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1. 发明授权

US07208341B2 Method for manufacturing printed circuit board 有权
标题翻译：印刷电路板制造方法
公开(公告)号：US07208341B2
公开(公告)日：2007-04-24
申请号：US10855557
申请日：2004-05-28
申请人： Kwang-Tae Lee , Sung-Gue Lee , Sang-Hyuck Nam , Sung-Ho Youn , Young-Kyu Lee
发明人： Kwang-Tae Lee , Sung-Gue Lee , Sang-Hyuck Nam , Sung-Ho Youn , Young-Kyu Lee
IPC分类号： H01L21/48 , H01L21/4763
CPC分类号： H05K3/28 , H05K3/243 , H05K2201/0959 , H05K2201/09881 , H05K2203/025 , H05K2203/0577 , Y10T29/49155
摘要： A method for manufacturing a printed circuit board includes: forming inner circuit patterns in an insulating material in multi-layers, forming a plurality of through holes at certain portions of the insulating material, and forming an outer circuit pattern which is electrically connected to the inner circuit pattern, at an inner circumferential surface of the through hole and the surface of the insulating material, and a terminal portion; forming a first photo solder resist layer at an entire surface of the insulating material and an entire surface of the outer circuit pattern, and exposing the terminal portion by removing a specific portion of the first photo solder resist layer; abrading the surface of the first photo solder resist layer; printing a second photo solder resist layer at the surface of the first photo solder resist layer, and exposing the terminal portion to the outside by removing a specific portion of the second photo solder resist layer; and forming a pad portion by plating the surface of the exposed terminal portion with gold, and electrically connecting the pad portion and the terminal portion.
摘要翻译：印刷电路板的制造方法包括：在多层绝缘材料中形成内部电路图案，在绝缘材料的某些部分形成多个通孔，并形成外部电路图形，该外部电路图形与内部在通孔的内周面和绝缘材料的表面上形成电路图形，以及端子部分; 在所述绝缘材料的整个表面和所述外部电路图案的整个表面上形成第一光阻焊层，并且通过去除所述第一光阻焊层的特定部分来暴露所述端子部分; 研磨第一光阻焊层的表面; 在第一光阻焊层的表面上印刷第二光阻焊层，并通过去除第二光阻焊层的特定部分将端子部分暴露于外部; 以及通过用暴露的端子部分的表面镀金形成焊盘部分，并且电连接焊盘部分和端子部分。

2. 发明申请

US20110036618A1 Printed Circuit Board and Method for Manufacturing the Same, and Panel for Manufacturing the Printed Circuit Board 有权
标题翻译：印刷电路板及其制造方法，以及制造印刷电路板的面板
公开(公告)号：US20110036618A1
公开(公告)日：2011-02-17
申请号：US12745667
申请日：2008-12-01
申请人： Kwang Tae Lee , Sung Gue Lee , Jae Bong Choi
发明人： Kwang Tae Lee , Sung Gue Lee , Jae Bong Choi
IPC分类号： H05K1/00 , H05K3/10 , B23Q41/00
CPC分类号： H05K3/0097 , H05K1/0271 , H05K3/0052 , H05K2201/09354 , H05K2201/09736 , H05K2201/09781 , H05K2201/2009 , H05K2203/0169
摘要： Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.
摘要翻译：公开了一种印刷电路板，包括：绝缘部件，其上限定有第一区域和第二区域;形成在第一区域上的电路图案;以及形成在第二区域上的支撑部件。

3. 发明授权

US08426739B2 Printed circuit board and method for manufacturing the same, and panel for manufacturing the printed circuit board 有权
标题翻译：印刷电路板及其制造方法以及用于制造印刷电路板的面板
公开(公告)号：US08426739B2
公开(公告)日：2013-04-23
申请号：US12745667
申请日：2008-12-01
申请人： Kwang Tae Lee , Sung Gue Lee , Jae Bong Choi
发明人： Kwang Tae Lee , Sung Gue Lee , Jae Bong Choi
IPC分类号： H05K1/03
CPC分类号： H05K3/0097 , H05K1/0271 , H05K3/0052 , H05K2201/09354 , H05K2201/09736 , H05K2201/09781 , H05K2201/2009 , H05K2203/0169
摘要： Disclosed is a printed circuit board including an insulation member on which a first region and a second region are defined, a circuit pattern formed on the first region, and a support member formed on the second region.
摘要翻译：公开了一种印刷电路板，包括：绝缘部件，其上限定有第一区域和第二区域;形成在第一区域上的电路图案;以及形成在第二区域上的支撑部件。

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