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1. 发明授权

US06220102B1 Die-shear test fixture apparatus 有权
标题翻译：模切试验夹具装置
公开(公告)号：US06220102B1
公开(公告)日：2001-04-24
申请号：US09389629
申请日：1999-09-03
申请人： Kuang-Ho Liao
发明人： Kuang-Ho Liao
IPC分类号： G01N308
CPC分类号： G01N3/02 , G01N2203/0025
摘要： A new method and apparatus is provided for obtaining a quantitative reading of the strength of the chip bonding connections and for testing the quality of the bonding that is established between a chip and the chip pad or tapes on which the chip is mounted. The invention makes use of the fact that the lead frame, that is the frame that contains the leads to which the chip is connected, uses a material for the metal interconnects that can be controlled by a magnetic field. A metal alloy is commonly used to fabricate the interconnect leads on the lead frame. The alloy is typically selected based on considerations of thermal stress (between the chip and the chip pad or tapes or equivalent interface on which the chip is mounted) and on considerations of delamination between the lead frame and the encapsulating compound. Ni—Fe is an alloy that is frequently used as the material for the metal interconnects on the lead frame. A magnetic field is applied such that this magnetic field holds the lead frame firmly in place with respect to the fixture plate. The lead frame/die combination is mounted such that the chip faces upwards. The die-shear test can now be performed.
摘要翻译：提供了一种新的方法和装置，用于获得芯片接合连接的强度的定量读数，并且用于测试在芯片和芯片焊盘或其上安装芯片的带之间建立的接合质量。本发明利用以下事实：引线框架，即包含与芯片连接的引线的框架使用可由磁场控制的金属互连材料。金属合金通常用于制造引线框架上的互连引线。该合金通常基于热应力（芯片与芯片焊盘或芯片或其上安装芯片的等效接口之间）的考虑以及引线框架和封装化合物之间的分层考虑。 Ni-Fe是经常用作引线框架上的金属互连材料的合金。施加磁场使得该磁场将引线框架相对于固定板牢固地保持就位。引线框架/管芯组合安装成使得芯片面向上。现在可以进行模切试验。

2. 发明授权

US6122822A Method for balancing mold flow in encapsulating devices 失效
标题翻译：在封装装置中平衡模具流动的方法
公开(公告)号：US6122822A
公开(公告)日：2000-09-26
申请号：US103193
申请日：1998-06-23
申请人： Kuang-Ho Liao
发明人： Kuang-Ho Liao
IPC分类号： H01L21/56 , H01L23/495 , H01R43/00
CPC分类号： H01L21/565 , H01L23/4951 , H01L23/49551 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/73215 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , Y10T29/49121
摘要： A method for forming a plastic package of an electronic device that is substantially without void formation is disclosed. In the method, a lead finger which is to be encapsulated in a plastic package is first deformed into various configurations such that the mold flow pattern can be modified accordingly. For instance, the tip portion of the lead finger can be formed into a U-shaped or a V-shaped bend, can be tilted to a 45.degree. slope or can be formed with U-shaped or V-shaped notch in the lead finger such that plastic flow velocity may be increased where the flow channel has been enlarged. Numerous embodiments of the present invention novel method are available for achieving similarly desirable results.
摘要翻译：公开了一种形成基本上没有空隙形成的电子器件的塑料封装的方法。在该方法中，要封装在塑料封装件中的引线指头首先变形成各种构造，使得可以相应地修改模具流动模式。例如，引线指的尖端部可以形成为U形或V形弯曲部，可以倾斜到45°斜率，或者可以在引线指中形成U形或V形凹口使得当流动通道被扩大时可以增加塑性流动速度。本发明新颖方法的许多实施方案可用于实现类似的期望结果。

3. 发明授权

US06458617B1 Multi-chip semiconductor package structure 有权
标题翻译：多芯片半导体封装结构
公开(公告)号：US06458617B1
公开(公告)日：2002-10-01
申请号：US09788703
申请日：2001-02-20
申请人： Kuang-Ho Liao , Feng Lin , Yun-sheng Chen
发明人： Kuang-Ho Liao , Feng Lin , Yun-sheng Chen
IPC分类号： H01L2100
CPC分类号： H01L24/06 , H01L23/4951 , H01L23/49537 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/73215 , H01L2224/85399 , H01L2924/00014 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip semiconductor package structure. The structure includes two chips and two lead frames. The leads on one of the lead frames have inner leads at one end and joint sections at the other end. The joint sections are connected with another lead frame. Both lead frames use a common set of external leads. The two chips and two lead frames are joined together forming a lead-on-chip structure with the two chips facing each other back-to-back. The assembly except the external leads is enclosed by packaging material.
摘要翻译：多芯片半导体封装结构。该结构包括两个芯片和两个引线框架。一个引线框架上的引线在一端具有内引线，另一端具有接头部分。接头部分与另一个引线框架连接。两个引线框都使用一组通用的外部引线。两个芯片和两个引线框架连接在一起，形成了两个芯片背靠背相对的芯片上芯片结构。除外部引线外的组件由包装材料包围。

4. 发明授权

US06245598B1 Method for wire bonding a chip to a substrate with recessed bond pads and devices formed 失效
标题翻译：用于将芯片引线接合到具有凹陷接合焊盘和形成的器件的衬底的方法
公开(公告)号：US06245598B1
公开(公告)日：2001-06-12
申请号：US09305945
申请日：1999-05-06
申请人： Tsung-Chieh Chen , Chun-Liang Chen , Kuang-Ho Liao
发明人： Tsung-Chieh Chen , Chun-Liang Chen , Kuang-Ho Liao
IPC分类号： H01L2150
CPC分类号： H01L23/3114 , H01L23/4985 , H01L24/45 , H01L24/48 , H01L2224/05624 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73265 , H01L2224/85447 , H01L2224/8547 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00015 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method for forming chip scale packages and devices formed by utilizing a wire bonding technique and an interposer board which has recessed peripheral regions are disclosed. In the method, an IC die is bonded on its active surface to an interposer which is constructed with a recessed peripheral regions equipped with interconnections such that shorter bond wires may be run between the IC die and the interposer. The interposer is further equipped, in a top planar surface, with a plurality of interconnections for the subsequently forming of solder balls for connecting to an outside circuit such as a printed circuit board. The present invention novel method further provides the benefit that the shorter wire bonds formed alleviate the wire sweep problem normally occurs in the plastic encapsulation process for such a package.
摘要翻译：公开了一种用于形成芯片尺寸封装的方法和利用引线键合技术形成的器件以及具有凹陷周边区域的插入板。在该方法中，将IC芯片的有源表面接合到插入器上，该插入件由具有互连的凹陷周边区域构成，使得可以在IC管芯和插入件之间延伸较短的接合线。插入器在顶部平面表面中进一步配备有多个互连，用于随后形成用于连接到诸如印刷电路板的外部电路的焊球。本发明的新颖方法还提供了一种益处，即在这种封装的塑料封装工艺中，通常会发生形成的较短的引线键合减轻电线扫描问题。

5. 发明授权

US06844616B2 Multi-chip semiconductor package structure 有权
标题翻译：多芯片半导体封装结构
公开(公告)号：US06844616B2
公开(公告)日：2005-01-18
申请号：US10098239
申请日：2002-03-15
申请人： Kuang-Ho Liao , Feng Lin , Yun-sheng Chen
发明人： Kuang-Ho Liao , Feng Lin , Yun-sheng Chen
IPC分类号： H01L23/495 , H01L29/435
CPC分类号： H01L24/06 , H01L23/4951 , H01L23/49537 , H01L23/49575 , H01L24/32 , H01L24/48 , H01L24/49 , H01L2224/04042 , H01L2224/05554 , H01L2224/05599 , H01L2224/06136 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/49171 , H01L2224/73215 , H01L2224/85399 , H01L2924/00014 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/181 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip semiconductor package structure. The structure includes two chips and two lead frames. The leads on one of the lead frames have inner leads at one end and joint sections at the other end. The joint sections are connected with another lead frame. Both lead frames use a common set of external leads. The two chips and two lead frames are joined together forming a lead-on-chip structure with the two chips facing each other back-to-back. The assembly except the external leads is enclosed by packaging material.
摘要翻译：多芯片半导体封装结构。该结构包括两个芯片和两个引线框架。一个引线框架上的引线在一端具有内引线，另一端具有接头部分。接头部分与另一个引线框架连接。两个引线框都使用一组通用的外部引线。两个芯片和两个引线框架连接在一起，形成了两个芯片背靠背相对的芯片上芯片结构。除外部引线外的组件由包装材料包围。

6. 发明授权

US6075281A Modified lead finger for wire bonding 有权
标题翻译：导线接合用改良铅笔
公开(公告)号：US6075281A
公开(公告)日：2000-06-13
申请号：US281673
申请日：1999-03-30
申请人： Kuang-Ho Liao , Tsung-Chieh Chen , Chuen-Jye Lin
发明人： Kuang-Ho Liao , Tsung-Chieh Chen , Chuen-Jye Lin
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40 , H05K5/02
CPC分类号： H01L23/4952 , H01L23/49548 , H01L24/48 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/73265 , H01L2224/85385 , H01L24/45 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/351
摘要： A lead frame equipped with modified lead fingers which have inclined tip portions for achieving an improved wire bond is provided. The inclined tip portions on the lead fingers can be formed in a stamping process with an angle on a top surface of the inclined tip portion measured at smaller than 30.degree. from a horizontal plane of the lead finger. It is preferred that the inclined angle should be between about 5.degree. and about 30.degree., and more preferred that the angle should be between about 5.degree. and about 20.degree.. A wedge bond formed on the inclined tip portion of a lead finger has improved thickness and thermal stress endurance. The thermal stress endurance may be improved by at least 20% and preferably by at least 50% when tested in a thermal cycling test between 150.degree. C. and -65.degree. C.
摘要翻译：提供一种配备有改进的引线指的引线架，其具有用于实现改进的引线接合的倾斜尖端部分。引线指上的倾斜尖端部分可以在冲压工艺中形成，其倾斜尖端部分的顶表面上的角度从铅笔的水平面小于30度测量。倾斜角度优选在大约5°至大约30°之间，更优选角度应在大约5°至大约20°之间。形成在引线指的倾斜尖端部分上的楔形结合件具有改善的厚度和耐热应力。当在150℃和-65℃之间的热循环试验中测试时，热应力耐久性可以提高至少20％，优选至少提高50％。

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