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    • 4. 发明授权
    • Plasma CVD process
    • 等离子体CVD工艺
    • US06333079B1
    • 2001-12-25
    • US09874251
    • 2001-06-06
    • Satoshi TakakiKoji Teranishi
    • Satoshi TakakiKoji Teranishi
    • H05H124
    • H01J37/32174C23C16/509H01J37/32082
    • In a plasma CVD system comprises a reactor the inside of which can be evacuated, a substrate holding means provided in the reactor, a material gas feed means for feeding into the reactor a material gas for plasma CVD, a high-frequency power supply means for supplying to a plasma-producing high-frequency electrode a high-frequency power having an oscillation frequency in the range of from 30 MHz to 600 MHz, generated by a high-frequency power source, and an exhaust means for exhausting a gas remaining in the reactor after the reaction; the high-frequency power generated in the high-frequency power source being supplied to the plasma-producing high-frequency electrode to cause a plasma to take place across a substrate held by the substrate holding means and the plasma-producing high-frequency electrode to form a deposited film on the substrate; the phase of reflected power is adjusted on the plasma-producing high-frequency electrode at its part on the opposite side of the feeding point. High-quality deposited films having a very uniform film thickness and a homogeneous film quality can be formed at a high rate and stably on large-area substrates having any shapes, to obtain semiconductor devices in a good efficiency.
    • 在等离子体CVD系统中,包括其内部可被抽真空的反应器,设置在反应器中的基板保持装置,用于向反应器供应用于等离子体CVD的原料气体的材料气体供给装置,用于 向等离子体产生高频电极供给具有由高频电源产生的振荡频率在30MHz至600MHz范围内的高频功率;以及排气装置,用于排出残留在所述高频电源中的气体 反应后反应; 在高频电源中产生的高频电力被供给到等离子体产生高频电极,以使等离子体在由基板保持装置和等离子体产生高频电极保持的基板上发生, 在基板上形成沉积膜;在等离子体产生高频电极的馈电点相对侧的部分调整反射功率的相位。 可以在具有任何形状的大面积基板上以高速率和稳定地形成具有非常均匀的膜厚度和均匀膜质量的高质量沉积膜,从而以高效率获得半导体器件。
    • 10. 发明申请
    • MULTILAYER FILM REFLECTOR
    • 多层膜反射器
    • US20090252977A1
    • 2009-10-08
    • US12416544
    • 2009-04-01
    • Seiken MatsumotoKenji AndoHidehiro KanazawaKoji TeranishiTakayuki MiuraKyoko Nagata
    • Seiken MatsumotoKenji AndoHidehiro KanazawaKoji TeranishiTakayuki MiuraKyoko Nagata
    • B32B15/04
    • B82Y10/00G02B5/0891G21K1/062G21K2201/067
    • A stress distribution resulting from variation in in-plane film quality of a stress relaxation layer and a reflective layer is eliminated. A reflective layer is stacked on a substrate via a stress relaxation layer. The stress relaxation layer has a stress relaxation portion having a uniform film thickness distribution to cancel the internal stress of the reflective layer, and a stress distribution eliminating portion with a film thickness distribution approximated to a second order even function. The stress is substantially proportional to the film thickness. Thus, formation of a given film thickness distribution allows the stress distribution to be controlled. However, changing the film thickness distribution based on a design value may degrade the optical characteristics. Thus, the film thickness distribution of the stress distribution eliminating portion, which serves to eliminate the stress distribution, is approximated to the second order even function. This enables aberration associated with the film thickness distribution to be reduced by adjusting an optical system.
    • 消除了由应力松弛层和反射层的面内膜质量的变化引起的应力分布。 反射层通过应力松弛层堆叠在基板上。 应力缓和层具有均匀的薄膜厚度分布的应力松弛部,以抵消反射层的内部应力,以及具有近似于二次偶次函数的膜厚分布的应力分布消除部。 应力基本上与膜厚成正比。 因此,形成给定的膜厚度分布允许控制应力分布。 然而,基于设计值改变膜厚度分布可能降低光学特性。 因此,用于消除应力分布的应力分布消除部分的膜厚度分布近似于二阶偶函数。 通过调整光学系统,能够降低与膜厚分布有关的像差。