各种电子元件（包括电路部件，组件和子组件）的方法和装置。具有形成在电子元件上的表面的粒子增强材料金属接触层包括设置在金属接触层之上和/或内部的较大硬度的颗粒，该颗粒形成当所述接触表面接触时集中应力的突起在压力下的相对表面，从而穿过相对的表面并在两个表面之间形成金属基体。本发明包括适用于电池燃料电池和电容器的粒子增强材料的优选和替代实施例。

10. 发明授权

US5670251A Patternable particle filled adhesive matrix for forming patterned structures between joined surfaces 失效
标题翻译：用于在接合表面之间形成图案化结构的可图案化的填充颗粒的粘合剂基
公开(公告)号：US5670251A
公开(公告)日：1997-09-23
申请号：US320443
申请日：1994-10-07
申请人： Louis Difrancesco
发明人： Louis Difrancesco
IPC分类号： B32B5/16
CPC分类号： B32B5/16 , Y10T428/252 , Y10T428/256 , Y10T428/258 , Y10T428/259 , Y10T428/2857
摘要： A patternable bonding material for joining the surfaces of two or more substrates permits localization of conductive or insulating hard-cored particles within an adhesive matrix to form patterned structures on or between the surfaces. Electrical, thermal, or mechanical energy may be transferred through, or isolated by the material. The material may be used in an uncured state to allow easy separation of the joined surfaces, or a more permanent bond may be formed. The adhesive may be cured by thermocuring, evaporation or ablation of organic components, pressure, or by the application of ultraviolet radiation.
摘要翻译：用于连接两个或更多个基底的表面的可图案化的接合材料允许将导电或绝缘的硬质颗粒定位在粘合剂基质内，以在表面之间或之间形成图案化结构。电，热或机械能可以通过材料传输或隔离。该材料可以在未固化状态下使用以容易地分离接合的表面，或者可以形成更永久的键。粘合剂可以通过热固化，蒸发或消除有机组分，压力或通过施加紫外线照射来固化。

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