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1. 发明申请

US20130020726A1 PACKAGE MODULE STRUCTURE FOR HIGH POWER DEVICE WITH METAL SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：具有金属基底的高功率器件的封装模块结构及其制造方法
公开(公告)号：US20130020726A1
公开(公告)日：2013-01-24
申请号：US13520284
申请日：2010-02-16
申请人： Kyoung-Min Kim , Jung-Hyun Kim
发明人： Kyoung-Min Kim , Jung-Hyun Kim
IPC分类号： H01L29/02 , H01L21/56
CPC分类号： H01L23/367 , H01L23/4006 , H01L23/562 , H01L2224/32245
摘要： A method of manufacturing a package module structure of a high power device using a metal substrate that can improve reliability by minimizing stress due to a thermal expansion coefficient difference between a metal substrate and a semiconductor device includes: preparing a metal substrate; forming an oxide layer by selectively anodizing the metal substrate; forming a mounting groove for mounting a semiconductor device by etching a portion of the oxide layer; installing a shock-absorbing substrate that is made of a material having a thermal expansion coefficient in a range similar to a material of a semiconductor device to expose the entirety or a portion of a bottom portion of the mounting groove; mounting the semiconductor device in the shock-absorbing substrate exposed to the mounting groove; and electrically connecting an electrode terminal of the semiconductor device and an electrode line formed in an upper surface of the oxide layer.
摘要翻译：一种使用能够通过使由于金属基板与半导体器件之间的热膨胀系数差导致的应力最小化而提高可靠性的金属基板的高功率器件的封装模块结构的制造方法，其特征在于，包括：准备金属基板; 通过选择性地阳极氧化金属基底来形成氧化物层; 通过蚀刻所述氧化物层的一部分形成用于安装半导体器件的安装槽; 安装由具有与半导体器件的材料类似的范围内的热膨胀系数的材料制成的吸震衬底，以露出安装槽的整个或一部分底部; 将半导体器件安装在暴露于安装槽的减震基板中; 并且电连接半导体器件的电极端子和形成在氧化物层的上表面中的电极线。

2. 发明申请

US20100067907A1 METHOD AND SYSTEM FOR CONTROLLING DRIVING CURRENT OF WDM-PON OPTICAL TRANSMITTER 失效
标题翻译：控制WDM-PON光纤发射机驱动电流的方法和系统
公开(公告)号：US20100067907A1
公开(公告)日：2010-03-18
申请号：US12516930
申请日：2009-03-24
申请人： Jae Oh Byun , Kyoung Min Kim
发明人： Jae Oh Byun , Kyoung Min Kim
IPC分类号： H04J14/02
CPC分类号： H04J14/0282 , H04B10/506 , H04B10/564
摘要： The present disclosure relates to a WDM-PON optical transmitter; and, more particularly, to a system for controlling a driving current of the WDM-PON optical transmitter. The present disclosure provides a driving current control system of an optical transmitter for use in WDM-PON including a plurality of optical transmitters, each transmitter generating and transmitting a transmittance optical signal based on a driving current and an optical multiplexer/demultiplexer for combining the optical signals received from the plurality of the optical transmitters to output a combined optical signal through a single common terminal, wherein the driving current is controlled based on the combined optical signal outputted from the common terminal.
摘要翻译：本公开涉及一种WDM-PON光发射机; 更具体地说，涉及一种用于控制WDM-PON光发射机的驱动电流的系统。本公开提供了一种用于在包括多个光发射机的WDM-PON中使用的光发射机的驱动电流控制系统，每个发射机基于驱动电流产生和发射透射率光信号，以及用于组合光学器件的光复用器/解复用器从多个光发射机接收的信号通过单个公共端输出组合的光信号，其中驱动电流根据从公共端输出的组合光信号进行控制。

3. 发明申请

US20120318952A1 ELASTIC SUPPORT MODULE AND RACK BAR SUPPORTING DEVICE FOR VEHICLE STEERING APPARATUS HAVING THE SAME 有权
标题翻译：具有其的车辆转向装置的弹性支撑模块和机架支撑装置
公开(公告)号：US20120318952A1
公开(公告)日：2012-12-20
申请号：US13495425
申请日：2012-06-13
申请人： Kwang Ho YANG , Kyoung Min Kim
发明人： Kwang Ho YANG , Kyoung Min Kim
IPC分类号： F16M13/00
CPC分类号： B62D3/123 , F16H55/283 , Y10T74/19623 , Y10T74/1967
摘要： The present invention relates to an elastic support module and a rack bar supporting device for a vehicle steering apparatus, which includes the elastic support module. By the present invention, it is possible to prevent a noise from being produced due to the increase of a clearance caused when a vehicle loses the driving durability thereof to a certain degree and hence a support yoke of the vehicle is worn, or due to an impact reversely input from a road surface, and hence to provide a pleasant steering feeling for a driver when steering the vehicle.
摘要翻译：本发明涉及一种包括弹性支撑模块的用于车辆转向装置的弹性支撑模块和齿条支撑装置。通过本发明，可以防止由于当车辆将驾驶耐久性降低到一定程度时引起的间隙的增加而产生噪音，因此车辆的支撑轭被磨损，或者由于从路面反向输入，从而为驾驶员转向时提供令人愉快的转向感。

4. 发明申请

US20120318086A1 RACK BAR SUPPORTING DEVICE OF VEHICLE STEERING APPARATUS 有权
标题翻译：车架转向装置的支架支撑装置
公开(公告)号：US20120318086A1
公开(公告)日：2012-12-20
申请号：US13524461
申请日：2012-06-15
申请人： Kwang Ho Yang , Kyoung Min Kim
发明人： Kwang Ho Yang , Kyoung Min Kim
IPC分类号： F16H55/28
CPC分类号： B62D3/123 , F16H55/283 , Y10T74/19623 , Y10T74/1967
摘要： The present invention relates to a rack bar supporting device for a vehicle steering apparatus. According to the present invention, a clearance between the rack bar and a support yoke can be kept always constant when the vehicle steering apparatus is operated, which makes it possible to reduce operational friction and noise, to maintain the supporting force of the support yoke and the rack bar to be constant for a long time, and to improve a steering feeling of a driver.
摘要翻译：本发明涉及一种用于车辆转向装置的齿条支撑装置。根据本发明，当车辆转向装置被操作时，齿条和支撑轭之间的间隙总是保持恒定，这使得可以减少操作摩擦和噪音，以保持支撑轭的支撑力和齿条长时间恒定，提高驾驶员的转向感。

5. 发明授权

US08034664B2 Method of fabricating passive device applied to the three-dimensional package module 有权
标题翻译：无源器件的制造方法应用于三维封装模块
公开(公告)号：US08034664B2
公开(公告)日：2011-10-11
申请号：US12914725
申请日：2010-10-28
申请人： Young-Se Kwon , Kyoung Min Kim
发明人： Young-Se Kwon , Kyoung Min Kim
IPC分类号： H01L21/44
CPC分类号： H01L23/66 , H01L21/4857 , H01L23/3121 , H01L23/49822 , H01L23/5389 , H01L23/645 , H01L24/24 , H01L24/82 , H01L25/072 , H01L25/162 , H01L2223/6616 , H01L2223/6627 , H01L2223/6644 , H01L2224/04105 , H01L2224/24227 , H01L2224/32245 , H01L2224/73267 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15787 , H01L2924/19033 , H01L2924/19041 , H01L2924/19042 , H05K1/053 , H05K1/185 , H01L2924/00
摘要： Provided is a three-dimensional aluminum package module including: an aluminum substrate; an aluminum oxide layer formed on the aluminum substrate and having at least one first opening of which sidewalls are perpendicular to an upper surface of the aluminum substrate; a semiconductor device mounted in the first opening using an adhesive; an organic layer covering the aluminum oxide layer and the semiconductor device; and a first interconnection line and a passive device circuit formed on the organic layer and the aluminum oxide layer.
摘要翻译：提供一种三维铝封装模块，包括：铝基板; 形成在所述铝基板上并具有至少一个第一开口的铝氧化物层，所述第一开口的侧壁垂直于所述铝基板的上表面; 使用粘合剂安装在第一开口中的半导体器件; 覆盖氧化铝层和半导体器件的有机层; 以及形成在有机层和氧化铝层上的第一互连线和无源器件电路。

6. 发明申请

US20100144099A1 METHOD FOR MANUFACTURING PASSIVE DEVICE AND SEMICONDUCTOR PACKAGE USING THIN METAL PIECE 失效
标题翻译：用于制造被动装置的方法和使用薄金属片的半导体封装
公开(公告)号：US20100144099A1
公开(公告)日：2010-06-10
申请号：US12695449
申请日：2010-01-28
申请人： Young-Se Kwon , Kyoung-Min Kim
发明人： Young-Se Kwon , Kyoung-Min Kim
IPC分类号： H01L21/50
CPC分类号： H01L21/6835 , H01L21/4846 , H01L21/486 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5227 , H01L23/66 , H01L24/32 , H01L24/48 , H01L2221/68363 , H01L2224/16225 , H01L2224/32188 , H01L2224/48227 , H01L2224/73253 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/16152 , H01L2924/181 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing passive devices and semiconductor packages using a thin metal piece is provided. According to the method, an adhesive layer is formed on a dummy substrate; a thin metal piece is bonded on the adhesive layer; a masking material is attached to the thin metal piece, a dielectric layer is formed; a masking material is attached to form metal pads; a metal pad is formed, and the formed device is attached to a lower substrate using the metal pads; the adhesive layer and the dummy substrate are removed, a masking material is attached on a surface exposed, a region where passive devices are to be formed is patterned, and the thin metal piece is etched at a predetermined depth; and solder bumps for surface mounting are formed.
摘要翻译：提供了使用薄金属片制造无源器件和半导体封装的方法。根据该方法，在虚设基板上形成粘接层; 在粘合剂层上粘接薄金属片; 将掩模材料附着到薄金属片上，形成电介质层; 连接掩模材料以形成金属垫; 形成金属垫，并使用金属垫将形成的装置附接到下基板; 去除粘合剂层和虚设基板，将掩模材料附着在暴露的表面上，对要形成无源器件的区域进行图案化，并且以预定深度蚀刻薄金属片; 并形成用于表面安装的焊料凸块。

7. 发明申请

US20100067911A1 INJECTION LIGHT GENERATOR FOR USE IN WAVELENGTH DIVISION MULTIPLEXED-PASSIVE OPTICAL NETWORK 审中-公开
标题翻译：注射光发生器用于波长部分多路被动光网络
公开(公告)号：US20100067911A1
公开(公告)日：2010-03-18
申请号：US12516886
申请日：2007-12-13
申请人： Jae Oh Byun , Kyoung Min Kim
发明人： Jae Oh Byun , Kyoung Min Kim
IPC分类号： H04J14/00
CPC分类号： H04J14/0282 , H04B10/506
摘要： The invention is related to an injection light generator for use in a wavelength division multiplexed-passive optical network, which generates A-band injection light having a spectrum range separated into N wavelength ranges (N is a natural number equal to or greater than 2) to be used for a transmission of a downstream optical signal and B-band injection light having a spectrum range separated into N wavelength ranges to be used for a transmission of an upstream optical signal.
摘要翻译：本发明涉及一种用于波分复用无源光网络的注入光发生器，其产生频谱范围分为N个波长范围（N为等于或大于2的自然数）的A波段注入光，用于下行光信号的传输和具有分离为N个波长范围的频谱范围的B波段注入光，以用于上行光信号的传输。

8. 发明授权

US08664538B2 Terminal-integrated metal base package module and terminal-integrated metal base packaging method 有权
标题翻译：端子集成金属基底封装模块和端子集成金属基底封装方法
公开(公告)号：US08664538B2
公开(公告)日：2014-03-04
申请号：US13060097
申请日：2010-04-30
申请人： Kyoung-Min Kim
发明人： Kyoung-Min Kim
IPC分类号： H05K1/16 , H05K3/30
CPC分类号： H01L21/6835 , H01L21/4846 , H01L23/142 , H01L23/3121 , H01L23/498 , H01L23/49861 , H01L24/24 , H01L24/48 , H01L24/97 , H01L2224/05554 , H01L2224/32188 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2924/00014 , H01L2924/01012 , H01L2924/12041 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19107 , Y10T29/4913 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： The present invention relates to a terminal-integrated package method for a metal base package module that can effectively prevent short-circuit or breakage by not using wire bonding for connection with an external circuit.The terminal-integrated package method for the metal base package module includes: preparing a metal substrate formed with a conductive metal material; forming an oxide layer by oxidizing one side of the metal substrate to a predetermined depth; forming an insulation groove by partially eliminating the metal substrate to the oxide layer with a constant width along the circumference of the metal substrate from an opposite side of the metal substrate; forming a plurality of external connection terminals by forming a separation groove by eliminating a circumference portion of the metal substrate, disconnected with a center portion thereof by the insulation groove along the circumference with a predetermined gap; mounting or manufacturing an electronic part on the metal substrate or the oxide layer; and electrically connecting an electrode of the electronic part with the external connection terminal.
摘要翻译：本发明涉及一种用于金属基底封装模块的端子集成封装方法，其可以通过不使用引线接合来有效地防止短路或断线，从而与外部电路连接。金属基封装模块的端子集成封装方法包括：准备形成有导电金属材料的金属基板; 通过将金属基板的一侧氧化到预定深度来形成氧化物层; 通过从所述金属基板的相对侧沿着所述金属基板的周边部分地将所述金属基板部分地去除所述氧化物层而形成绝缘槽; 通过以预定间隙沿着圆周除去金属基板的周边部分的中心部分与绝缘槽断开而形成分离槽，形成多个外部连接端子; 在金属基板或氧化物层上安装或制造电子部件; 并将电子部件的电极与外部连接端子电连接。

9. 发明授权

US08497586B2 Package module structure for high power device with metal substrate and method of manufacturing the same 有权
标题翻译：具有金属基板的大功率器件的封装模块结构及其制造方法
公开(公告)号：US08497586B2
公开(公告)日：2013-07-30
申请号：US13520284
申请日：2010-02-16
申请人： Kyoung-Min Kim , Jung-Hyun Kim
发明人： Kyoung-Min Kim , Jung-Hyun Kim
IPC分类号： H01L29/02
CPC分类号： H01L23/367 , H01L23/4006 , H01L23/562 , H01L2224/32245
摘要： A method of manufacturing a package module structure of a high power device using a metal substrate that can improve reliability by minimizing stress due to a thermal expansion coefficient difference between a metal substrate and a semiconductor device includes: preparing a metal substrate; forming an oxide layer by selectively anodizing the metal substrate; forming a mounting groove for mounting a semiconductor device by etching a portion of the oxide layer; installing a shock-absorbing substrate that is made of a material having a thermal expansion coefficient in a range similar to a material of a semiconductor device to expose the entirety or a portion of a bottom portion of the mounting groove; mounting the semiconductor device in the shock-absorbing substrate exposed to the mounting groove; and electrically connecting an electrode terminal of the semiconductor device and an electrode line formed in an upper surface of the oxide layer.
摘要翻译：一种使用能够通过使由于金属基板与半导体器件之间的热膨胀系数差导致的应力最小化而提高可靠性的金属基板的高功率器件的封装模块结构的制造方法，其特征在于，包括：准备金属基板; 通过选择性地阳极氧化金属基底来形成氧化物层; 通过蚀刻所述氧化物层的一部分形成用于安装半导体器件的安装槽; 安装由具有与半导体器件的材料类似的范围内的热膨胀系数的材料制成的吸震衬底，以露出安装槽的整个或一部分底部; 将半导体器件安装在暴露于安装槽的减震基板中; 并且电连接半导体器件的电极端子和形成在氧化物层的上表面中的电极线。

10. 发明申请

US20130037309A1 TERMINAL-INTEGRATED METAL BASE PACKAGE MODULE AND TERMINAL-INTEGRATED METAL BASE PACKAGING METHOD 有权
标题翻译：端子集成金属基底包装模块和终端集成金属基底包装方法
公开(公告)号：US20130037309A1
公开(公告)日：2013-02-14
申请号：US13060097
申请日：2010-04-30
申请人： Kyoung-Min Kim
发明人： Kyoung-Min Kim
IPC分类号： H05K1/05 , H05K3/02 , H05K3/30
CPC分类号： H01L21/6835 , H01L21/4846 , H01L23/142 , H01L23/3121 , H01L23/498 , H01L23/49861 , H01L24/24 , H01L24/48 , H01L24/97 , H01L2224/05554 , H01L2224/32188 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2924/00014 , H01L2924/01012 , H01L2924/12041 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19107 , Y10T29/4913 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： The present invention relates to a terminal-integrated package method for a metal base package module that can effectively prevent short-circuit or breakage by not using wire bonding for connection with an external circuit.The terminal-integrated package method for the metal base package module includes: preparing a metal substrate formed with a conductive metal material; forming an oxide layer by oxidizing one side of the metal substrate to a predetermined depth; forming an insulation groove by partially eliminating the metal substrate to the oxide layer with a constant width along the circumference of the metal substrate from an opposite side of the metal substrate; forming a plurality of external connection terminals by forming a separation groove by eliminating a circumference portion of the metal substrate, disconnected with a center portion thereof by the insulation groove along the circumference with a predetermined gap; mounting or manufacturing an electronic part on the metal substrate or the oxide layer; and electrically connecting an electrode of the electronic part with the external connection terminal.
摘要翻译：本发明涉及一种用于金属基底封装模块的端子集成封装方法，其可以通过不使用引线接合来有效地防止短路或断线，从而与外部电路连接。金属基封装模块的端子集成封装方法包括：准备形成有导电金属材料的金属基板; 通过将金属基板的一侧氧化到预定深度来形成氧化物层; 通过从所述金属基板的相对侧沿着所述金属基板的周边部分地将所述金属基板部分地去除所述氧化物层而形成绝缘槽; 通过以预定间隙沿着圆周除去金属基板的周边部分的中心部分与绝缘槽断开而形成分离槽，形成多个外部连接端子; 在金属基板或氧化物层上安装或制造电子部件; 并将电子部件的电极与外部连接端子电连接。

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