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1. 发明申请

US20070142100A1 Speaker module for portable terminal 审中-公开
标题翻译：便携式终端扬声器模块
公开(公告)号：US20070142100A1
公开(公告)日：2007-06-21
申请号：US11641133
申请日：2006-12-19
申请人： Kyung-Rok Lee
发明人： Kyung-Rok Lee
IPC分类号： H04M1/00
CPC分类号： H04M1/03 , H04M1/0214 , H04M1/035
摘要： A speaker module for a portable terminal includes a speaker box having a predetermined size and receiving a speaker. The speaker box is installed at a predetermined location of a case frame of the portable terminal to protrude partially to the outside. The speaker box enters into the folder of the portable terminal while storing a predetermined elastic force. Because only the speaker module contacts a user's ear and elastically enters into the folder of the portable terminal, the stable sound quality is provided during voice communication, thereby securing the reliability of the portable terminal.
摘要翻译：用于便携式终端的扬声器模块包括具有预定尺寸并接收扬声器的扬声器盒。扬声器盒安装在便携式终端的壳体框架的预定位置处，以部分地突出到外部。在存储预定的弹力的同时，扬声器盒进入便携式终端的文件夹。由于只有扬声器模块接触用户的耳朵并弹性地进入便携式终端的文件夹，所以在语音通信期间提供稳定的音质，从而确保便携式终端的可靠性。

2. 发明授权

US06704573B1 Channel resource management method in base station using dynamic function in mobile communication system 有权
标题翻译：移动通信系统中使用动态功能的基站信道资源管理方法
公开(公告)号：US06704573B1
公开(公告)日：2004-03-09
申请号：US09526946
申请日：2000-03-16
申请人： Moon-Kee Paek , Seung-Hyun Min , Song-Ho Kang , Kyung-Rok Lee
发明人： Moon-Kee Paek , Seung-Hyun Min , Song-Ho Kang , Kyung-Rok Lee
IPC分类号： H04Q720
CPC分类号： H04W24/04
摘要： Disclosed is a channel resource management method in a base station using a dynamic function in a mobile communication system, in which a real-time conversion of a traffic channel to an overhead channel using a dynamic function is allowed when a trouble occurs in the overhead channel of a base station of a mobile communication system adopting code division multiple access(CDMA) system like digital cellular system(DCS) or personal communication system (PCS), and normal servicing of terminal can be maintained by a minimum channel resource conversion resulted from an effective management of channel resource. The traffic channel that is not currently used is converted in real-time to an overhead channel using the dynamic function when a trouble or an error occurs at the overhead channel of the base station, and the overhead channel is converted again to a traffic channel when the overhead channel for which a trouble or an error occurred is restored to normal, thus a terminal may perform a normal communication service by a minimum channel resource conversion resulted from an effective management of the channel resource.
摘要翻译：公开了在移动通信系统中使用动态功能的基站中的信道资源管理方法，其中，当在开销信道中发生故障时，允许使用动态功能将业务信道实时转换到开销信道通过采用诸如数字蜂窝系统（DCS）或个人通信系统（PCS）的码分多址（CDMA）系统的移动通信系统的基站，并且可以通过由终端的最小信道资源转换来维持终端的正常服务渠道资源的有效管理。当基站的开销信道出现故障或错误时，当前未使用的业务信道被实时转换为开销信道，并且将开销信道再次转换为业务信道，当业务信道发生故障或错误的开销信道恢复正常，因此终端可以通过由信道资源的有效管理产生的最小信道资源转换来执行正常通信服务。

3. 发明授权

US06452282B1 Insulating adhesive tape for a semiconductor chip package having a copper lead frame 失效
标题翻译：用于具有铜引线框架的半导体芯片封装的绝缘胶带
公开(公告)号：US06452282B1
公开(公告)日：2002-09-17
申请号：US09858445
申请日：2001-05-17
申请人： Jeong Min Kweon , Soon Sik Kim , Kyeong Ho Chang , Kyung Rok Lee
发明人： Jeong Min Kweon , Soon Sik Kim , Kyeong Ho Chang , Kyung Rok Lee
IPC分类号： H01L2348
CPC分类号： H01L24/29 , H01L23/4951 , H01L23/49513 , H01L24/48 , H01L2224/05599 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/15747 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/45015 , H01L2924/207
摘要： An insulating tape for use in LOC (lead-on-chip) type semiconductor chip packages. With a tripartite structure in which two adhesive layers are provided to both surfaces of a base film, the insulating tape ranges, in coefficient of thermal expansion, from 16.0 to 23.5 ppm/° C. and is very useful in improving the reliability of LOC semiconductor chip packages having lead frames.
摘要翻译：一种用于LOC（片上芯片）型半导体芯片封装的绝缘胶带。通过在基膜的两面设置两个粘合剂层的三方结构，绝缘带的热膨胀系数为16.0〜23.5ppm /℃，对提高LOC半导体的可靠性非常有用具有引线框架的芯片封装。

4. 发明授权

US06320019B1 Method for the preparation of polyamic acid and polyimide 失效
标题翻译：聚酰胺酸和聚酰亚胺的制备方法
公开(公告)号：US06320019B1
公开(公告)日：2001-11-20
申请号：US09512382
申请日：2000-02-25
申请人： Kyung Rok Lee , Soon Sik Kim , Kyeong Ho Chang , Jeong Min Kweon
发明人： Kyung Rok Lee , Soon Sik Kim , Kyeong Ho Chang , Jeong Min Kweon
IPC分类号： C08G6926
CPC分类号： C08G73/1003 , C08G73/106 , H05K2201/0154 , H05K2203/065
摘要： A method for preparing polyamic acid and polyimide of three-dimensional molecular structure such that these polymers are superior in adhesive strength and high-temperature stability while maintaining their inherent thermal resistance and mechanical properties, and thus can be effectively used as an adhesive material for high temperature adhesive tapes suitable for semiconductor assembly. The polyamic acid is prepared by reacting at least one tetracarboxylic dianhydride, at least one aromatic diamine, at least one diamine with a siloxane structure, represented by the following general formula I, and at least one polyamino compound represented by the following general formula II or III:
摘要翻译：制备三维分子结构的聚酰胺酸和聚酰亚胺的方法，使得这些聚合物在保持其固有的耐热性和机械性能的同时具有优异的粘合强度和高温稳定性，因此可以有效地用作高的粘合剂适用于半导体组装的温度粘合带。聚酰胺酸通过使至少一种四羧酸二酐，至少一种芳族二胺，至少一种二胺与硅氧烷结构，由以下通式I表示，和至少一种由以下通式II表示的聚氨基化合物或三：

5. 发明授权

US06307008B1 Polyimide for high temperature adhesive 失效
标题翻译：聚酰亚胺用于高温粘合剂
公开(公告)号：US06307008B1
公开(公告)日：2001-10-23
申请号：US09512381
申请日：2000-02-25
申请人： Kyung Rok Lee , Soon Sik Kim , Kyeong Ho Chang , Jeong Min Kweon
发明人： Kyung Rok Lee , Soon Sik Kim , Kyeong Ho Chang , Jeong Min Kweon
IPC分类号： C08G7310
CPC分类号： C09J179/08 , Y10S526/935
摘要： A polymide useful as an adhesive for semiconductor assemblies having excellent thermal resistance and adhesive strength at high temperatures. The polyimide adhesive is based on the polyimide represented by the following formula II which can be prepared through the thermal or chemical imidization of the polyamic acid represented by the following formula I:
摘要翻译：用作半导体组件的粘合剂的聚酰亚胺在高温下具有优异的耐热性和粘合强度。聚酰亚胺粘合剂基于下式II表示的聚酰亚胺，其可以通过由下式I表示的聚酰胺酸进行热或化学酰亚胺化制备：

6. 发明授权

US06252033B1 Method for the preparation of polyamic acid and polymide useful for adhesives 失效
标题翻译：用于粘合剂的聚酰胺酸和聚酰亚胺的制备方法
公开(公告)号：US06252033B1
公开(公告)日：2001-06-26
申请号：US09531314
申请日：2000-03-20
申请人： Jeong Min Kweon , Soon Sik Kim , Kyeong Ho Chang , Kyung Rok Lee
发明人： Jeong Min Kweon , Soon Sik Kim , Kyeong Ho Chang , Kyung Rok Lee
IPC分类号： C08G7310
CPC分类号： C08G73/10 , C08G73/1042 , C08G73/106 , C08G77/455
摘要： A method for preparing polyamic acid and polyimide, which is suitable for use in adhesives or adhesive tapes for electronic parts. The polymers have such three-dimensional molecular structures that a significant improvement can be brought about in solvent solubility, thermal resistance, mechanical properties, and adhesive properties onto various substrates. The polyamic acid is prepared by reacting at least one tetracarboxylic dianhydride, at least one aromatic diamine, at least one diamine with a siloxane structure, represented by the following general formula I, and at least one polyamino compound represented by the following general formula II or III. The polyamic acid is converted into polyimide through thermal or chemical imidization.
摘要翻译：一种制备聚酰胺酸和聚酰亚胺的方法，适用于电子部件的粘合剂或胶带。聚合物具有这样的三维分子结构，可以在溶剂溶解度，耐热性，机械性能和粘合剂性能方面对各种基材产生显着的改进。聚酰胺酸通过使至少一种四羧酸二酐，至少一种芳族二胺，至少一种二胺与硅氧烷结构，由以下通式I表示，和至少一种由以下通式II表示的聚氨基化合物或三，聚酰胺酸通过热或化学酰亚胺化转化为聚酰亚胺。

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